IT8667095A0 - Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a filmspesso e dispositivi realizzati con tale procedimento - Google Patents

Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a filmspesso e dispositivi realizzati con tale procedimento

Info

Publication number
IT8667095A0
IT8667095A0 IT8667095A IT6709586A IT8667095A0 IT 8667095 A0 IT8667095 A0 IT 8667095A0 IT 8667095 A IT8667095 A IT 8667095A IT 6709586 A IT6709586 A IT 6709586A IT 8667095 A0 IT8667095 A0 IT 8667095A0
Authority
IT
Italy
Prior art keywords
procedure
diaphragm
bodies
creating
mechanical
Prior art date
Application number
IT8667095A
Other languages
English (en)
Other versions
IT1203535B (it
Inventor
Luciano Benini
Original Assignee
Marelli Autronica
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marelli Autronica filed Critical Marelli Autronica
Publication of IT8667095A0 publication Critical patent/IT8667095A0/it
Priority to IT67095/86A priority Critical patent/IT1203535B/it
Priority to GB08702241A priority patent/GB2186438B/en
Priority to CH382/87A priority patent/CH670000A5/it
Priority to JP62025558A priority patent/JPS62190627A/ja
Priority to FR878701548A priority patent/FR2594286B1/fr
Priority to ES8700301A priority patent/ES2004369A6/es
Priority to DE3703925A priority patent/DE3703925C2/de
Priority to BE8700099A priority patent/BE1001888A3/fr
Priority to US07/013,099 priority patent/US4771261A/en
Priority to NL8700311A priority patent/NL8700311A/nl
Priority to BR8700718A priority patent/BR8700718A/pt
Priority to PT84261A priority patent/PT84261B/pt
Application granted granted Critical
Publication of IT1203535B publication Critical patent/IT1203535B/it
Priority to JP008894U priority patent/JPH09346U/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49103—Strain gauge making

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
IT67095/86A 1986-02-10 1986-02-10 Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a film spesso e dispositivi realizzati con tale procedimento IT1203535B (it)

Priority Applications (13)

Application Number Priority Date Filing Date Title
IT67095/86A IT1203535B (it) 1986-02-10 1986-02-10 Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a film spesso e dispositivi realizzati con tale procedimento
GB08702241A GB2186438B (en) 1986-02-10 1987-02-02 Method for achieving the electrical and mechanical interconnection of two bodies, particularly the diaphragm and the support of a thick-film pressure sensor, and devices made by this method
CH382/87A CH670000A5 (it) 1986-02-10 1987-02-03
JP62025558A JPS62190627A (ja) 1986-02-10 1987-02-05 部材間の機電接続方法とそれによる装置
DE3703925A DE3703925C2 (de) 1986-02-10 1987-02-09 Verfahren zur Herstellung der elektrischen und mechanischen Verbindung von plattenförmigen Körpern
ES8700301A ES2004369A6 (es) 1986-02-10 1987-02-09 Metodo para obtener la interconexion mecanica electrica de dos cuerpos
FR878701548A FR2594286B1 (fr) 1986-02-10 1987-02-09 Procede d'interconnexion electrique et mecanique de deux corps, notamment dans un capteur de pression
BE8700099A BE1001888A3 (fr) 1986-02-10 1987-02-09 Procede d'interconnexion electrique et mecanique de deux corps, notamment dans un capteur de pression.
US07/013,099 US4771261A (en) 1986-02-10 1987-02-10 Method for achieving the electrical and mechanical interconnection of two bodies, particularly the diaphragm and the support of a thick-film pressure sensor, and devices made by this method
NL8700311A NL8700311A (nl) 1986-02-10 1987-02-10 Werkwijze voor het tot stand brengen van een elektrische en mechanische verbinding tussen twee lichamen, in het bijzonder een membraan en een ondersteuning van een dikke-filmdruksensor en inrichtingen vervaardigd volgens deze werkwijze.
BR8700718A BR8700718A (pt) 1986-02-10 1987-02-10 Processo para obter o diafragma eletrico e mecanico e o suporte de um sensor de pressao de pelicula espessa e dispositivos feitos por este processo
PT84261A PT84261B (pt) 1986-02-10 1987-02-10 Processo para obter o diafragma electrico e mecanico e o suporte de um sensor de pressao de pelicula espessa
JP008894U JPH09346U (ja) 1986-02-10 1996-09-03 機電接続した電機部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT67095/86A IT1203535B (it) 1986-02-10 1986-02-10 Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a film spesso e dispositivi realizzati con tale procedimento

Publications (2)

Publication Number Publication Date
IT8667095A0 true IT8667095A0 (it) 1986-02-10
IT1203535B IT1203535B (it) 1989-02-15

Family

ID=11299527

Family Applications (1)

Application Number Title Priority Date Filing Date
IT67095/86A IT1203535B (it) 1986-02-10 1986-02-10 Procedimento per la realizzazione del collegamento meccanico ed elettrico fra due corpi in particolare tra la membrana ed il sopporto di un sensore di pressione a film spesso e dispositivi realizzati con tale procedimento

Country Status (12)

Country Link
US (1) US4771261A (it)
JP (2) JPS62190627A (it)
BE (1) BE1001888A3 (it)
BR (1) BR8700718A (it)
CH (1) CH670000A5 (it)
DE (1) DE3703925C2 (it)
ES (1) ES2004369A6 (it)
FR (1) FR2594286B1 (it)
GB (1) GB2186438B (it)
IT (1) IT1203535B (it)
NL (1) NL8700311A (it)
PT (1) PT84261B (it)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031308A (en) * 1988-12-29 1991-07-16 Japan Radio Co., Ltd. Method of manufacturing multilayered printed-wiring-board
US5436795A (en) * 1994-03-28 1995-07-25 Texas Instruments Incorporated Pressure transducer apparatus and method for making same
FR2738705B1 (fr) * 1995-09-07 1997-11-07 Sagem Dispositif capteur electromecanique et procede de fabrication d'un tel dispositif
AU2059597A (en) * 1996-02-28 1997-09-16 Sigma-Netics, Inc. Improved strain gauge and method of manufacture
DE19708325B4 (de) * 1997-03-03 2007-06-14 Sokymat Gmbh Klebeverbindung von elektrisch leitenden Fügeteilen
EP1406271A1 (en) * 2001-02-16 2004-04-07 K-Tech Devices Corp. Resistor element, stress sensor and method for manufacturing them
DE102006031344A1 (de) 2006-07-06 2008-01-10 Epcos Ag Elektrisches Bauelement mit einem Sensorelement, Verfahren zur Verkapselung eines Sensorelements und Verfahren zur Herstellung einer Plattenanordnung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1403371A (en) * 1972-01-12 1975-08-28 Mullard Ltd Semiconductor device arrangements
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
JPS5550131A (en) * 1978-10-06 1980-04-11 Hitachi Ltd Electronic transmitter
JPS574531A (en) * 1980-06-10 1982-01-11 Matsushita Electric Ind Co Ltd Manufacture of electrostatic capacity type pressure sensor
US4410927A (en) * 1982-01-21 1983-10-18 Olin Corporation Casing for an electrical component having improved strength and heat transfer characteristics
JPS58162099A (ja) * 1982-03-23 1983-09-26 日本電信電話株式会社 多層印刷配線板の製造方法
FR2541828B1 (fr) * 1983-02-28 1985-09-13 Inf Milit Spatiale Aeronaut Dispositif de connexion electrique entre deux cartes de circuits imprimes et procede de connexion de deux cartes de circuits imprimes a l'aide d'un tel dispositif
DE3316017A1 (de) * 1983-05-03 1984-11-08 Siegert GmbH, 8501 Cadolzburg Verfahren zur herstellung elektrischer verbindungen an multisubstratschaltungen, sowie hiernach hergestellte multisubstratschaltungen
JPS6033308A (ja) * 1983-08-04 1985-02-20 Nippon Soda Co Ltd 鉄鋼改質剤
GB8322473D0 (en) * 1983-08-20 1983-09-21 Int Computers Ltd Printed circuit boards
GB8403968D0 (en) * 1984-02-15 1984-03-21 Heraeus Gmbh W C Chip resistors
US4670733A (en) * 1985-07-01 1987-06-02 Bell Microsensors, Inc. Differential pressure transducer

Also Published As

Publication number Publication date
PT84261B (pt) 1989-09-14
GB2186438B (en) 1989-02-01
IT1203535B (it) 1989-02-15
US4771261A (en) 1988-09-13
DE3703925C2 (de) 1998-12-10
GB2186438A (en) 1987-08-12
JPS62190627A (ja) 1987-08-20
BE1001888A3 (fr) 1990-04-10
CH670000A5 (it) 1989-04-28
JPH09346U (ja) 1997-06-10
PT84261A (en) 1987-03-01
FR2594286B1 (fr) 1991-09-13
NL8700311A (nl) 1987-09-01
BR8700718A (pt) 1987-12-08
FR2594286A1 (fr) 1987-08-14
DE3703925A1 (de) 1987-08-13
ES2004369A6 (es) 1989-01-01
GB8702241D0 (en) 1987-03-11

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970228