IT7848041A0 - IMPROVEMENT IN PROCEDURES FOR THE MANUFACTURE OF TWO-LAYER PRINTED CIRCUITS - Google Patents
IMPROVEMENT IN PROCEDURES FOR THE MANUFACTURE OF TWO-LAYER PRINTED CIRCUITSInfo
- Publication number
- IT7848041A0 IT7848041A0 IT7848041A IT4804178A IT7848041A0 IT 7848041 A0 IT7848041 A0 IT 7848041A0 IT 7848041 A IT7848041 A IT 7848041A IT 4804178 A IT4804178 A IT 4804178A IT 7848041 A0 IT7848041 A0 IT 7848041A0
- Authority
- IT
- Italy
- Prior art keywords
- procedures
- improvement
- manufacture
- printed circuits
- layer printed
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US76873577A | 1977-02-15 | 1977-02-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7848041A0 true IT7848041A0 (en) | 1978-02-14 |
IT1102270B IT1102270B (en) | 1985-10-07 |
Family
ID=25083343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT48041/78A IT1102270B (en) | 1977-02-15 | 1978-02-14 | IMPROVEMENT IN PROCEDURES FOR THE MANUFACTURE OF TWO-LAYER PRINTED CIRCUITS |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5416670A (en) |
DE (1) | DE2805535A1 (en) |
FR (1) | FR2380686A1 (en) |
GB (1) | GB1584241A (en) |
IL (1) | IL53957A0 (en) |
IT (1) | IT1102270B (en) |
NL (1) | NL7801594A (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4250790A (en) * | 1979-10-22 | 1981-02-17 | Richard Shubb | Capo |
FR2517165A1 (en) * | 1981-11-20 | 1983-05-27 | Radiotechnique Compelec | METHOD FOR PROVIDING A SCREEN AN ELECTRONIC CIRCUIT, AND PAYMENT CARD HAVING A SCREEN |
JPS5939093A (en) * | 1982-08-27 | 1984-03-03 | 大槻 眞之 | Method of producing through hole circuit board |
FR2562335B1 (en) * | 1984-04-03 | 1988-11-25 | Rogers Corp | FLEXIBLE MULTILAYER CIRCUIT WITH CONNECTIONS BETWEEN ULTRASONIC WELDED LAYERS |
JPS62237791A (en) * | 1986-04-08 | 1987-10-17 | 新藤電子工業株式会社 | Manufacture of printed wiring board |
US5744759A (en) * | 1996-05-29 | 1998-04-28 | International Business Machines Corporation | Circuit boards that can accept a pluggable tab module that can be attached or removed without solder |
DE102009050386B4 (en) * | 2009-10-22 | 2013-10-31 | Mühlbauer Ag | Method for producing plated-through holes |
CN110636716A (en) * | 2019-09-24 | 2019-12-31 | 江苏上达电子有限公司 | Manufacturing method of non-electroplating blind hole |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1920061U (en) * | 1963-09-27 | 1965-07-22 | Siemens Ag | CARRIER PLATE ACCORDING TO THE PRINTED CIRCUIT WITH METAL CONDUCTOR TRACKS PROVIDED IN SEVERAL LEVELS, SOME OF WHICH ARE IN ELECTRICAL CONTACT WITH EACH OTHER. |
US3346950A (en) * | 1965-06-16 | 1967-10-17 | Ibm | Method of making through-connections by controlled punctures |
DE2113613B2 (en) * | 1970-03-27 | 1972-11-23 | Owens-Illinois, Inc., Toledo, Ohio (V.St.A.) | A method of simultaneously making electrical connections between a plurality of conductors on one substrate and a plurality of conductors on another substrate |
-
1978
- 1978-02-02 FR FR7802931A patent/FR2380686A1/en active Granted
- 1978-02-02 IL IL53957A patent/IL53957A0/en not_active IP Right Cessation
- 1978-02-10 NL NL7801594A patent/NL7801594A/en not_active Application Discontinuation
- 1978-02-10 DE DE19782805535 patent/DE2805535A1/en not_active Ceased
- 1978-02-13 GB GB5630/78A patent/GB1584241A/en not_active Expired
- 1978-02-13 JP JP1419478A patent/JPS5416670A/en active Granted
- 1978-02-14 IT IT48041/78A patent/IT1102270B/en active
Also Published As
Publication number | Publication date |
---|---|
IL53957A0 (en) | 1978-04-30 |
FR2380686B1 (en) | 1984-05-25 |
JPS6252479B2 (en) | 1987-11-05 |
DE2805535A1 (en) | 1978-08-17 |
NL7801594A (en) | 1978-08-17 |
IT1102270B (en) | 1985-10-07 |
GB1584241A (en) | 1981-02-11 |
JPS5416670A (en) | 1979-02-07 |
FR2380686A1 (en) | 1978-09-08 |
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