IT8922500A1 - PRINTED CIRCUIT THERMOCOUPLE SYSTEMS FOR PERSONNEL TRAINING AND EQUIPMENT EVALUATION PURPOSES AND METHODS FOR MAKING AND USING THE SAME. - Google Patents

Description

DESCRIPTION

The present invention relates to thermocouples which are used in conjunction with printed circuit boards for personnel training in soldering / desoldering conductors of circuit components versus printed circuit boards, as well as for conducting a quantitative analysis of cleaning operations, preheating, and spot welding of components mounted on printed circuit boards. In particular, the invention relates to the formation of thermocouples for such purposes through standard printed circuit board construction techniques, as opposed to standard techniques, as well as the manner in which they can be made and used to simulate a wide variety ? of circuit board types, plane topographies and assembly configurations.

In U.S. Patent No. 4,224,744 of the same Applicant there is disclosed an electrical circuit for teaching welding and a practical circuit board for its use with it, in which a training board provided with terminals and in which a plurality of terminals is provided. of temperature sensing devices associated with the respective terminals? provided at each terminal where the welding of a joint? attempted to monitor the behavior of a pupil or other person whose abilities? repairs are evaluated.

One disclosed form of temperature sensing means is the provision of thermocouples at each of a plurality of materials. of through holes in a printed circuit board. These thermocouples include a first conductor, such as a non-electrical copper, which? disposed across the holes to form pins or earths at each of the opposite sides of the printed circuit board, and a sheet metal or wire or constantan or other conductive metal other than that disposed in the through holes which is attached to one of the pins or lands in the plated conductor, for which? formed a thermocouple junction. For the formation of these thermocouple junctions? disclosed The use of electric arc techniques, flame heating, welding, brazing, edging, butt welding. Furthermore, while this patent indicates that its content? also applicable to desoldering, soldering, etc., as well as to circuit connections other than those on a single or double-sided printed circuit board, such as multilayer plates, ceramic printed circuits, etc., and various terminals such as plated through holes, holes unsupported, funnel passages, slot passages, vertical passages, etc., no structures, techniques or applications are presented that are directed at emulating a wide assortment of circuit board topographies, types and assembly configurations, which vary by type of component, substrate material, thermal characteristics and other factors, or the application of these to the development, evaluation, monitoring and regulation of "thermally influencing" manufacturing, reprocessing or repair processes and equipment used for the purpose, i.e. to weld / solder , preLdare, spot weld, etc.

The US patent No. A, 224,744 of the same Applicant also presents in detail the various factors that clash with the capacity? to carry out high quality reprocessing and repair operations? about electronic montages, and this description? incorporated herein by reference for patent purposes. These factors do not include only the human factor, for which training to obtain the required skills? and experience to enable the operator to observe the work and react appropriately in handling the soldering iron or other reprocessing and repair devices? the best insurance, but they also include other factors that do not depend on the operator, such as the characteristics of the reprocessing and repair device for example a soldering iron with its normal peak temperature, speed? recovery, etc., and characteristics of the component and the printed circuit board, such as temperature, conductivity? thermal, specific heat, etc.

As a result, for the proper training and evaluation of personnel,? desirable to be able to simulate the pi? realistically possible a wide range of circumstances that an operator? able to meet. Furthermore, even with the best of trainings there is the possibility? overheating the workpiece, as a result of excessive residence time or temperature, causing damage to the printed circuit board in the form of raised pins, damage to the plated through holes, or, in the extreme case, damage to the fiberglass laminate , etc., as a result of factors related to the equipment. So ? It is also desirable to provide a means by which new equipment, particularly automatic equipment, can be evaluated by analyzing the temperature profile at which, for example,? undergoes a joint during a soldering / desoldering process.

The usual method of inspecting welded joints? visual. Anyway a similar method of qualitative analysis? ineffective since? the physical appearance of a welded joint, after what? been made, not d? a real indication of the maximum temperature reached by the junction or how long? been kept at that temperature. On the other hand, to obtain a quantitative analysis of the temperature conditions under which? subject to a junction, thermocouples must be attached to circuit pins and / or component leads so that temperatures can be recorded using a computerized data transfer system. However, the attachment of thermocouples to terminals or pins, usually done with spot welding,? a difficult task, and if multiple welds have to be made, the task becomes cumbersome and costly as it? each thermocouple costs about $ 5.

A purpose of the present invention? to provide a thermocouple construction and process that allows a wide assortment of printed circuit board types, topographies and assembly configurations, varying by component type, substrate material, thermal characteristics and other factors, to be emulated simply and at little cost.

A particular purpose of the invention? to adapt standard printed circuit board construction techniques to the previous purpose.

Another important purpose? provide processes by which a thermocouple construction in accordance with the invention can be used in the development, evaluation, monitoring and regulation of thermally influencing processes, processing equipment and associated human factors.

A further object of the present invention? to allow quantitative analysis of temperature profiles that will be produced in simulated complexes of printed circuit boards during the realization of a real temperature-influenced production, reprocessing and repair processes, such as soldering, desoldering, cleaning, melting, preheating, fixing heat compression, spot welding and other processes that can thermally affect these assemblies for the purpose of evaluating the process and equipment for treatment and for training or recertification of repair personnel, through the measurement of temperatures experienced at the weld joints , component terminals, and / or substrate material of a printed circuit board assembly in a test process operation.

The foregoing objects of the invention are achieved in accordance with various embodiments in which a layer of a first conductive material, such as copper,? applied to a first surface of an electrically insulating support, while a second layer of a second, dissimilar, conductive material, such as constantan,? applied to at least one other surface of the support using conventional printed circuit board construction techniques. In those points where thermocouple junctions are required, holes are made through the conductive layers and the support material, and then the two conductor layers are electrically connected by plating the first conductive material through the through hole and on respective terminal portions of pin of the conductive layers. The voltages produced by the thermocouple during a manufacturing / repair / reprocessing operation on a simulated electronic assembly can? be monitored and used to develop, modify or adjust the conduct of thermally influencing processes, train personnel or evaluate equipment. Numerous different processes can be evaluated including different permutations of thermal mass configurations, locations and types of heat sources, and thermocouple locations.

These and further objects, features and advantages of the present invention will become more obvious from the following description if taken in connection with the accompanying drawings which show, for illustration purposes only, different embodiments in accordance with the present invention.

Fig. 1? a partial cross-sectional view of a printed circuit thermocouple construction for a simple circuit board having a component mounted in a through hole;

FIG. 2 illustrates, in cross section, a portion of the thermocouple circuit board construction for temperature monitoring on both sides of a three layer printed circuit board having a surface mounted component;

FIG. 3 illustrates, in cross section, a portion of the printed circuit thermocouple construction for providing a detailed analysis of the temperature gradient of a multilayer printed circuit board; And

Figures 4 to 6 illustrate photomask structures representative of the production of thermocouples for printed circuit boards in accordance with the present invention, Figure 4 showing a 16-pin DIP structure with thermocouple junctions for each terminal and traces of equal amplitude, Figure 5 also showing a structure for a 16-pin DIP but with earths of varying size or thermal mass, and Figure 6 showing a structure for a surface mounted component having an earth configuration to produce a complex temperature profile .

In fig. 1? illustrated a basic thermocouple system for providing temperature data resulting from a test operation of reprocessing, repairing or manufacturing a printed circuit board, including at least a "thermally influencing process," of a type that can be used. be used for the purpose of training students in the ability to weld in the manner of the aforementioned U.S. Patent No. 4,224,744 (which is incorporated by reference), or to recertify experienced repair personnel, or in the evaluation of new equipment for reprocessing and repair. In this regard,? pointed out that, for the purposes of this application, the term "thermally influencing process"? used to define one of the many processes used in the reprocessing, repair or manufacturing of electronic assemblies (such as soldering, desoldering, cleaning, melting, preheating, thermocompression connection, spot welding, cooling, and other processes included in the installation, removal and restoration of components mounted in through hole or surface) that can? affect the structure, operability? and / or appearance of each part of an electronic assembly due to temperature effects. It is also noted that although the construction of the embodiments of Fig. 1-3 has been described with reference to only a single thermocouple junction of the inventive system, it should be appreciated that a thermocouple system for emulating an electronic assembly (including simple circuit boards and boards in the manufacturing process) in accordance with the present invention will include at least as many thermocouple junction sides as? the number of conductors of the various components to be used in conjunction with them.

In particular, the printed circuit thermocouple system of Fig.1 comprises an electrically insulating support 1 which can being the substrate of a standard circuit board formed of glass reinforced epoxy or other suitable material. A layer of a first conductive material, such as copper,? applied to the first surface of the support 1, while a second layer of a second conductive material, which is different from the first conducting material, such as constantan,? applied to the reverse side of the substrate 1. These layers of conductive material are formed using conventional printed circuit board construction techniques. For example, a copper sheet 3, approximately 0.002 poly thick,? Laminated at the other end. In those places where thermocouple junctions are required, cavities are dug. between the sheets and the laminate substrate and then foot terminal portions, in the form of earths, are defined around the cavities. on both sides of the support 1, using photomask techniques. Non-electric copper 7? then plated on the feet, as defined by the photomask pattern, on both the copper and constantan sheets and through the cavities. The copper plate 7 electrically and mechanically connects the copper and constantan sheets forming a T-type thermocouple junction. are then formed on both sheets using photomask techniques and the unwanted sheet of copper and constantan? then removed using an appropriate etching agent, such as iron chloride, to complete the circuit diagram.

As a result of the above steps, a thermocouple junction 9 will be? formed at the interface between the respective terminal portion of the thermocouple pin of the cii? cuito printed of constantan 5 and copper plated 7. So, in any case, the conductive material of constantan will be? formed in an articulated printed circuit diagram. On the other hand, since? a copper to copper electrical connection? formed at the interface 11 between the copper layer 3 and the plated copper 7 on the opposite side of the insulating support 1, the copper layer 3 can? be a coupling articulated printed circuit diagram, or where load, thermal insulation or sensitivity demands? of the instrument They will allow it, the copper can? be left in its original sheet form, so it will be? equal in area extension at least to the area on which? formed the printed circuit and can? fully cover the respective Side of the media 1.

Fig. 1 shows the thermocouple system used to obtain data such as the temperature profile at the point where the welding material S? applied through a soldering tool T, such as an iron tool, in the upright through hole of an electronic component 13 having a plurality of of conductors, of which only one conductor 13a? shown in Fig. 1. Of course, other forms of soldering tools and automatic soldering devices can be used in conjunction with this thermocouple system, such as wave type soldering devices as typically used in the mass production of through holes in printed circuit boards (in which case the system should be reversed relative to the orientation shown in FIG. 1 and placed over a pool of molten solder of a wave soldering device).

In this regard,? noticed that the monitoring of the signals coming from the thermocouple junction in most cases can? be made using a typical printed circuit board side connector or any other conventional type of connector. However, in the event that the thermocouple system is arranged above a wave soldering bath, the output connections can only be made on the upper surface of the board. In fig. 1 a voltage meter? shown simply schematically and? only intended to represent generically an output quantification means for use in measuring the temperature related voltage produced by the thermocouple junction 9.

In addition to soldering operations, desoldering processes can also be evaluated with the described thermocouple system when a component? been mounted on it. In that case, a welding extractor tool? disposed against the weld material and around the component lead on the opposite side of the component body, i.e., the side of the welder in the case of through-hole mounting.

The desoldering device? then activated to apply heat to the solder joint, and once the soldering iron? heated above its melting point,? created the vacuum to remove the solder from the hole. Similarly, any other thermally influencing process can be monitored in a similar way.

In the case of the embodiment of fig. 1, if the component were to be inserted on the constantan side, the heat required to melt the solder material in the hole must flow through the copper plating, the component conductor, the same material as welding. As a result, the temperature measurements taken during the desoldering processes will be biased towards the component side of the board since the thermocouple junction would be on that side. For circuitry having small earths and trace portions and small mass component conductors, the temperature differential from the side of the soldering material to the side of the component will be? small. However, what if, for example, a large area of circuit or ground trace? located on the side of the component, exist? a finite temperature differential between the side of the soldering iron, where the heat? applied, and the side of the component where? detected through thermocouple junction 9. Does this differentiate in temperature? the result of the fact that the heat required to raise the temperature of a large circuit area to melt the solder has to flow through the combination of plated through hole, component lead and solder, and the through hole path has a speed? relatively low heat transfer compared to the heat required to raise the temperature of the circuitry on the component side.

This low speed? heat transfer prevents heat from flowing from the side of the solder to the side of the component, thus creating the noted temperature gradient between the two sides. So, under these circumstances, the thermocouple junction 9 must be on the side of the support 1 where you want to monitor the temperature, i.e. component 13 should be mounted through the through hole on the side shown in fig.1 or surface on the opposite side (in a manner described below with respect to fig.2). On the other hand, when circuitry having small earths and circuit traces and / or small conductors of ground components are concerned, appropriate results will be obtained regardless of which side of the system of fig. 1 on which? mounted the component.

Fig. 2 illustrates a thermocouple system for monitoring temperature data through thermocouple heat sensors arranged on both opposite sides. With such a construction, the electrically insulating support 21? formed by a plurality? of circuit board layers 21a, 21b, and the layer of the first conductive material (e.g. copper) 23? formed on an interface surface of the support 21 between the pair of card layers 21a, 21b. Printed circuit diagrams of the second conductive material (e.g. constantan) 25a, 25b are then formed at each of the opposite sides of the insulating support 21, and are electrically and mechanically coupled together through an electrical connection 27 plated across, as described above, with respect to conductors 3, 5 and electrical connection 7. As a result, a pair of thermocouple junctions 29a, 27b are located at the interface between the electrical connection 27 and the layers 25a, 25b, while an electrical connection 31? produced at the interface between the first conductive layer 23? the plating of the through hole of the electrical connection 27. That the inner layer of the first conductor 23 is a foil that fills the interface between the layers of the board 21a, 21b, as shown, or an articulated pattern of traces, the interspaces of which are filled with insulating material, it will be? dependent, as noted above, on the load, thermal insulation and sensitivity requirements? (which in most cases will make the distribution of all conductive layers preferable).

FIG. 2 also shows the surface mounting of an electronic component 33 through its conductor 33a. For this purpose, unless the through hole is designated to have a very small diameter, a plug 35 of first conductive material (e.g. 35)? inserted in the through hole, or the hole can? be filled or reduced to only a very small diameter with the solder melt within it, at least on the post side of the component in the manner described in relation to FIG. 1.

Which system? shown in fig. 2? particularly advantageous in evaluating a manufacturing, reprocessing or repair process in which an auxiliary heat source? used with a printed circuit board having a ground plane (s) or other heat container which makes it difficult for a primary heat source, such as hot air sent to the side of the component of fig. 2, to rapidly raise the temperature of the conductors of the components at the melting temperature of the solder. In a similar case, an auxiliary heat source is used to compensate for the unwanted decrease in heat by bringing the board to a pre-melting temperature of 250? F. For example, if a large thermal mass? placed on the bottom side of the board adapted to the ground floor, the primary heater can? not being able to deliver sufficient heat to raise the temperature at the component conductors to melting temperatures of the solder due to the reduction of heat of the mass which can? do of the board in addition to the use of a primary heater on the end component side? of the board, relative to Fig. 2. Thus, using a system as shown in Fig. 2, in which sensors of the thermocouple junction type are provided at both ends? delLa card, can? be evaluated the effect of the use of combined heaters at the top? and at the bottom of a circuit board to be emulated. Alternatively, the effect of only one or the other of the heaters can? also be evaluated separately at both the top and bottom surfaces of the support 21. These temperatures can be measured with the use of voltmeters schematically indicated by V1 and V2, which measure the voltages produced at the thermocouple junctions 29a, 29b.

To get a more analysis? detailed temperature profile, by examining the temperature gradient, any number of additional circuit layers can? to be added. For example, FIG. 3 illustrates a printed circuit thermocouple system in accordance with the invention in which the electrically insulating support 41? divided into four layers of circuit boards 41a-41d, on each side of which? formed a conductive layer. In this layer The central conducting layer 43? formed by a first conducting material, such as copper, while all the other conducting layers 45a-45d are formed by a second, dissimilar, conducting material, such as constantan. All the layers 45a-45d are produced by an articulated printed circuit diagram as described above, while the layer 43 of the first conductive material, although preferably schematized in the same way, can, as already mentioned, be described as above. pointed out for the other embodiments, be left as a continuous laminar layer. The temperature gradient can? then be measured by arranging the voltmeters V1-V4 as shown in FIG. 3, to measure the voltages produced at the thermocouple junctions 49a-49d.

While simple voltage meters are presented as the means of monitoring the voltages produced at the thermocouple junctions of the embodiments of FIG. 1-3, it should be appreciated that numerous others and more can be used. sophisticated means. For example, analyzers and indicators of the type described in the aforementioned US Patent No. 4,224,744 can be used, as well as other similar types of systems designated for particular circumstances. Furthermore, data is obtainable throughout the entire environment-to-environment operation cycle, and not solely during the implementation of a specific heat-influenced process of an overall manufacturing, reprocessing or repair operation.

Figures 4-6 show printed circuit diagram masks for use in forming any of the conductive layers of the printed circuit thermocouple systems shown in Figures 1-3. In fig. 4,? shown a diagram of mask 60 for a 16-pin DIP having terminal portions of thermocouple pins 62 for each conductor and interconnections of equal-amplitude traces 64 which connect the terminal portions of thermocouple pins 62 with the signal monitoring connection portions 66. Of course, it should be appreciated that the portions of the mask 60 not contained within the corners of the positioning frame 68, including the corner frames 68, would be removed with a chemical etching agent, as shown above with respect to the process for making the thermocouple systems of the present invention.

In fig. 5? Also shown is a diagram of mask 70 for a 16 pin DIP. However, in this case, the terminal portions of thermocouple pins which are monitored through trace interconnects 74 and connection portions 76 provide a graduated circuit area extending from the terminal portions 72a, formed by lands of a small area / mass ratio. and comparable with those of fig. 4, up to the terminal portions 72b, which are formed as soils with a high area / mass ratio. Since an increased circuit area results in a higher thermal load, increased circuit areas will increase the time it takes to heat a solder joint at it. Thus, a scheme as shown in fig. 5 can be used to emulate a circuit board having large traces or a ground plane attached to the pin. It is noted that, in addition to this technique, other techniques can be used to simulate ground planes (other heat sinks) on or inside a printed circuit board, which can be used. be a single layer or a multilayer board. For example, with reference to fig. 3, the diameter of the through hole pu? be varied and / or the thickness of the wall plating of the hole 47 can? be varied. As a result, electronic systems and processes resulting in complex temperature profiles can be simulated. For example, many of the thermal characteristics of multilayer printed circuit boards can be emulated with a much less expensive double-sided board made in accordance with the present invention.

FIG. 6 shows a schematic of mask 80 for a large surface mounted component having 17 conductors on each side, but with end portions 82a to form thermocouple junctions at only three spaced locations on each side (as in the third, eighth and fifteenth conductor), as well as end portions 82b spaced 0.2 inches from the center of the row of end portions 82 on each Side. Such a system allows a complex temperature profile of the component and the surrounding area to be obtained during various processes. In this regard, while in fig. 6 (or for the one in fig. 4 as well as in fig. 5) only 16 thermocouples are shown, the number of thermocouples? only limited by the quantity? of space available and the possibilities? through the conductive traces 84 and the monitoring connection portions 36. Furthermore, the use of thermocouple systems of the type shown in FIG. particularly advantageous with respect to the evaluation of densely populated card systems to determine the terminal effects transferred to components that have not been operated directly and can? include monitoring of the thermocouple junctions of adjacent schematics, not just those junctions of the schematic relevant to the component which? been directly subjected to a thermally influencing process during a particular emulation.

It would also be appreciated from the foregoing that various permutations of (a) thermal mass configurations, (b) heat source locations, and (c) thermocopy junction locations can be created, in accordance with the present invention, so to be able to emulate a wide variety? of sizes, types, topologies and configurations of printed circuit board systems, as well as evaluating a wide variety of printed circuit board systems. soldering / desoldering processes, or other types of manufacturing, repair or rework operations that require heat to be applied to a printed circuit board system.

Furthermore, while the printed circuit board thermocouple systems in accordance with the present invention have been described in relation to systems in which the thermocouple junctions are formed on an electrically insulating support which simulates the effect experienced in various points on different types of printed circuit boards, it would be appreciated that due to the use of conventional techniques to create thermocouples, other possibilities exist. For example, printed circuit thermocouples could be formed in a simulated chip, where the number of printed circuit thermocouples corresponds to the number of conductors in the chip. Alternatively, the number of printed circuit thermocouples formed on the chip substrate, serving as an electrically insulating carrier, may be less than the number of chip conductors, where some chip conductors can be connected to the heat source and others to an analyzer. exit. In this way, temperature data regarding a manufacturing, repair or reprocessing operation performed on a printed circuit board can be obtained in a manner that reflects the effects of heat that are directly experienced by an electronic component itself, thus further expanding the capacity. ? to train personnel, develop, adapt and monitor any thermally influencing processes, such as welding, and evaluate process equipment in accordance with the present invention using, for example, an analyzer that can accumulate time and temperature curves, as described in U.S. Patent No. 4,224,744.

Those of capacity? Ordinary in the art will also recognize that the materials described as examples of use in the construction of the present invention represent only one possibility. for which many alternatives are possible. For example, instead of using a carrier formed from a glass reinforced epoxy circuit board substrate, ceramic, polyimide or polyimide / kevLar laminates may be used. Also, instead of forming T, K, J type thermocouple junctions, thermocouple junctions could be formed using chromium / aluminum or iron / constantan conductor sheets, respectively.

Also, it should be appreciated that a printed circuit thermocouple and the methods by which? made and used as described above, for purposes such as those described above concerning personnel training and equipment evaluation, etc., represents only a preferred intended application of the invention by the inventors which, in no way, reflects the complete utility of the invention. That is, a set of thermocouples on a printed circuit thermocouple system, in accordance with the present invention, could be used for almost any situation where it would be desirable to obtain a temperature profile of thermal effects. For example, thermal insulation or heat loss effects could be evaluated in a manner similar to that achievable with an infrared photograph, covering one or more? surfaces of a study subject with a printed circuit thermocouple system having suitable thermocouple scheme (s) manufactured in accordance with the present invention. Also by using a flexible circuit board type substrate, such as one formed from polyimide or polyimide / Kevlar, such a thermocouple system could be readily applied to arcuate and other non-planar surfaces.

Still further, the method of manufacturing thermocouples through printed circuit technology in accordance with the present invention also offers a novel, low-cost alternative to conventionally constructed thermocouples for use as replacements for similar standard thermocouples in any application for which previously individual thermocouples were used. In particular, a single broad support can? be formed from a myriad of individual thermocouple junctions in accordance with the present invention, which support, with the thermocouples formed thereon, is then cut into a corresponding number of identified thermocouple elements, each of which has one of the thermocouple junctions on it, at a fraction of the cost associated with existing techniques for producing thermocouple elements. Here again, the use of thin flexible substrate materials can? be beneficial.

So, since? the present invention? susceptible to numerous other changes and modifications how will it appear? evident to those of ordinary capacity? In the art, the present invention should not be considered limited to the details of the various embodiments shown and described herein, but rather should be seen as including all those changes and modifications which are within the scope of the appended claims.

Claims (70)

CLAIMS 1. Thermocouple system for providing temperature data resulting from the use of at least one thermally influencing process on an electronic assembly through a simulated manufacturing / repair / reprocessing operation, comprising an electrically insulating carrier, a layer of a first conductive material applied on a first surface of said support, at least a printed circuit diagram of a second conductive material, which? dissimilar to said first conductive material, formed on at least one other surface of the support; wherein said printed circuit diagram comprises circuitry having terminal portions of thermocouple pins, signal monitoring connection portions and interconnect traces running therebetween; wherein at least one terminal portion of the thermocouple pin of the circuit diagram of the second conductor? connected to the layer of the first conductive material through an electrical connection formed from said first conductive material and extending through said support so as to create a thermocouple junction on a respective terminal portion of the thermocouple pin. 2. A thermocouple system according to claim 1, wherein said layer of first conductive material? a printed circuit diagram having terminal and signal monitoring portions, and interconnect traces running therebetween. 3. A thermocouple system according to claim 2, wherein said printed circuit diagrams are formed on the outer side of opposite surfaces of said electrically insulating support. 4. Thermocouple system according to claim 3, wherein said electrical connection? formed by a first conductive material plated through a through hole in the support and on terminal portions of said printed circuit diagram so as to mechanically as well as electrically connect the terminal portions of the diagrams of the first and second conductive materials. 5. A thermocouple according to claim 4, wherein said printed circuit diagrams have a plurality of elements. of electrically connected terminal portions, and in which all the traces of the scheme are of equal amplitude. The thermocouple system according to claim 5, wherein some of said terminal portions of thermocouple pins are located at points corresponding to a set of conductors of an electrical component to be mounted on the support, and in which other or said terminal portions of pins thermocouples are arranged in an area surrounding said corresponding points for the areas in which the manufacturing / reprocessing / repair operations are carried out. 7. A thermocouple system according to claim 4, wherein some of said terminal portions of thermocouple pins are located at points corresponding to a set of conductors of an electrical component to be mounted on the support, and in which other or said terminal portions of pins thermocouples are disposed in an area surrounding said corresponding points to provide temperature data at points which are remote from the areas in which the manufacturing / reprocessing / repair operations are carried out. 8. A thermocouple system according to claim 4, wherein said printed circuit diagrams have a plurality of elements. of electrically connected terminal portions, and wherein the schematic trace for some of said terminal portions? of a different amplitude with respect to the pattern trace for others of said end portions to simulate different configurations of thermal mass. 9. A thermocouple system according to claim 4, wherein said through hole? open. 10. A thermocouple system according to claim 4, wherein said through hole? at least partially closed. 11. Thermocouple system according to claim 4, wherein the quantity? of the first conductive material provided in said through hole? predetermined as a means of simulating temperature drops. 12. A thermocouple system according to claim 1, wherein said printed circuit diagram of the second conductive material has a plurality of materials. of electrically connected terminal portions, and in which all the traces of the scheme of this are of equal amplitude. 13. A thermocouple system according to claim 12, wherein some of said terminal portions of thermocouple pins are located at points corresponding to a set of conductors of an electrical component to be mounted on the support, and wherein others of said terminal portions of pins of thermocouple are disposed in an area surrounding said corresponding points to provide temperature data at points which are disposed away from the areas in which? the production / reprocessing / repair operation carried out. 14. A thermocouple system according to claim 1, wherein said printed circuit diagram of the second conductive material has a plurality of materials. of electrically connected terminal portions, and in which the circuitry for some of said then? terminal tions? of a different area with respect to the area of others of said end portions to simulate different configurations of thermal mass. 15. A thermocouple system according to claim 1, wherein said thermocouple junction? built for surface mounting a conductor of an electrical component on it. 16. Thermocouple system according to claim 1, wherein said thermocouple junction? built for the mounting in a through hole of a conductor of an electrical component on it. 17. Thermocouple system according to claim 1, wherein said layer of first conductive material? formed by a sheet covering said first surface of said electrically insulating support, at least in an area thereof which extends as an area of said other surface of the support on which? formed said printed circuit diagram. 18. Thermocouple system according to claim 1, wherein said electrically insulating support? formed by a plurality? of circuit board layers, wherein said layer of first conductive material? formed on an interface surface of the support located between a pair of said board layers and wherein said printed circuit diagram of the second conductive material? formed on each of said opposite outer surfaces of said card. 19. A thermocouple system according to claim 18, wherein the layer of said first conductive material covers said interface surface. 20. A thermocouple system according to claim 18, wherein said layer of first conductive material? a printed circuit diagram provided with signal monitoring portions and terminal portions, and interconnection traces therebetween. 21. A thermocouple system according to claim 18, wherein said electrically insulating support comprises at least three layers of circuit board, and wherein at least one additional diagram of second conductive material? arranged at a respective additional interface surface of the support so as to form intermediate thermocouple junctions at points where the additional diagram intersects the electrical connections extending between the layer of first conductive material and the diagrams of the second conductive material formed on them external surfaces of the support. 22. A thermocouple system according to claim 21, wherein the layer of first conductive material covers said interface surface. 23. A thermocouple system according to claim 21, wherein said layer of first conductive material? a printed circuit diagram having signal monitoring portions and terminal portions and interconnection traces therebetween. 24. A thermocouple system according to claim 18, wherein said thermocouple junction of at least one of said schemes? constructed for a surface mounting of a conductor of an electrical component on it. 25. A thermocouple system according to claim 18, wherein said thermocouple junction of at least one of said schemes? built for the mounting in a through hole of a conductor of an electrical component on it. 26. A thermocouple system according to claim 18, wherein said printed circuit diagrams have a plurality of elements. of electrically connected terminal portions, and wherein the circuitry for some of said terminal portions? of a different area with respect to the area of said end portions to simulate different configurations of thermal mass. 27. A thermocouple system according to claim 18, wherein at least one said electrical connection? built as a means of simulating a drop in temperature. 28. A thermocouple system according to claim 1, wherein said conductive materials are selected from the group consisting of copper and constantan, chromium and aluminum, and iron and constantan. 29. Method for making a thermocouple system to provide temperature data resulting from the use of a thermally influencing process on an electronic system through a simulated manufacturing / reprocessing / repair operation, comprising the steps of: (A) applying a layer of a first conductive material to a first surface of an insulating electrical support; (B) at least form a printed circuit diagram of a second conductive material, which? different from said first conductive material, on at least one other surface of the support, said schemes comprising a circuitry having then? terminal sections of thermocouple pins, signal monitoring connection portions and trace interconnects running between them; And (C) connecting at least one end portion of the thermocouple pin of the second conductor to the layer of the first conductive material by forming an electrical connection of said first conductive material which extends through the support from said layer of first conductive material to the end portion of the pin circuitry thermocouple so as to create a thermocouple junction thereon. A method according to claim 29, wherein the step (A)? carried out by forming a printed circuit diagram of the first conductive material on said first surface. 31. Method according to claim 30, wherein the step <(> C <)> comprises the steps of forming a through hole in the electrically insulating support and of the end portions of the first and second conductive material, and plating the first conductive material through said through hole and on the end portions so as to form a mechanical, as well as an electrical connection, between them. 32. A method according to claim 31, comprising the further step of inserting a plug into said through hole to allow surface mounting of a conductor of an electrical component above it. 33. A method according to claim 31, wherein said plating in said through hole? carried out in such a way as to leave a portion of said opening unobstructed for mounting a conductor of an electrical component inside it in a through hole. The method according to claim 29, wherein the step (C) comprises the steps of forming a through hole in the electrically insulating support and of end portions of the first and second conductive material, and plating a first conductive material through said through hole and on the terminal portions so as to create a mechanical as well as electrical connection between them. A method according to claim 34, comprising the further step of inserting a plug into said through hole to allow surface mounting of a conductor of an electrical component thereon. 36. A method according to claim 34, wherein said plating in said through hole? carried out in such a way as to leave a portion of said opening unobstructed for mounting a conductor of an electrical component inside it in a through hole. 37. A method according to claim 29, wherein the step (B)? realized in such a way as to create a schematic trace for some of said terminal portions which? of a different amplitude with respect to another of said terminal portion to simulate different configurations of thermal mass. 38. A method according to claim 29, wherein said printed circuit diagram? formed by laminating a conductive sheet approximately 0.002 inch thick on the support, producing a circuit diagram of said sheet by photomasking techniques and removing unwanted portions of the circuit diagram produced using a chemical etching agent. 39. Method for obtaining temperature data corresponding to the implementation of a thermally influencing process on an electronic assembly by simulating a manufacturing / reprocessing / repair operation, comprising the steps of: (A) simulating an electronic assembly by providing a thermocouple system, comprising an electrically insulating support, a layer of a first conductive material applied to a first surface of said support, at least a printed circuit diagram of a second conductive material, which ? dissimilar to said first conductive material, formed on at least one other surface of the support; where said printed circuit diagram? including circuitry having thermocouple pin terminal portions, signal monitor connection portions and trace interconnects running therebetween wherein at least one thermocouple pin terminal portion of the second conductor circuit diagram; connected to the layer of the first conductive material by an electrical connection which? formed from said first conductive material and extending through said support therebetween so as to create a thermocouple junction on a respective terminal portion of thermocouple pin, so that said electronic component conductors are disposed on respective terminal portions of thermocouple pins. thermocouple of said printed circuit diagram; (B) simulate a manufacturing / reprocessing / repair operation during which a thermally influencing process? practically made with respect to said thermocouple system; (C) producing an electrical signal, representative of temperature data regarding the effects of at least said heat-influenced process of the simulated manufacturing / reprocessing / repair operation, through at least one said thermocouple junction; And (D) generating an output from said electrical signals with which said effects can be evaluated. The method according to claim 39, wherein the stage (B) comprises the steps of arranging the conductors of at least one electronic component on respective terminal portions of thermocouple pins, and forming an electrical connection between the conductors of the electronic component and respective terminal portions of thermocouple pins through said influencing thermal process; in which said process comprises the application of heat and said electrical signals relate to the effects of this on the insulating support and on the electronic component. A method according to claim 40, wherein said manufacturing / reprocessing / repair operation comprises a welding process. 42. A method according to claim 41, wherein said welding process? a through hole mounting process. 43. A method according to claim 41, wherein said welding process? a surface mounting process. A method according to claim 41, wherein said manufacturing / reprocessing / repair process? made by applying heat from at least one side of the thermocouple system to which the electronic component? applied. 45. Method according to claim 40, wherein said welding process? a surface mounting process. A method according to claim 45, wherein said manufacturing / reprocessing / repair process? achieved by applying heat from at least one side of the thermocouple system to which? applied the electronic component. A method according to claim 40, wherein said electrical signals representative of temperature data are produced to reflect the effect of a change in thermal mass configuration of an electronic assembly which? status sim 48. A method according to claim 40, wherein the temperature data? obtained from the thermocouple junctions in a plurality? of points corresponding to at least one surface of the insulating support. 49. A method according to claim 40, wherein the temperature data? obtained from thermocouple junctions in a plurality? of points in a plurality? of surfaces of the insulating support. 50. Method according to claim 49, wherein said plurality of of surfaces at which temperature data is obtained includes interface surfaces between circuit board layers from which? formed said insulating support. A method according to claim 39, wherein conductors of at least one electronic component are electrically connected to respective terminal portions of thermocouple pins; wherein step (B) includes the application of heat to separate the conductors of the electronic component from the respective terminal portions of the thermocouple pin, and wherein said electronic signals relate to the effects of said heat on at least the insulating support. The method of claim 51 wherein said electrical signals are also relevant to the effects of said heat application on other electrical components mounted on said insulating support. 53. A method according to claim 51, wherein said reprocessing / repair process is a desoldering process. 54. Method according to claim 53, wherein the electrical connections are of the surface mount type. A method according to claim 53, wherein the electrical connections are of the through-hole type. 56. A method according to claim 53, wherein said heat? applied by at least one side of the thermocouple system to which? applied the electronic component. 57. Method according to claim 54, wherein said manufacturing / reprocessing / repair process? achieved by applying heat from at least one side of the thermocouple system to which? connected the electronic component. The method of claim 51, wherein said electrical signals representative of temperature data are produced to reflect the effect of a variable thermal mass pattern of an electronic assembly being simulated. 59. Method according to claim 51, wherein the temperature data? obtained from thermocouple junctions in a plurality? of points on at least one surface of the insulating support. 60. A method according to claim 51, wherein the temperature data? obtained from thermocouple junctions in a pluraLit? of points on a plurality? of surfaces of the insulating support. 61. Method according to claim 60, wherein said plurality of of surfaces on which? obtained the temperature data includes interface surfaces between the circuit board layers from which? formed said insulating support. 62. A method according to claim 39, wherein said thermally influencing process? made with a fixture, and in which the output generated in stage (D)? used to evaluate the thermal behavior characteristics of said apparatus. 63. A printed circuit thermocouple comprising an electrically insulating support, a first conductive material applied to a first surface of said support, a printed circuit diagram of a second conductive material which differs from said first conductive material, said printed circuit diagram comprising a circuitry having at least one terminal portion of a thermocouple pin, a then? connection monitoring signal, and interconnection traces running between them; wherein the at least one terminal portion of the thermocouple pin of the circuit diagram of the second conductor? connected to the layer of the first conductive material by an electrical connection which? formed of said first conductive material, and extending through said support therebetween so as to create a thermocouple junction on the respective terminal portion of the thermocouple pin. 64. The printed circuit thermocouple of claim 63, wherein said layer of first conductive material comprises a printed circuit diagram having at least a signal monitoring terminal portion with an interconnect track running therebetween. 65. A printed circuit thermocouple according to claim 64, wherein said printed circuit diagram of the second conductive material has a plurality of materials. of said terminal portions on which? formed a respective said thermocouple junction. 66. Method for making a printed circuit thermocouple comprising the stages of: (A) applying a layer of a first conductive material on a first surface of an electrically insulating support; (B) forming at least a printed circuit diagram of a second conductive material, dissimilar to said conductive material, on at least one external surface of the support, said scheme being inclusive of circuitry having at least one terminal pin portion thermocouple, a monitoring signal of a connection portion and interconnection traces running between them; And (C) connecting said at least one terminal portion of the thermocouple pin of the second conductor printed circuit diagram to the layer of the first conductive material by forming an electrical connection on said first conductive material extending into the support from said first conductor layer. conductive material to the thermocouple pin terminal portion of the circuitry so as to create a thermocouple junction thereon. 67. A method according to claim 66, wherein the step (A)? made by forming a printed circuit diagram of the first conductive material on said first surface. 68. Method according to claim 67, wherein step (C) also comprises the Levels of forming a through hole in the electrically insulating support and of end portions of the first and second conductive materials, and plating the first conductive material in said through hole and on said end portions so as to create a mechanical as well as an electrical connection between them. 69. Method according to claim 68, wherein said method? made in order to create a multiplicity? of said thermocouple junctions. 70. A method according to claim 69, comprising the further step of dividing said support so as to create a plurality of materials. of separate and distinct thermocouple elements. each of which has at least one said thermo junction? couple formed on it.