IT991068B - Procedimento e pressa per la fabbri cazione di circuiti stampati a strati multipli - Google Patents

Procedimento e pressa per la fabbri cazione di circuiti stampati a strati multipli

Info

Publication number
IT991068B
IT991068B IT2636073A IT2636073A IT991068B IT 991068 B IT991068 B IT 991068B IT 2636073 A IT2636073 A IT 2636073A IT 2636073 A IT2636073 A IT 2636073A IT 991068 B IT991068 B IT 991068B
Authority
IT
Italy
Prior art keywords
press
multiple layer
printed circuits
layer printed
making multiple
Prior art date
Application number
IT2636073A
Other languages
English (en)
Italian (it)
Original Assignee
Buckbee Mears Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buckbee Mears Co filed Critical Buckbee Mears Co
Application granted granted Critical
Publication of IT991068B publication Critical patent/IT991068B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesives Or Adhesive Processes (AREA)
IT2636073A 1972-07-17 1973-07-09 Procedimento e pressa per la fabbri cazione di circuiti stampati a strati multipli IT991068B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27219872A 1972-07-17 1972-07-17

Publications (1)

Publication Number Publication Date
IT991068B true IT991068B (it) 1975-07-30

Family

ID=23038817

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2636073A IT991068B (it) 1972-07-17 1973-07-09 Procedimento e pressa per la fabbri cazione di circuiti stampati a strati multipli

Country Status (8)

Country Link
JP (1) JPS4951561A (fr)
BE (1) BE797750A (fr)
CA (1) CA990413A (fr)
DE (1) DE2333445A1 (fr)
FR (1) FR2193301B1 (fr)
GB (1) GB1419027A (fr)
IT (1) IT991068B (fr)
NL (1) NL7304482A (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3322772C2 (de) * 1983-06-24 1986-05-22 Didier-Werke Ag, 6200 Wiesbaden Verbundfolie zum Auskleiden von Flüssigkeitsbehältern
JP6350758B2 (ja) * 2015-08-10 2018-07-04 株式会社村田製作所 樹脂多層基板およびその製造方法
CN107529294A (zh) * 2017-09-27 2017-12-29 生益电子股份有限公司 一种pcb的制作方法及pcb

Also Published As

Publication number Publication date
FR2193301B1 (fr) 1977-02-04
JPS4951561A (fr) 1974-05-18
GB1419027A (en) 1975-12-24
BE797750A (nl) 1973-10-04
NL7304482A (fr) 1974-01-21
CA990413A (en) 1976-06-01
DE2333445A1 (de) 1974-01-31
FR2193301A1 (fr) 1974-02-15

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