IT971835B - Struttura di isolamento a giun zione a circuito integrato - Google Patents
Struttura di isolamento a giun zione a circuito integratoInfo
- Publication number
- IT971835B IT971835B IT3287272A IT3287272A IT971835B IT 971835 B IT971835 B IT 971835B IT 3287272 A IT3287272 A IT 3287272A IT 3287272 A IT3287272 A IT 3287272A IT 971835 B IT971835 B IT 971835B
- Authority
- IT
- Italy
- Prior art keywords
- integrated circuit
- insulation structure
- circuit junction
- junction insulation
- integrated
- Prior art date
Links
- 238000009413 insulation Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/761—PN junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Element Separation (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23917372A | 1972-03-29 | 1972-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT971835B true IT971835B (it) | 1974-05-10 |
Family
ID=22900936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT3287272A IT971835B (it) | 1972-03-29 | 1972-12-14 | Struttura di isolamento a giun zione a circuito integrato |
Country Status (6)
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6173252B2 (ja) * | 2014-04-03 | 2017-08-02 | 三菱電機株式会社 | 昇降装置 |
-
1972
- 1972-12-14 IT IT3287272A patent/IT971835B/it active
-
1973
- 1973-02-20 FR FR7306800A patent/FR2177767B1/fr not_active Expired
- 1973-02-22 JP JP2075873A patent/JPS4916392A/ja active Pending
- 1973-03-20 CH CH546010D patent/CH546010A/xx not_active IP Right Cessation
- 1973-03-20 DE DE19732313725 patent/DE2313725A1/de active Pending
- 1973-03-28 ES ES413097A patent/ES413097A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CH546010A (US20060205796A1-20060914-C00130.png) | 1974-02-15 |
DE2313725A1 (de) | 1973-10-11 |
FR2177767B1 (US20060205796A1-20060914-C00130.png) | 1978-03-10 |
FR2177767A1 (US20060205796A1-20060914-C00130.png) | 1973-11-09 |
ES413097A1 (es) | 1976-07-01 |
JPS4916392A (US20060205796A1-20060914-C00130.png) | 1974-02-13 |
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