IT201700094953A1 - Integrated optical system and process for creating the integrated optical system - Google Patents

Integrated optical system and process for creating the integrated optical system

Info

Publication number
IT201700094953A1
IT201700094953A1 IT102017000094953A IT201700094953A IT201700094953A1 IT 201700094953 A1 IT201700094953 A1 IT 201700094953A1 IT 102017000094953 A IT102017000094953 A IT 102017000094953A IT 201700094953 A IT201700094953 A IT 201700094953A IT 201700094953 A1 IT201700094953 A1 IT 201700094953A1
Authority
IT
Italy
Prior art keywords
optical system
integrated optical
creating
integrated
optical
Prior art date
Application number
IT102017000094953A
Other languages
Italian (it)
Inventor
Jan Niklas Caspers
Marc Schmid
Alexander Huebel
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Priority to IT102017000094953A priority Critical patent/IT201700094953A1/en
Publication of IT201700094953A1 publication Critical patent/IT201700094953A1/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/34—Optical coupling means utilising prism or grating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1028—Coupling to elements in the cavity, e.g. coupling to waveguides adjacent the active region, e.g. forward coupled [DFC] structures
    • H01S5/1032—Coupling to elements comprising an optical axis that is not aligned with the optical axis of the active region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/14—External cavity lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
IT102017000094953A 2017-08-22 2017-08-22 Integrated optical system and process for creating the integrated optical system IT201700094953A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
IT102017000094953A IT201700094953A1 (en) 2017-08-22 2017-08-22 Integrated optical system and process for creating the integrated optical system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT102017000094953A IT201700094953A1 (en) 2017-08-22 2017-08-22 Integrated optical system and process for creating the integrated optical system

Publications (1)

Publication Number Publication Date
IT201700094953A1 true IT201700094953A1 (en) 2019-02-22

Family

ID=60628102

Family Applications (1)

Application Number Title Priority Date Filing Date
IT102017000094953A IT201700094953A1 (en) 2017-08-22 2017-08-22 Integrated optical system and process for creating the integrated optical system

Country Status (1)

Country Link
IT (1) IT201700094953A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040086011A1 (en) * 2002-10-30 2004-05-06 Photodigm, Inc. Planar and wafer level packaging of semiconductor lasers and photo detectors for transmitter optical sub-assemblies
US7535944B1 (en) * 2000-05-26 2009-05-19 Opticomp Corporation Photonic crystal/waveguide coupler for VCSELS and photodetectors
US20110158278A1 (en) * 2009-12-30 2011-06-30 Koch Brian R Hybrid silicon vertical cavity laser with in-plane coupling
EP2746828A1 (en) * 2012-12-19 2014-06-25 Caliopa NV Optical interposer
DE102013011581A1 (en) * 2013-07-04 2015-01-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Arrangement of a substrate with at least one optical waveguide and an optical coupling point and of an optoelectronic component and method for producing such an arrangement
US20170054269A1 (en) * 2015-08-21 2017-02-23 Oclaro Japan, Inc. Optical module
DE102016213412A1 (en) * 2016-07-22 2018-01-25 Robert Bosch Gmbh Integrated optical system and manufacturing process of the integrated optical system

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7535944B1 (en) * 2000-05-26 2009-05-19 Opticomp Corporation Photonic crystal/waveguide coupler for VCSELS and photodetectors
US20040086011A1 (en) * 2002-10-30 2004-05-06 Photodigm, Inc. Planar and wafer level packaging of semiconductor lasers and photo detectors for transmitter optical sub-assemblies
US20110158278A1 (en) * 2009-12-30 2011-06-30 Koch Brian R Hybrid silicon vertical cavity laser with in-plane coupling
EP2746828A1 (en) * 2012-12-19 2014-06-25 Caliopa NV Optical interposer
DE102013011581A1 (en) * 2013-07-04 2015-01-08 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Arrangement of a substrate with at least one optical waveguide and an optical coupling point and of an optoelectronic component and method for producing such an arrangement
US20170054269A1 (en) * 2015-08-21 2017-02-23 Oclaro Japan, Inc. Optical module
DE102016213412A1 (en) * 2016-07-22 2018-01-25 Robert Bosch Gmbh Integrated optical system and manufacturing process of the integrated optical system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HUIHUI LU ET AL: "Flip-chip integration of tilted VCSELs onto a silicon photonic integrated circuit", OPTICS EXPRESS, vol. 24, no. 15, 11 July 2016 (2016-07-11), pages 16258, XP055467223, DOI: 10.1364/OE.24.016258 *

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