IT201900020850A1 - SYSTEM FOR STORAGE AND COLLECTION OF MATERIALS - Google Patents
SYSTEM FOR STORAGE AND COLLECTION OF MATERIALSInfo
- Publication number
- IT201900020850A1 IT201900020850A1 IT102019000020850A IT201900020850A IT201900020850A1 IT 201900020850 A1 IT201900020850 A1 IT 201900020850A1 IT 102019000020850 A IT102019000020850 A IT 102019000020850A IT 201900020850 A IT201900020850 A IT 201900020850A IT 201900020850 A1 IT201900020850 A1 IT 201900020850A1
- Authority
- IT
- Italy
- Prior art keywords
- collection
- materials
- storage
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
- B65G1/02—Storage devices
- B65G1/04—Storage devices mechanical
- B65G1/0407—Storage devices mechanical using stacker cranes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/086—Supply management, e.g. supply of components or of substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102019000020850A IT201900020850A1 (en) | 2019-11-12 | 2019-11-12 | SYSTEM FOR STORAGE AND COLLECTION OF MATERIALS |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102019000020850A IT201900020850A1 (en) | 2019-11-12 | 2019-11-12 | SYSTEM FOR STORAGE AND COLLECTION OF MATERIALS |
Publications (1)
Publication Number | Publication Date |
---|---|
IT201900020850A1 true IT201900020850A1 (en) | 2021-05-12 |
Family
ID=69903829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT102019000020850A IT201900020850A1 (en) | 2019-11-12 | 2019-11-12 | SYSTEM FOR STORAGE AND COLLECTION OF MATERIALS |
Country Status (1)
Country | Link |
---|---|
IT (1) | IT201900020850A1 (en) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5321885A (en) * | 1991-03-18 | 1994-06-21 | Fujitsu Limited | Method and apparatus for manufacturing printed wiring boards |
US20030215357A1 (en) * | 2002-05-13 | 2003-11-20 | Nigel Malterer | Automated processing system and method of using same |
JP2006296296A (en) * | 2005-04-20 | 2006-11-02 | Yec Co Ltd | Warehouse for storing and holding article |
US20100086440A1 (en) * | 2008-09-30 | 2010-04-08 | F. Hoffmann-La Roche Ag | System and method for robotic storage of microplates |
US20160035608A1 (en) * | 2007-05-09 | 2016-02-04 | Brooks Automation, Inc. | Side opening unified pod |
WO2017072725A1 (en) * | 2015-10-30 | 2017-05-04 | Lafer S.R.L. | Storage unit for storing materials and pressure-bending facility using the aforementioned storage unit |
EP3238514A1 (en) * | 2014-12-22 | 2017-11-01 | Essegi System Service S.r.l. | Improved storage unit |
WO2018189699A1 (en) * | 2017-04-13 | 2018-10-18 | I-Tronik S.R.L. | Device for the storage of reels of electronic components |
JP2019091770A (en) * | 2017-11-13 | 2019-06-13 | Juki株式会社 | Component transfer device |
-
2019
- 2019-11-12 IT IT102019000020850A patent/IT201900020850A1/en unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5321885A (en) * | 1991-03-18 | 1994-06-21 | Fujitsu Limited | Method and apparatus for manufacturing printed wiring boards |
US20030215357A1 (en) * | 2002-05-13 | 2003-11-20 | Nigel Malterer | Automated processing system and method of using same |
JP2006296296A (en) * | 2005-04-20 | 2006-11-02 | Yec Co Ltd | Warehouse for storing and holding article |
US20160035608A1 (en) * | 2007-05-09 | 2016-02-04 | Brooks Automation, Inc. | Side opening unified pod |
US20100086440A1 (en) * | 2008-09-30 | 2010-04-08 | F. Hoffmann-La Roche Ag | System and method for robotic storage of microplates |
EP3238514A1 (en) * | 2014-12-22 | 2017-11-01 | Essegi System Service S.r.l. | Improved storage unit |
WO2017072725A1 (en) * | 2015-10-30 | 2017-05-04 | Lafer S.R.L. | Storage unit for storing materials and pressure-bending facility using the aforementioned storage unit |
WO2018189699A1 (en) * | 2017-04-13 | 2018-10-18 | I-Tronik S.R.L. | Device for the storage of reels of electronic components |
JP2019091770A (en) * | 2017-11-13 | 2019-06-13 | Juki株式会社 | Component transfer device |
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