IT939391B - Pasticca semiconduttrice nonche metodo e dispositivo per la sua produzione - Google Patents

Pasticca semiconduttrice nonche metodo e dispositivo per la sua produzione

Info

Publication number
IT939391B
IT939391B IT5274871A IT5274871A IT939391B IT 939391 B IT939391 B IT 939391B IT 5274871 A IT5274871 A IT 5274871A IT 5274871 A IT5274871 A IT 5274871A IT 939391 B IT939391 B IT 939391B
Authority
IT
Italy
Prior art keywords
pastry
semiconductive
production
well
semiconductive pastry
Prior art date
Application number
IT5274871A
Other languages
English (en)
Italian (it)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP7858370A external-priority patent/JPS5013112B1/ja
Priority claimed from JP45096065A external-priority patent/JPS506305B1/ja
Priority claimed from JP46004885A external-priority patent/JPS5217278B1/ja
Application filed filed Critical
Application granted granted Critical
Publication of IT939391B publication Critical patent/IT939391B/it

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12Preparing bulk and homogeneous wafers
    • H10P90/14Preparing bulk and homogeneous wafers by setting crystal orientation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0088Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being angularly adjustable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/042Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0428Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
IT5274871A 1970-09-08 1971-09-08 Pasticca semiconduttrice nonche metodo e dispositivo per la sua produzione IT939391B (it)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP7858370A JPS5013112B1 (enExample) 1970-09-08 1970-09-08
JP45096065A JPS506305B1 (enExample) 1970-10-30 1970-10-30
JP46004885A JPS5217278B1 (enExample) 1971-02-05 1971-02-05

Publications (1)

Publication Number Publication Date
IT939391B true IT939391B (it) 1973-02-10

Family

ID=27276497

Family Applications (1)

Application Number Title Priority Date Filing Date
IT5274871A IT939391B (it) 1970-09-08 1971-09-08 Pasticca semiconduttrice nonche metodo e dispositivo per la sua produzione

Country Status (3)

Country Link
US (1) US4127969A (enExample)
FR (1) FR2108218B1 (enExample)
IT (1) IT939391B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3959579A (en) * 1974-08-19 1976-05-25 International Business Machines Corporation Apertured semi-conductor device mounted on a substrate
US4602854A (en) * 1985-02-25 1986-07-29 At&T Technologies, Inc. Polyhedral ring mirrors and their manufacture
JPH0342821A (ja) * 1989-07-11 1991-02-25 Mitsubishi Electric Corp 半導体ウエハの熱処理方法およびそのためのウエハハンガーならびに半導体ウエハ
JP3060445B2 (ja) * 1992-07-16 2000-07-10 株式会社東京精密 半導体ウエハのスライシング方法及びその装置
US5529051A (en) * 1994-07-26 1996-06-25 At&T Corp. Method of preparing silicon wafers
US5564409A (en) * 1995-06-06 1996-10-15 Corning Incorporated Apparatus and method for wire cutting glass-ceramic wafers
US5950643A (en) * 1995-09-06 1999-09-14 Miyazaki; Takeshiro Wafer processing system
US6125529A (en) * 1996-06-17 2000-10-03 Thermometrics, Inc. Method of making wafer based sensors and wafer chip sensors
US20130136939A1 (en) * 2011-11-28 2013-05-30 Touch Century Electronic Ltd. Method for forming a shape of an electro-optical component or photovoltaic component
JP6223804B2 (ja) * 2013-12-09 2017-11-01 株式会社ディスコ ウェーハ加工装置
USD966888S1 (en) * 2020-03-05 2022-10-18 Kimberly-Clark Worldwide, Inc. Lid

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1066282B (enExample) * 1958-03-26 1900-01-01
US3124868A (en) * 1960-04-18 1964-03-17 Method of making semiconductor devices
US3094026A (en) * 1960-06-10 1963-06-18 American Can Co Cutter spacing device
NL129945C (enExample) * 1961-01-03
US3699719A (en) * 1971-01-25 1972-10-24 Nicholas Rozdilsky Ultrasonic machining

Also Published As

Publication number Publication date
FR2108218B1 (enExample) 1977-06-03
US4127969A (en) 1978-12-05
FR2108218A1 (enExample) 1972-05-19

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