IT202000001258A1 - COOLING DEVICE FOR HEAT GENERATORS OF ELECTRONIC SYSTEMS - Google Patents

COOLING DEVICE FOR HEAT GENERATORS OF ELECTRONIC SYSTEMS

Info

Publication number
IT202000001258A1
IT202000001258A1 IT102020000001258A IT202000001258A IT202000001258A1 IT 202000001258 A1 IT202000001258 A1 IT 202000001258A1 IT 102020000001258 A IT102020000001258 A IT 102020000001258A IT 202000001258 A IT202000001258 A IT 202000001258A IT 202000001258 A1 IT202000001258 A1 IT 202000001258A1
Authority
IT
Italy
Prior art keywords
cooling device
electronic systems
heat generators
generators
heat
Prior art date
Application number
IT102020000001258A
Other languages
Italian (it)
Inventor
Franco Provenziani
Filippo Cataldo
Original Assignee
Provides Metalmeccanica S R L
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Provides Metalmeccanica S R L filed Critical Provides Metalmeccanica S R L
Priority to CA3161561A priority Critical patent/CA3161561A1/en
Priority to PCT/IB2020/061500 priority patent/WO2021111387A1/en
Priority to EP20829352.2A priority patent/EP4070631B1/en
Priority to CN202080084444.1A priority patent/CN114762469A/en
Priority to US17/756,442 priority patent/US11871546B2/en
Publication of IT202000001258A1 publication Critical patent/IT202000001258A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
IT102020000001258A 2019-12-05 2020-01-23 COOLING DEVICE FOR HEAT GENERATORS OF ELECTRONIC SYSTEMS IT202000001258A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CA3161561A CA3161561A1 (en) 2019-12-05 2020-12-04 Cooling system of electronic systems, in particular for data centre
PCT/IB2020/061500 WO2021111387A1 (en) 2019-12-05 2020-12-04 Cooling system of electronic systems, in particular for data centre
EP20829352.2A EP4070631B1 (en) 2019-12-05 2020-12-04 Cooling system of electronic systems, in particular for data centre
CN202080084444.1A CN114762469A (en) 2019-12-05 2020-12-04 Electronic system, in particular cooling system for a data center
US17/756,442 US11871546B2 (en) 2019-12-05 2020-12-04 Cooling system of electronic systems, in particular for data centre

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102019000023076A IT201900023076A1 (en) 2019-12-05 2019-12-05 COOLING SYSTEM FOR DATA CENTER

Publications (1)

Publication Number Publication Date
IT202000001258A1 true IT202000001258A1 (en) 2021-07-23

Family

ID=70009250

Family Applications (2)

Application Number Title Priority Date Filing Date
IT102019000023076A IT201900023076A1 (en) 2019-12-05 2019-12-05 COOLING SYSTEM FOR DATA CENTER
IT102020000001258A IT202000001258A1 (en) 2019-12-05 2020-01-23 COOLING DEVICE FOR HEAT GENERATORS OF ELECTRONIC SYSTEMS

Family Applications Before (1)

Application Number Title Priority Date Filing Date
IT102019000023076A IT201900023076A1 (en) 2019-12-05 2019-12-05 COOLING SYSTEM FOR DATA CENTER

Country Status (1)

Country Link
IT (2) IT201900023076A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050217829A1 (en) * 2004-03-31 2005-10-06 Alex Belits Low-profile thermosyphon-based cooling system for computers and other electronic devices
US20060144567A1 (en) * 2004-12-31 2006-07-06 Foxconn Technology Co., Ltd. Pulsating heat transfer apparatus
US20110067843A1 (en) * 2008-11-14 2011-03-24 Vasiliev Jr Leonid Heat exchange device made of polymeric material
EP2988578A1 (en) * 2014-08-19 2016-02-24 ABB Technology Oy Cooling element
EP3147621A1 (en) * 2015-09-24 2017-03-29 ABB Schweiz AG Cooling device and method for cooling at least two power electronic devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6657121B2 (en) * 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system
JP4199018B2 (en) * 2003-02-14 2008-12-17 株式会社日立製作所 Rack mount server system
US7345877B2 (en) * 2005-01-06 2008-03-18 The Boeing Company Cooling apparatus, system, and associated method
US8018720B2 (en) * 2009-06-25 2011-09-13 International Business Machines Corporation Condenser structures with fin cavities facilitating vapor condensation cooling of coolant
JP5836029B2 (en) * 2011-09-20 2015-12-24 株式会社日立製作所 Server rack cooling system and server equipment
IT201600108608A1 (en) * 2016-10-27 2018-04-27 Rodolfo Caciolli COOLING SYSTEM OF ELECTRONIC COMPONENTS HEAT PRODUCERS

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050217829A1 (en) * 2004-03-31 2005-10-06 Alex Belits Low-profile thermosyphon-based cooling system for computers and other electronic devices
US20060144567A1 (en) * 2004-12-31 2006-07-06 Foxconn Technology Co., Ltd. Pulsating heat transfer apparatus
US20110067843A1 (en) * 2008-11-14 2011-03-24 Vasiliev Jr Leonid Heat exchange device made of polymeric material
EP2988578A1 (en) * 2014-08-19 2016-02-24 ABB Technology Oy Cooling element
EP3147621A1 (en) * 2015-09-24 2017-03-29 ABB Schweiz AG Cooling device and method for cooling at least two power electronic devices

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CATALDO FILIPPO ET AL: "Experimental Performance of Completely Passive Single and Recirculating Loop Thermosyphon Cooling Systems using Low GWP R1234ze and R1234yf", 2019 18TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), IEEE, 28 May 2019 (2019-05-28), pages 1180 - 1189, XP033575072, DOI: 10.1109/ITHERM.2019.8757374 *

Also Published As

Publication number Publication date
IT201900023076A1 (en) 2021-06-05

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