IT7921367A0 - Processo per l'attacco controllato di silicio. - Google Patents

Processo per l'attacco controllato di silicio.

Info

Publication number
IT7921367A0
IT7921367A0 IT7921367A IT2136779A IT7921367A0 IT 7921367 A0 IT7921367 A0 IT 7921367A0 IT 7921367 A IT7921367 A IT 7921367A IT 2136779 A IT2136779 A IT 2136779A IT 7921367 A0 IT7921367 A0 IT 7921367A0
Authority
IT
Italy
Prior art keywords
attacking
controlled silicon
silicon
controlled
silicon attacking
Prior art date
Application number
IT7921367A
Other languages
English (en)
Other versions
IT1162723B (it
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of IT7921367A0 publication Critical patent/IT7921367A0/it
Application granted granted Critical
Publication of IT1162723B publication Critical patent/IT1162723B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02019—Chemical etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30608—Anisotropic liquid etching

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
IT21367/79A 1978-04-24 1979-03-28 Processo per l'attacco controllato di silicio IT1162723B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/899,051 US4155866A (en) 1978-04-24 1978-04-24 Method of controlling silicon wafer etching rates-utilizing a diazine catalyzed etchant

Publications (2)

Publication Number Publication Date
IT7921367A0 true IT7921367A0 (it) 1979-03-28
IT1162723B IT1162723B (it) 1987-04-01

Family

ID=25410424

Family Applications (1)

Application Number Title Priority Date Filing Date
IT21367/79A IT1162723B (it) 1978-04-24 1979-03-28 Processo per l'attacco controllato di silicio

Country Status (6)

Country Link
US (1) US4155866A (it)
EP (1) EP0004872B1 (it)
JP (1) JPS54141348A (it)
CA (1) CA1100395A (it)
DE (1) DE2961095D1 (it)
IT (1) IT1162723B (it)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4187140A (en) * 1978-10-11 1980-02-05 International Business Machines Corporation Method for etching silicon and a residue and oxidation resistant etchant therefor
US4453305A (en) * 1981-07-31 1984-06-12 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Method for producing a MISFET
US4501636A (en) * 1983-12-28 1985-02-26 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for etching vertical junction solar cell wafers
US4765865A (en) * 1987-05-04 1988-08-23 Ford Motor Company Silicon etch rate enhancement
US4941941A (en) * 1989-10-03 1990-07-17 International Business Machines Corporation Method of anisotropically etching silicon wafers and wafer etching solution
US6110881A (en) * 1990-11-05 2000-08-29 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US6121217A (en) 1990-11-05 2000-09-19 Ekc Technology, Inc. Alkanolamine semiconductor process residue removal composition and process
US6242400B1 (en) 1990-11-05 2001-06-05 Ekc Technology, Inc. Method of stripping resists from substrates using hydroxylamine and alkanolamine
US7205265B2 (en) 1990-11-05 2007-04-17 Ekc Technology, Inc. Cleaning compositions and methods of use thereof
US6000411A (en) * 1990-11-05 1999-12-14 Ekc Technology, Inc. Cleaning compositions for removing etching residue and method of using
US20040018949A1 (en) * 1990-11-05 2004-01-29 Wai Mun Lee Semiconductor process residue removal composition and process
US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
JPH0763061B2 (ja) * 1991-07-30 1995-07-05 インターナショナル・ビジネス・マシーンズ・コーポレイション 選ばれた触媒が加えられたエッチング剤を用いるシリコンの異方性エッチングの制御
US5348617A (en) * 1991-12-23 1994-09-20 Iowa State University Research Foundation, Inc. Selective etching process
US7144849B2 (en) * 1993-06-21 2006-12-05 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
DE10060318A1 (de) 2000-12-04 2002-06-13 Solvay Pharm Gmbh Urin-Sammelvorrichtung mit lösbarem Kopfteil

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1273150A (en) * 1968-10-21 1972-05-03 Associated Semiconductor Mft Improvements in and relating to methods of etching semiconductor body surfaces
JPS5224508B2 (it) * 1973-11-19 1977-07-01 Tokai Electro Chemical Co
FR2372904A1 (fr) * 1976-11-19 1978-06-30 Ibm Composition de decapage du silicium polycristallin contenant de l'hydroxyde de tetramethylammonium et procede d'application

Also Published As

Publication number Publication date
IT1162723B (it) 1987-04-01
CA1100395A (en) 1981-05-05
EP0004872A3 (en) 1979-11-14
EP0004872A2 (fr) 1979-10-31
JPS5535466B2 (it) 1980-09-13
DE2961095D1 (en) 1982-01-07
US4155866A (en) 1979-05-22
EP0004872B1 (fr) 1981-10-28
JPS54141348A (en) 1979-11-02

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