IT201800003900A1 - PROCESS OF MICRO-ENGRAVING OF NANOMETRIC STRUCTURES ON "UV" INKS AND LACQUERS COVERED WITH PLASTIC FILM OR ANY FILM OR FILM THAT MAY BE COATED WITH SUCH INKS OR LACQUERS - Google Patents
PROCESS OF MICRO-ENGRAVING OF NANOMETRIC STRUCTURES ON "UV" INKS AND LACQUERS COVERED WITH PLASTIC FILM OR ANY FILM OR FILM THAT MAY BE COATED WITH SUCH INKS OR LACQUERS Download PDFInfo
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- IT201800003900A1 IT201800003900A1 IT102018000003900A IT201800003900A IT201800003900A1 IT 201800003900 A1 IT201800003900 A1 IT 201800003900A1 IT 102018000003900 A IT102018000003900 A IT 102018000003900A IT 201800003900 A IT201800003900 A IT 201800003900A IT 201800003900 A1 IT201800003900 A1 IT 201800003900A1
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- Prior art keywords
- film
- ink
- micro
- coated
- lacquers
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Links
- 239000000976 ink Substances 0.000 title claims description 67
- 238000000034 method Methods 0.000 title claims description 24
- 230000008569 process Effects 0.000 title claims description 22
- 239000004922 lacquer Substances 0.000 title claims description 18
- 239000002985 plastic film Substances 0.000 title claims description 6
- 229920006255 plastic film Polymers 0.000 title claims description 6
- 238000004049 embossing Methods 0.000 claims description 25
- 230000005855 radiation Effects 0.000 claims description 10
- 238000006116 polymerization reaction Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 238000003892 spreading Methods 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- 238000003847 radiation curing Methods 0.000 claims 1
- 239000002086 nanomaterial Substances 0.000 description 3
- 239000000123 paper Substances 0.000 description 3
- 239000004038 photonic crystal Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000011111 cardboard Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000011087 paperboard Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- -1 Polypropylene Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
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- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/024—Hologram nature or properties
- G03H1/0244—Surface relief holograms
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/0276—Replicating a master hologram without interference recording
- G03H1/028—Replicating a master hologram without interference recording by embossing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/04—Processes or apparatus for producing holograms
- G03H1/18—Particular processing of hologram record carriers, e.g. for obtaining blazed holograms
- G03H1/181—Pre-exposure processing, e.g. hypersensitisation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
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- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/04—Layered products comprising a layer of paper or cardboard next to a particulate layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/06—Embossing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F19/00—Apparatus or machines for carrying out printing operations combined with other operations
- B41F19/08—Simultaneous moulding and printing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/0252—Laminate comprising a hologram layer
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H1/0272—Substrate bearing the hologram
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
- G03H2001/026—Recording materials or recording processes
- G03H2001/0264—Organic recording material
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/04—Processes or apparatus for producing holograms
- G03H1/18—Particular processing of hologram record carriers, e.g. for obtaining blazed holograms
- G03H2001/185—Applying a curing step
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
- G03H1/26—Processes or apparatus specially adapted to produce multiple sub- holograms or to obtain images from them, e.g. multicolour technique
- G03H1/30—Processes or apparatus specially adapted to produce multiple sub- holograms or to obtain images from them, e.g. multicolour technique discrete holograms only
- G03H2001/306—Tiled identical sub-holograms
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H2222/00—Light sources or light beam properties
- G03H2222/10—Spectral composition
- G03H2222/15—Ultra Violet [UV]
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H2227/00—Mechanical components or mechanical aspects not otherwise provided for
- G03H2227/04—Production line for mass production
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H2250/00—Laminate comprising a hologram layer
- G03H2250/14—Forming layer onto which a surface relief hologram is formed
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H2250/00—Laminate comprising a hologram layer
- G03H2250/34—Colour layer
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H2270/00—Substrate bearing the hologram
- G03H2270/10—Composition
- G03H2270/12—Fibrous, e.g. paper, textile
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H2270/00—Substrate bearing the hologram
- G03H2270/10—Composition
- G03H2270/14—Plastic
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
- G03H2270/00—Substrate bearing the hologram
- G03H2270/30—Nature
- G03H2270/31—Flexible
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Description
Descrizione della Description of the
INVENZIONE INDUSTRIALE INDUSTRIAL INVENTION
dal Titolo: by title:
PROCESSO DI MICROINCISIONE DI STRUTTURE NANOMETRICHE SU INCHIOSTRI E LACCHE “UV” POSTE A RIVESTIMENTO DI PELLI-COLE PLASTICHE O QUALSIASI PELLICOLA O FILM CHE POSSA ES-SERE SPALMATA CON TALI INCHIOSTRI O LACCHE. PROCESS OF MICRO-ENGRAVING OF NANOMETRIC STRUCTURES ON “UV” INKS AND LACQUERS COVERED WITH PLASTIC LEATHER OR ANY FILM OR FILM THAT MAY BE COATED WITH SUCH INKS OR LACQUERS.
SETTORE TECNOLOGICO DI RIFERIMENTO REFERENCE TECHNOLOGICAL SECTOR
La presente invenzione ha per oggetto un processo di microincisione di strutture nanometriche su inchiostri e lacche “UV” poste a rivestimento di pellicole plastiche o qualsiasi pellicola o film che possa essere spalmata con tali inchiostri o lacche. The present invention relates to a process of micro-etching of nanometric structures on inks and "UV" lacquers placed on coating of plastic films or any film or film that can be coated with such inks or lacquers.
STATO DELLA TECNICA STATE OF THE TECHNIQUE
Sono noti metodi di microgoffratura di immagini olografiche su una pellicola rivestita con inchiostri “UV” utilizzando come stampo di goffratura film recanti microgoffrate in superficie le immagini olografiche da trasferire sulla pellicola. In tali sistemi solitamente il processo di trasferimento dell’immagine olografica del film sull’inchiostro “UV” della pellicola e il processo di indurimento dell’inchiostro avvengono contemporaneamente. SCOPO DELLA PRESENTE INVENZIONE Methods of micro-embossing holographic images on a film coated with “UV” inks are known using films having micro-embossed on the surface as the embossing mold of the holographic images to be transferred onto the film. In these systems usually the process of transferring the holographic image of the film onto the "UV" ink of the film and the ink hardening process take place simultaneously. PURPOSE OF THIS INVENTION
Scopo della presente invenzione è la realizzazione di un processo di microincisione di strutture nanometriche su inchiostri e lacche “UV” poste a rivestimento di pellicole plastiche o qualsiasi pellicola o film che possa essere spalmata con tali inchiostri o lacche, che risulti particolarmente affidabile e in cui lo stampo di goffratura possa utilizzare come mezzo di goffratura o un cliché o un film già inciso. The purpose of the present invention is to carry out a process of micro-etching of nanometric structures on "UV" inks and lacquers placed on plastic films or any film or film that can be coated with such inks or lacquers, which is particularly reliable and in which the embossing mold can use either a cliché or a film already engraved as an embossing medium.
SOLUZIONE INVENTIVA INVENTIVE SOLUTION
Il processo di microincisione secondo l’invenzione, di strutture nanometriche su inchiostri e lacche “UV” poste a rivestimento di una pellicola plastica o qualsiasi pellicola o film che possa essere spalmata con tali inchiostri o lacche, comprende una prima fase di spalmatura dell’inchiostro UV sulla pellicola, cui fa seguito una fase di parziale polimerizzazione dell’inchiostro UV attuata a mezzo di radiazioni UV, e infine una fase di microincisione dell’inchiostro con un cliché recante incise le strutture nanometriche o con una pellicola già incisa con le strutture nanometriche, fase di microincisione con contemporanea polimerizzazione definitiva dell’inchiostro UV a mezzo di radiazioni UV. The process of micro-engraving according to the invention, of nanometric structures on inks and "UV" lacquers placed on a plastic film or any film or film that can be coated with such inks or lacquers, includes a first step of spreading the ink UV on the film, followed by a phase of partial polymerization of the UV ink carried out by means of UV radiation, and finally a phase of micro-engraving of the ink with a cliché bearing the nanometric structures engraved or with a film already engraved with the nanometric structures , micro-engraving phase with simultaneous definitive polymerization of the UV ink by means of UV radiation.
ELENCO DELLE FIGURE LIST OF FIGURES
Le caratteristiche, gli scopi e i vantaggi dell’invenzione risulteranno più evidenti dalla descrizione che segue relativa ad esempi di realizzazione di carattere non limitativo, facente riferimento ai disegni allegati le cui figure mostrano schematicamente: The features, purposes and advantages of the invention will be more evident from the following description relating to examples of non-limiting embodiments, referring to the attached drawings whose figures show schematically:
La Fig.1: un processo di microincisione secondo l’invenzione utilizzante come mezzo di goffratura un cliché; Fig.1: a micro-engraving process according to the invention using a cliché as an embossing medium;
La Fig.2: un processo di microincisione secondo l’invenzione utilizzante come mezzo di goffratura un film già inciso. Fig.2: a micro-engraving process according to the invention using an already engraved film as an embossing medium.
DESCRIZIONE DEGLI ESEMPI DI REALIZZAZIONE DESCRIPTION OF THE REALIZATION EXAMPLES
La Fig. 1 mostra lo schema di una macchina “goffratrice” funzionante come da presente invenzione, in cui sono presenti diversi componenti meccanici: una stazione di spalmatura, stazioni di essiccamento, unità di illuminazione “UV”, cilindri porta clichè e di controspinta, rulli di accompagnamento della pellicola, unità di supporto della bobina per lo svolgimento e per il riavvolgimento del film. Fig. 1 shows the diagram of an "embossing" machine operating as per the present invention, in which there are various mechanical components: a coating station, drying stations, "UV" lighting unit, cliché and counter-thrust cylinders, film accompanying rollers, reel support unit for unwinding and rewinding the film.
Nella figura i vari contrassegni stanno a indicare: In the figure, the various marks indicate:
A: rullo svolgitore della bobina della pellicola che deve essere spalmata con l’inchiostro “UV”. A: unwinding roller of the film reel to be coated with "UV" ink.
B: stazione di spalmatura dell’inchiostro “UV” sulla pellicola che fa da supporto. B: "UV" ink spreading station on the film that acts as a support.
C: stazione di parziale essicazione dei solventi dell’inchiostro “UV”. C: station for partial drying of the "UV" ink solvents.
E: stazione di goffratura con il clichè montato su uno dei due cilindri che trasferiranno sull’inchiostro “UV” l’impronta nanometrica . E: embossing station with the cliché mounted on one of the two cylinders that will transfer the nanometric imprint to the "UV" ink.
D: pellicola con spalmato l’inchiostro”UV” che transita verso il modulo goffratore E. ù D: film with "UV" ink coated which passes towards the embossing module E. ù
F: unità di illuminazione con emissione di radiazioni “UV” che polimerizzano l’inchiostro “UV” in forma definitiva. F: lighting unit with emission of "UV" radiation that polymerize the "UV" ink in its final form.
G: rullo di riavvolgimento della pellicola recante l’inchiostro “UV” spalmato, goffrato e polimerizzato. G: rewinding roller of the film bearing the coated, embossed and polymerized "UV" ink.
Per quanto concerne il clichè utilizzabile, questo potrebbe essere realizzato con le tecnologie descritte nei brevetti precedenti N.IT1217385 (B), e N.IT393948 (B1) a nome dello stesso inventore. As far as the usable plate is concerned, this could be achieved with the technologies described in the previous patents N.IT1217385 (B), and N.IT393948 (B1) in the name of the same inventor.
Si commenta lo schema di Fig.1 come segue. The diagram of Fig.1 is commented on as follows.
La goffratura di lacche e inchiostri UV, così chiamati perchè fotosensibili alla radiazioni elettromagnetiche ultraviolette, goffratura che qui di seguito chiameremo per semplicità goffratura “UV”, permette di incidere nano strutture del tipo: ologrammi, reticoli di diffrazione micro lenti, filtri polarizzatori, antenne olografiche Rfid, transponder olografici, guide di luce, strutture nanofotoniche e cristalli fotonici, applicabili alle diverse discipline fisiche e chimiche, nella industria dell’imballaggio alimentare, nei documenti della stampa di sicurezza, nella segnaletica stradale, nel packaging, nelle pellicole anti abbagliamento, nella struttura dei semiconduttori, nelle guide d’onda, nei cristalli fotonici e così via, insomma in qualsiasi struttura incisa a dimensioni micrometriche e nanometriche. Tutti i processi di lavorazione vengono svolti in un ambiente sterile. La struttura dei macchinari è progettata in due fasi di lavorazione: la prima fase è quella della spalmatura dell’inchiostro “UV” sulla pellicola con funzioni di supporto, la seconda fase è il processo di esposizione del clichè con l’inchiostro “UV” per trasferire l’impronta del clichè sull’inchiostro “UV”. La sequenza di lavorazione si svolge nel seguente modo nella macchina da incisione: la pellicola che funge da substrato delle lacche e degli inchiostri”UV” del tipo film di poliestere dello spessore che può andare dai 12 micron ai 300 micron e oltre, viene svolto e trascinato in una testa di stampa che spalma l’inchiostro “UV” sulla superficie della pellicola che durante il percorso di trascinamento passa sotto un modulo di essiccazione per far evaporare i solventi, dove viene effettuata una lieve polimerizzazione dell’inchiostro “UV”. Poi la pellicola con l’inchiostro “UV” leggermente polimerizzato, passa in un'altra stazione di incisione del clichè con la pellicola con spalmato l’inchiostro “UV” leggermente polimerizzato,e viene tenuta a contatto intimo con il clichè mediante un cilindro di controspinta che permette al clichè di penetrare nello strato dell’inchiostro “UV” per lasciare l’impronta nanometrica del clichè. Durante questa fase un secondo gruppo di lampade a emissione ultravioletta fissano e terminano il processo di polimerizzazione. La pellicola con il suo strato di inchiostro ”UV” inciso e polimerizzato, si riavvolge sul riavvolgitore della macchina di incisione. Nel circuito delle lavorazioni delle macchine possono essere aggiunti altri elementi per ottimizzare i processi di lavorazione che indicheremo come esempi non limitativi, e variabili di lavorazione che sfruttano lo stesso principio di incisione, ma con altre caratteristiche .Per esempio uno stadio di essiccazione può essere aggiunto nel percorso della lavorazione dell’inchiostro “UV” per rimuovere i solventi della lacca o inchiostro “UV”. Il modulo di spalmatura dell’inchiostro è sincronizzato con il rullo incisore per garantire uno spessore del rivestimento dell’inchiostro sulla pellicola flessibile del supporto indipendentemente dalla velocità di lavorazione. La pellicola è tenuta in intimo contatto con il rullo di incisione che ha applicato sul suo diametro il clichè, che esercita una pressione costante durante l’incisione; tale pressione viene controllata da un sensore optoelettronico. Mediante tali accorgimenti le microincisioni sull’inchiostro “UV” sono replicate perfettamente. L’inchiostro “UV” deve avere proprietà anti aderenti per fare in modo che dopo il contatto con il clichè possa continuare il suo percorso nella macchina. Un modulo di lampade “UV” è inserito nella zona di contatto della pellicola con il clichè, in modo che l’esposizione alla luce “UV” polimerizzi e indurisca permanentemente l’inchiostro con le impronte nanometriche incise. Dopo questo processo di polimerizzazione la pellicola con l’inchIostro “UV” con l’impronta nanometrica, viene riavvolto su un modulo di riavvolgimento collocato all’estremità della macchina goffratrice. Tutto il processo di lavorazione si svolge in un ambiente privo di inquinamento in camera bianca di classe 100. Il prodotto che si ottiene da queste lavorazioni utilizza principalmente pellicole flessibili del tipo PET, Polipropilene, Policarbonato, Pvc, ma anche carta con lavorazioni anche su fogli oltre che in pellicole in bobina come precedentemente descritto. The embossing of lacquers and UV inks, so called because they are photosensitive to ultraviolet electromagnetic radiation, embossing that we will call "UV" embossing below for simplicity, allows to engrave nano structures such as: holograms, micro-lens diffraction gratings, polarizing filters, antennas Rfid holographic, holographic transponders, light guides, nanophotonic structures and photonic crystals, applicable to different physical and chemical disciplines, in the food packaging industry, in security printing documents, in road signs, in packaging, in anti-glare films, in the semiconductor structure, in the waveguides, in the photonic crystals and so on, in short, in any structure engraved at micrometric and nanometric dimensions. All manufacturing processes are carried out in a sterile environment. The structure of the machinery is designed in two processing phases: the first phase is that of spreading the "UV" ink on the film with support functions, the second phase is the process of exposing the cliché with the "UV" ink to transfer the imprint of the cliché onto the "UV" ink. The processing sequence takes place in the following way in the engraving machine: the film that acts as a substrate for the "UV" lacquers and inks of the polyester film type with a thickness ranging from 12 microns to 300 microns and more, is unwound and dragged into a print head that spreads the “UV” ink on the surface of the film which, during the drag path, passes under a drying module to evaporate the solvents, where a slight polymerization of the “UV” ink is carried out. Then the film with the lightly cured "UV" ink passes to another plate engraving station with the film coated with the lightly cured "UV" ink, and is kept in intimate contact with the plate by means of a cylinder of counterthrust that allows the cliché to penetrate the “UV” ink layer to leave the nanometric imprint of the cliché. During this phase a second group of ultraviolet emission lamps fix and end the polymerization process. The film with its etched and cured ”UV” ink layer rewinds onto the rewinder of the engraving machine. Other elements can be added to the machine processing circuit to optimize the processing processes that we will indicate as non-limiting examples, and processing variables that exploit the same engraving principle, but with other characteristics. For example, a drying stage can be added in the path of the “UV” ink processing to remove the solvents of the lacquer or “UV” ink. The ink spreading module is synchronized with the scoring roller to ensure a thickness of the ink coating on the flexible film of the support regardless of the processing speed. The film is kept in intimate contact with the engraving roller which has applied the cliché on its diameter, which exerts constant pressure during engraving; this pressure is controlled by an optoelectronic sensor. By means of these precautions, the micro-engravings on the "UV" ink are replicated perfectly. The "UV" ink must have anti-adhesion properties to ensure that after contact with the cliché it can continue its path in the machine. A module of "UV" lamps is inserted in the contact area of the film with the cliché, so that exposure to "UV" light polymerizes and permanently hardens the ink with the engraved nanometric imprints. After this polymerization process, the film with the "UV" ink with the nanometric imprint is rewound on a rewinding module located at the end of the embossing machine. The entire manufacturing process takes place in a pollution-free environment in a class 100 clean room. The product obtained from these processes mainly uses flexible films such as PET, Polypropylene, Polycarbonate, PVC, but also paper with processing also on sheets as well as in reel films as previously described.
La Fig. 2 mostra lo schema di una macchina goffratrice che utilizza come clichè un film già inciso con le nano strutture, nanostrutture che possono essere già state realizzate con uno schema come in figura Fig.1. Fig. 2 shows the scheme of an embossing machine that uses as a cliché a film already engraved with the nano structures, nanostructures that may have already been made with a scheme as in figure Fig.1.
Nella figura le varie parti contrassegnate hanno lo stesso significato di Fig.1 con eccezione della stazione di goffratura E in cui in luogo del cilindro recante il cliché di goffratura compare una coppia di rulli di supporto di una pellicola già incisa con le strutture nanometriche, che si fa scorrere in intimo contatto con la pellicola spalmata con l’inchiostro”UV” in modo da lasciare l’impronta nanometrica nella forma e con le caratteristiche precedentemente descritte. In the figure, the various marked parts have the same meaning as in Fig. 1 with the exception of the embossing station E in which, instead of the cylinder bearing the embossing cliché, a pair of support rollers of a film already engraved with the nanometric structures appears, which it is made to slide in intimate contact with the film coated with the "UV" ink in order to leave the nanometric imprint in the shape and with the characteristics previously described.
Questo tipo di macchina è applicabile principalmente su carta e cartone. Il substrato, cioè la pellicola, la carta o il cartone vengono spalmati con l’inchiostro “UV”. Poi durante il percorso di lavorazione l’inchiostro “UV” viene parzialmente polimerizzato dal modulo di lampade “UV”, poi le due pellicole vengono messe a contatto intimo per trasferire l’impronta nanometrica, mentre un altro modulo di lampade “UV” polimerizza definitivamente l’inchiostro “UV” con l’impronta trasferita. All’uscita del contatto delle due pellicole i due film si separano e vengono riavvolti separatamente. Tale sistema permette di utilizzare la pellicola “goffratrice” più volte, e ha il vantaggio di essere applicato su supporti particolari con dimensioni non standard. Inoltre si possono stampare zone parziali sagomate ad hoc con l’inchiostro “UV”, in modo da riportare le incisioni nanometriche, durante il processo di goffratura, solo in quelle zone dove c’è l’inchiostro”UV”, e lasciando neutre le altre zone della pellicola o della carta .Si possono ripeter più volte queste lavorazioni sulla stessa pellicola o carta da stampa, dando ulteriori vantaggi al prodotto finito, non altrimenti possibili con le tecniche convenzionali. Le impronte nanometriche possono essere del tipo : ologrammi, lenti, cristalli fotonici, reticoli di diffrazione abbinabili insieme uno accanto all’altro, combinando più passaggi nella macchina “goffratrice”. Il procedimento di goffratura UV utilizza la radiazione ultravioletta della luce nella gamma di lunghezza d’onda che va da 200 a480 nanometri e polimerizza lacche e vernici a base di monomeri a velocità diversa a seconda della sua composizione e quantità di sensibilizzatori,pigmenti e additivi chimici, Lo spessore del rivestimento dell’inchiostro ”UV” è inversamente proporzionale al tempo di esposizione. La radiazione “UV” all’interno dello strato dell’inchiostro ”UV” diminuisce esponenzialmente con la profondità dello strato spalmato. Un aumento dello spessore di due volte rispetto ad una volta sola richiede una potenza di irraggiamento 10 volte superiore rispetto allo spessore più basso. Ad esempio per uno spessore dell’inchiostro “UV” di 50 micron il 70% dell’energia “UV” viene assorbita nei 25 micron superiori esposti, mentre il 7% viene assorbito nei 25 micron inferiori. Normalmente la velocità di lavorazione aumenta con l’aumento dell’irraggiamento del modulo della lampada “UV”a unità di superficie. Per esempio se il modulo di irraggiamento”UV” emette potenza di 100 watt per centimetro quadrato, se viene raddoppiata la potenza a 200watt per centimetro quadrato, la velocità di polimerizzazione aumenta di 10 volte. Scegliendo i diversi componenti dell’inchiostro “UV” si possono dare diverse combinazioni della struttura chimica in modo da far conferire al prodotto caratteristiche di durezza meccanica e proprietà ottiche importanti come conferire indici di rifrazione tali da essere impiegati nelle più svariate applicazione delle pellicole ad alto valore tecnologico come quelle utilizzabili nei film per incrementare l’efficienza nei pannelli fotovoltaici. This type of machine is mainly applicable on paper and cardboard. The substrate, ie the film, paper or cardboard, is coated with "UV" ink. Then during the processing process the "UV" ink is partially polymerized by the "UV" lamp module, then the two films are put into intimate contact to transfer the nanometric impression, while another module of "UV" lamps permanently polymerizes the “UV” ink with the transferred impression. When the two films come out of contact, the two films separate and are rewound separately. This system allows to use the "embossing" film several times, and has the advantage of being applied on particular supports with non-standard dimensions. In addition, partial areas shaped ad hoc can be printed with "UV" ink, in order to bring back the nanometric engravings, during the embossing process, only in those areas where there is "UV" ink, and leaving the other areas of the film or paper. These processes can be repeated several times on the same printing film or paper, giving further advantages to the finished product, not otherwise possible with conventional techniques. The nanometric imprints can be of the type: holograms, lenses, photonic crystals, diffraction gratings that can be combined together next to each other, combining multiple steps in the "embossing" machine. The UV embossing process uses ultraviolet radiation of light in the wavelength range from 200 to 480 nanometers and cures monomer-based lacquers and varnishes at different speeds depending on its composition and quantity of sensitizers, pigments and chemical additives , The thickness of the “UV” ink coating is inversely proportional to the exposure time. The "UV" radiation inside the "UV" ink layer decreases exponentially with the depth of the coated layer. A two-fold increase in thickness compared to one time requires 10 times more radiation power than the lowest thickness. For example, for a thickness of the "UV" ink of 50 microns, 70% of the "UV" energy is absorbed in the upper 25 microns exposed, while 7% is absorbed in the lower 25 microns. Normally the processing speed increases with the increase in irradiation of the "UV" lamp module per surface unit. For example, if the “UV” radiation module emits power of 100 watts per square centimeter, if the power is doubled to 200 watts per square centimeter, the polymerization speed increases by 10 times. By choosing the different components of the "UV" ink, different combinations of the chemical structure can be given in order to give the product characteristics of mechanical hardness and important optical properties such as conferring refractive indices such as to be used in the most varied applications of high-grade films. technological value such as those used in films to increase efficiency in photovoltaic panels.
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Citations (3)
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WO2006032493A2 (en) * | 2004-09-23 | 2006-03-30 | Securis Limited | Apparatus and process for the printing of microstructures |
EP1720079A1 (en) * | 2005-05-06 | 2006-11-08 | Neopack, Sl | Coloured composition comprising a hologram and preparation process |
US20140061976A1 (en) * | 2012-09-05 | 2014-03-06 | Heidelberger Druckmaschinen Ag | Method and apparatus for producing embossed structures in radiation-curing materials |
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WO2006032493A2 (en) * | 2004-09-23 | 2006-03-30 | Securis Limited | Apparatus and process for the printing of microstructures |
EP1720079A1 (en) * | 2005-05-06 | 2006-11-08 | Neopack, Sl | Coloured composition comprising a hologram and preparation process |
US20140061976A1 (en) * | 2012-09-05 | 2014-03-06 | Heidelberger Druckmaschinen Ag | Method and apparatus for producing embossed structures in radiation-curing materials |
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