ITMI20041695A1 - SENSORS ARRANGEMENT IN PARTICULAR FOR THE MEASUREMENT OF ACCELERATIONS OR ROTATION SPEED - Google Patents

SENSORS ARRANGEMENT IN PARTICULAR FOR THE MEASUREMENT OF ACCELERATIONS OR ROTATION SPEED

Info

Publication number
ITMI20041695A1
ITMI20041695A1 IT001695A ITMI20041695A ITMI20041695A1 IT MI20041695 A1 ITMI20041695 A1 IT MI20041695A1 IT 001695 A IT001695 A IT 001695A IT MI20041695 A ITMI20041695 A IT MI20041695A IT MI20041695 A1 ITMI20041695 A1 IT MI20041695A1
Authority
IT
Italy
Prior art keywords
accelerations
measurement
rotation speed
sensors arrangement
sensors
Prior art date
Application number
IT001695A
Other languages
Italian (it)
Inventor
Gerald Hopf
Oliver Kohn
Christian Ohl
Wolfgang Woernle
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20041695A1 publication Critical patent/ITMI20041695A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Air Bags (AREA)
  • Pressure Sensors (AREA)
IT001695A 2003-09-05 2004-09-02 SENSORS ARRANGEMENT IN PARTICULAR FOR THE MEASUREMENT OF ACCELERATIONS OR ROTATION SPEED ITMI20041695A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10340938A DE10340938A1 (en) 2003-09-05 2003-09-05 sensor arrangement

Publications (1)

Publication Number Publication Date
ITMI20041695A1 true ITMI20041695A1 (en) 2004-12-02

Family

ID=34177749

Family Applications (1)

Application Number Title Priority Date Filing Date
IT001695A ITMI20041695A1 (en) 2003-09-05 2004-09-02 SENSORS ARRANGEMENT IN PARTICULAR FOR THE MEASUREMENT OF ACCELERATIONS OR ROTATION SPEED

Country Status (3)

Country Link
DE (1) DE10340938A1 (en)
FR (1) FR2859533A1 (en)
IT (1) ITMI20041695A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4534912B2 (en) 2005-08-30 2010-09-01 株式会社デンソー Angular velocity sensor mounting structure
JP4839747B2 (en) 2005-09-20 2011-12-21 三菱電機株式会社 Capacitance type acceleration sensor
JP4595779B2 (en) * 2005-10-12 2010-12-08 株式会社デンソー Angular velocity sensor
DE102009019063A1 (en) * 2009-04-27 2010-10-28 Trw Automotive Gmbh Component part i.e. sensor e.g. acceleration sensor, for use in motor vehicle, has housing made of plastic and provided for embedding capsulated electronic assembly part together with screen section of conductor grid
DE102010039063B4 (en) 2010-08-09 2024-01-18 Robert Bosch Gmbh Sensor module with an electromagnetically shielded electrical component and method for producing such a sensor module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5345823A (en) * 1991-11-12 1994-09-13 Texas Instruments Incorporated Accelerometer
JP3278363B2 (en) * 1996-11-18 2002-04-30 三菱電機株式会社 Semiconductor acceleration sensor
JP4701505B2 (en) * 2001-01-29 2011-06-15 パナソニック株式会社 Inertial transducer
JP2003004450A (en) * 2001-06-25 2003-01-08 Matsushita Electric Ind Co Ltd Composite sensor for detecting angular velocity and acceleration

Also Published As

Publication number Publication date
DE10340938A1 (en) 2005-03-31
FR2859533A1 (en) 2005-03-11

Similar Documents

Publication Publication Date Title
GB2384054B (en) Angular velocity sensor
DE69934169D1 (en) The angular velocity sensor
DE502004008676D1 (en) Magnetic rotation angle sensor
GB2408645B (en) Integrated circuit for measuring the distance and/or speed of objects
DE69915919D1 (en) The angular velocity sensor
DE112004000035D2 (en) Sensor arrangement for distance and / or speed measurement
DE69932225D1 (en) ANGLE SPEED SENSOR
FR2834055B1 (en) MICRO-MACHINED INERTIAL SENSOR FOR MEASURING ROTATIONAL MOVEMENTS
DE602004000240D1 (en) Rotational speed detection device
EP1403616A4 (en) Angular velocity sensor
NO20006306L (en) Micromechanical rotation speed sensor
DE60214588D1 (en) angular velocity sensor
DE69938333D1 (en) ANGLE SPEED SENSOR
FI20030946A0 (en) Capacitive acceleration sensor arrangement
ITMI20041695A1 (en) SENSORS ARRANGEMENT IN PARTICULAR FOR THE MEASUREMENT OF ACCELERATIONS OR ROTATION SPEED
DE69921264D1 (en) The angular velocity sensor
NO20003007D0 (en) Fingerprint sensor speed calculation
FR2836552B1 (en) ACCELERATION SENSOR
ITPD20030151A1 (en) SPEED REDUCER
DE60045857D1 (en) inertial sensor
DE10164312B8 (en) Bearing equipped with rotation sensor
DE60335232D1 (en) Compact inertial sensor
DE69932788D1 (en) ROTARY SPEED SENSOR
DE60032208D1 (en) Rotational speed and acceleration sensor
DE602004002528D1 (en) Speed sensor with antistatic housing