IT942091B - METHOD FOR PLATING COPPER ON ALUMINUM - Google Patents

METHOD FOR PLATING COPPER ON ALUMINUM

Info

Publication number
IT942091B
IT942091B IT50041/71A IT5004171A IT942091B IT 942091 B IT942091 B IT 942091B IT 50041/71 A IT50041/71 A IT 50041/71A IT 5004171 A IT5004171 A IT 5004171A IT 942091 B IT942091 B IT 942091B
Authority
IT
Italy
Prior art keywords
aluminum
plating copper
plating
copper
Prior art date
Application number
IT50041/71A
Other languages
Italian (it)
Original Assignee
Canada Wire & Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canada Wire & Cable Co Ltd filed Critical Canada Wire & Cable Co Ltd
Application granted granted Critical
Publication of IT942091B publication Critical patent/IT942091B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
IT50041/71A 1970-05-25 1971-04-30 METHOD FOR PLATING COPPER ON ALUMINUM IT942091B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA83600 1970-05-25

Publications (1)

Publication Number Publication Date
IT942091B true IT942091B (en) 1973-03-20

Family

ID=4086864

Family Applications (1)

Application Number Title Priority Date Filing Date
IT50041/71A IT942091B (en) 1970-05-25 1971-04-30 METHOD FOR PLATING COPPER ON ALUMINUM

Country Status (14)

Country Link
US (1) US3775265A (en)
JP (1) JPS512901B1 (en)
BE (1) BE767398A (en)
BR (1) BR7102811D0 (en)
CA (1) CA898183A (en)
ES (1) ES390466A1 (en)
FI (1) FI52360C (en)
FR (1) FR2090261B1 (en)
GB (1) GB1309497A (en)
IT (1) IT942091B (en)
NL (1) NL148362B (en)
NO (1) NO131083C (en)
SE (1) SE375810B (en)
ZA (1) ZA712647B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1001581A (en) * 1971-11-10 1976-12-14 Canada Wire And Cable Limited Plating copper on aluminum
US4270957A (en) * 1977-06-03 1981-06-02 Ford Motor Company Method for cleaning aluminum articles
US4323632A (en) * 1978-10-17 1982-04-06 Gould Inc. Metal composites and laminates formed therefrom
US4234395A (en) * 1978-10-17 1980-11-18 Gould Inc. Metal composites and laminates formed therefrom
US4439282A (en) * 1982-06-01 1984-03-27 Mcdonnell Douglas Corporation Treatment of metals to enhance adhesive bonding
JP3547471B2 (en) * 1994-03-09 2004-07-28 富士通株式会社 Vapor phase growth method of dielectric film
US5607570A (en) * 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution
FR2818294A1 (en) * 2000-12-15 2002-06-21 Thomson Csf Electrolyte incorporating a basic inhibiting agent with a amine function for depositing anti-corrosion coatings of copper and its alloys on aluminium and its alloys
FR3053352A1 (en) 2016-07-04 2018-01-05 Airbus Safran Launchers Sas ANTI-CORROSION PROTECTIVE COMPOSITION
CN112684343B (en) * 2020-12-08 2022-07-15 潍柴动力股份有限公司 Battery fault judgment method, detection device and detection system
CN113151870A (en) * 2021-02-22 2021-07-23 张志梁 Cyanide-free alkaline copper plating electroplating solution for zinc alloy die castings, and preparation method and electroplating method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2766195A (en) * 1953-01-26 1956-10-09 American Brake Shoe Co Plated aluminum bearings
US2872346A (en) * 1956-05-21 1959-02-03 Miller Adolph Metal plating bath
NL199518A (en) * 1956-10-22
SU116447A1 (en) * 1958-06-11 1958-11-30 А.М. Ямпольский The method of applying copper coatings by electrolysis of non-cyanic electrolytes
GB869433A (en) * 1958-11-25 1961-05-31 Adolph Miller Improvements in metal plating baths
NL123240C (en) * 1960-07-23
US3280736A (en) * 1964-06-08 1966-10-25 Metalgamica S A Multi-metal planographic printing plates
US3468765A (en) * 1966-08-04 1969-09-23 Nasa Method of plating copper on aluminum

Also Published As

Publication number Publication date
NO131083C (en) 1975-04-02
JPS512901B1 (en) 1976-01-29
FR2090261B1 (en) 1973-12-28
SE375810B (en) 1975-04-28
ES390466A1 (en) 1973-06-01
BE767398A (en) 1971-10-18
NL148362B (en) 1976-01-15
FI52360C (en) 1977-08-10
NL7106640A (en) 1971-11-29
BR7102811D0 (en) 1973-05-17
CA898183A (en) 1972-04-18
ZA712647B (en) 1972-04-26
DE2125589B2 (en) 1975-12-11
FR2090261A1 (en) 1972-01-14
GB1309497A (en) 1973-03-14
FI52360B (en) 1977-05-02
NO131083B (en) 1974-12-23
DE2125589A1 (en) 1971-12-09
US3775265A (en) 1973-11-27

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