IT8120927A0 - PROCEDURE FOR THE MANUFACTURE OF MICROWIRE AND DEVICE FOR ITS IMPLEMENTATION. - Google Patents

PROCEDURE FOR THE MANUFACTURE OF MICROWIRE AND DEVICE FOR ITS IMPLEMENTATION.

Info

Publication number
IT8120927A0
IT8120927A0 IT8120927A IT2092781A IT8120927A0 IT 8120927 A0 IT8120927 A0 IT 8120927A0 IT 8120927 A IT8120927 A IT 8120927A IT 2092781 A IT2092781 A IT 2092781A IT 8120927 A0 IT8120927 A0 IT 8120927A0
Authority
IT
Italy
Prior art keywords
microwire
implementation
procedure
manufacture
Prior art date
Application number
IT8120927A
Other languages
Italian (it)
Other versions
IT1169238B (en
Inventor
Vasilievich Stepanenk Alexandr
Grigorievich Vitov Vladimir
Stepanovich Klimenkov Stepan
Alexandrovich Svyatoslav
Viktor Sergeevich Bartashevich
Original Assignee
Bruss Polt I
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SU802898655A external-priority patent/SU1066691A2/en
Priority claimed from SU802898652A external-priority patent/SU1058659A1/en
Priority claimed from SU802898653A external-priority patent/SU1058660A1/en
Priority claimed from SU802898659A external-priority patent/SU1058661A1/en
Priority claimed from SU802926253A external-priority patent/SU1058663A1/en
Priority claimed from SU802926251A external-priority patent/SU1058662A1/en
Application filed by Bruss Polt I filed Critical Bruss Polt I
Publication of IT8120927A0 publication Critical patent/IT8120927A0/en
Application granted granted Critical
Publication of IT1169238B publication Critical patent/IT1169238B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C1/00Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21CMANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C3/00Profiling tools for metal drawing; Combinations of dies and mandrels
    • B21C3/02Dies; Selection of material therefor; Cleaning thereof
    • B21C3/06Dies; Selection of material therefor; Cleaning thereof with adjustable section
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/745Apparatus for manufacturing wire connectors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B15/00Arrangements for performing additional metal-working operations specially combined with or arranged in, or specially adapted for use in connection with, metal-rolling mills
    • B21B2015/0028Drawing the rolled product
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124Aluminium (Al) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01004Beryllium [Be]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01041Niobium [Nb]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01042Molybdenum [Mo]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
IT20927/81A 1980-04-03 1981-04-03 PROCEDURE FOR THE MANUFACTURE OF MICROFILO AND DEVICE FOR ITS IMPLEMENTATION IT1169238B (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
SU2898658 1980-04-03
SU802898655A SU1066691A2 (en) 1980-04-03 1980-04-03 Apparatus for drawing microwire
SU802898652A SU1058659A1 (en) 1980-04-03 1980-04-03 Method and apparatus for drawing microwire
SU802898653A SU1058660A1 (en) 1980-04-03 1980-04-03 Method and apparatus for drawing microwire
SU802898659A SU1058661A1 (en) 1980-04-03 1980-04-03 Method and apparatus for drawing microwire
SU802926253A SU1058663A1 (en) 1980-06-04 1980-06-04 Method and apparatus for drawing microwire
SU2926252 1980-06-04
SU802926251A SU1058662A1 (en) 1980-06-04 1980-06-04 Method and apparatus for drawing microwire

Publications (2)

Publication Number Publication Date
IT8120927A0 true IT8120927A0 (en) 1981-04-03
IT1169238B IT1169238B (en) 1987-05-27

Family

ID=27573854

Family Applications (1)

Application Number Title Priority Date Filing Date
IT20927/81A IT1169238B (en) 1980-04-03 1981-04-03 PROCEDURE FOR THE MANUFACTURE OF MICROFILO AND DEVICE FOR ITS IMPLEMENTATION

Country Status (2)

Country Link
FR (1) FR2479714B1 (en)
IT (1) IT1169238B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH660696A5 (en) * 1983-07-28 1987-06-15 Bruss Polt I Apparatus for the production of microwire
FR2606304B1 (en) * 1986-11-07 1991-12-27 Bruss Polt I METHOD AND DEVICE FOR DRESSING A METAL WIRE

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1618515A (en) * 1921-05-28 1927-02-22 William C Coryell Metal working
US2092188A (en) * 1935-07-05 1937-09-07 Simons Aaron Process and apparatus for drawing metal strips
DE837988C (en) * 1951-01-20 1952-05-05 Otto Busselmeier Dipl Ing Method and device for the production of wire, in particular metal wire
US3492849A (en) * 1966-08-22 1970-02-03 Rotary Profile Anstalt Rolling of metal billets
DE2037889C3 (en) * 1970-07-27 1979-04-05 Brunswick Corp., Chicago, Ill. (V.St.A.) Process for making metal thread
US3955390A (en) * 1973-02-21 1976-05-11 Brunswick Corporation Twist drawn wire, process and apparatus for making same
US3883371A (en) * 1973-02-21 1975-05-13 Brunswick Corp Twist drawn wire

Also Published As

Publication number Publication date
FR2479714A1 (en) 1981-10-09
FR2479714B1 (en) 1985-11-29
IT1169238B (en) 1987-05-27

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