IT980359B - Elementi di raffreddamento per elementi strutturali dischiformi di semiconduttori - Google Patents

Elementi di raffreddamento per elementi strutturali dischiformi di semiconduttori

Info

Publication number
IT980359B
IT980359B IT4967273A IT4967273A IT980359B IT 980359 B IT980359 B IT 980359B IT 4967273 A IT4967273 A IT 4967273A IT 4967273 A IT4967273 A IT 4967273A IT 980359 B IT980359 B IT 980359B
Authority
IT
Italy
Prior art keywords
elements
disch
semiconductor
shaped structural
cooling
Prior art date
Application number
IT4967273A
Other languages
English (en)
Italian (it)
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19722220682 external-priority patent/DE2220682C3/de
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Application granted granted Critical
Publication of IT980359B publication Critical patent/IT980359B/it

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025Base discrete devices, e.g. presspack, disc-type transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IT4967273A 1972-04-27 1973-04-26 Elementi di raffreddamento per elementi strutturali dischiformi di semiconduttori IT980359B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722220682 DE2220682C3 (de) 1972-04-27 Kühlvorrichtung für ein scheibenförmiges, gekapseltes Halbleiterbauelement

Publications (1)

Publication Number Publication Date
IT980359B true IT980359B (it) 1974-09-30

Family

ID=5843453

Family Applications (1)

Application Number Title Priority Date Filing Date
IT4967273A IT980359B (it) 1972-04-27 1973-04-26 Elementi di raffreddamento per elementi strutturali dischiformi di semiconduttori

Country Status (4)

Country Link
AT (1) AT320797B (US06486227-20021126-C00005.png)
CH (1) CH549869A (US06486227-20021126-C00005.png)
FR (1) FR2182133B3 (US06486227-20021126-C00005.png)
IT (1) IT980359B (US06486227-20021126-C00005.png)

Also Published As

Publication number Publication date
DE2220682B2 (de) 1975-06-05
AT320797B (de) 1975-02-25
FR2182133A1 (US06486227-20021126-C00005.png) 1973-12-07
FR2182133B3 (US06486227-20021126-C00005.png) 1976-07-23
DE2220682A1 (de) 1973-11-08
CH549869A (de) 1974-05-31

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