IT8026678A0 - SEMICONDUCTOR DEVICE FOR LIMITING HIGH FREQUENCY ELECTRIC POWER. - Google Patents
SEMICONDUCTOR DEVICE FOR LIMITING HIGH FREQUENCY ELECTRIC POWER.Info
- Publication number
- IT8026678A0 IT8026678A0 IT8026678A IT2667880A IT8026678A0 IT 8026678 A0 IT8026678 A0 IT 8026678A0 IT 8026678 A IT8026678 A IT 8026678A IT 2667880 A IT2667880 A IT 2667880A IT 8026678 A0 IT8026678 A0 IT 8026678A0
- Authority
- IT
- Italy
- Prior art keywords
- semiconductor device
- electric power
- high frequency
- frequency electric
- limiting high
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/8611—Planar PN junction diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
- H01L27/0814—Diodes only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03G—CONTROL OF AMPLIFICATION
- H03G11/00—Limiting amplitude; Limiting rate of change of amplitude ; Clipping in general
- H03G11/02—Limiting amplitude; Limiting rate of change of amplitude ; Clipping in general by means of diodes
- H03G11/025—Limiting amplitude; Limiting rate of change of amplitude ; Clipping in general by means of diodes in circuits having distributed constants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Tone Control, Compression And Expansion, Limiting Amplitude (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7931142A FR2472269A1 (en) | 1979-12-19 | 1979-12-19 | HIGH FREQUENCY SEMICONDUCTOR POWER LIMITER |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8026678A0 true IT8026678A0 (en) | 1980-12-16 |
IT1134739B IT1134739B (en) | 1986-08-13 |
Family
ID=9232953
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT26678/80A IT1134739B (en) | 1979-12-19 | 1980-12-16 | SEMICONDUCTIVE DEVICE TO LIMIT THE HIGH FREQUENCY ELECTRIC POWER |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5698880A (en) |
DE (1) | DE3046815A1 (en) |
FR (1) | FR2472269A1 (en) |
GB (1) | GB2066568A (en) |
IT (1) | IT1134739B (en) |
NL (1) | NL8006828A (en) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1459083A (en) * | 1964-09-18 | 1966-04-29 | Texas Instruments Inc | Surface Oriented Semiconductor Diode |
CA1138572A (en) * | 1978-05-11 | 1982-12-28 | Paul L. Fleming | Planar transmission line attenuator and switch |
-
1979
- 1979-12-19 FR FR7931142A patent/FR2472269A1/en active Granted
-
1980
- 1980-12-12 DE DE19803046815 patent/DE3046815A1/en not_active Withdrawn
- 1980-12-15 GB GB8040072A patent/GB2066568A/en not_active Withdrawn
- 1980-12-16 IT IT26678/80A patent/IT1134739B/en active
- 1980-12-16 JP JP17796680A patent/JPS5698880A/en active Pending
- 1980-12-17 NL NL8006828A patent/NL8006828A/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
DE3046815A1 (en) | 1981-09-03 |
GB2066568A (en) | 1981-07-08 |
FR2472269A1 (en) | 1981-06-26 |
NL8006828A (en) | 1981-07-16 |
JPS5698880A (en) | 1981-08-08 |
FR2472269B1 (en) | 1983-10-21 |
IT1134739B (en) | 1986-08-13 |
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