IT1400619B1 - PRESSURE SENSOR - Google Patents

PRESSURE SENSOR

Info

Publication number
IT1400619B1
IT1400619B1 ITTO2010A000396A ITTO20100396A IT1400619B1 IT 1400619 B1 IT1400619 B1 IT 1400619B1 IT TO2010A000396 A ITTO2010A000396 A IT TO2010A000396A IT TO20100396 A ITTO20100396 A IT TO20100396A IT 1400619 B1 IT1400619 B1 IT 1400619B1
Authority
IT
Italy
Prior art keywords
pressure sensor
sensor
pressure
Prior art date
Application number
ITTO2010A000396A
Other languages
Italian (it)
Inventor
Massimo Monichino
Fabio Nebbia
Luca Salmaso
Original Assignee
Metallux Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metallux Sa filed Critical Metallux Sa
Priority to ITTO2010A000396A priority Critical patent/IT1400619B1/en
Priority to PCT/IB2011/052090 priority patent/WO2011141886A2/en
Publication of ITTO20100396A1 publication Critical patent/ITTO20100396A1/en
Application granted granted Critical
Publication of IT1400619B1 publication Critical patent/IT1400619B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
ITTO2010A000396A 2010-05-12 2010-05-12 PRESSURE SENSOR IT1400619B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITTO2010A000396A IT1400619B1 (en) 2010-05-12 2010-05-12 PRESSURE SENSOR
PCT/IB2011/052090 WO2011141886A2 (en) 2010-05-12 2011-05-12 Pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITTO2010A000396A IT1400619B1 (en) 2010-05-12 2010-05-12 PRESSURE SENSOR

Publications (2)

Publication Number Publication Date
ITTO20100396A1 ITTO20100396A1 (en) 2011-11-13
IT1400619B1 true IT1400619B1 (en) 2013-06-14

Family

ID=42983956

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO2010A000396A IT1400619B1 (en) 2010-05-12 2010-05-12 PRESSURE SENSOR

Country Status (2)

Country Link
IT (1) IT1400619B1 (en)
WO (1) WO2011141886A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3012596A1 (en) 2014-10-21 2016-04-27 wenglor fluid GmbH Measuring device for determining the flow speed of a medium in a conduit
CN106445226B (en) * 2016-08-29 2019-09-10 业成科技（成都）有限公司 Inexpensive pressure sensor production method and its structure
JP2018048964A (en) * 2016-09-23 2018-03-29 株式会社鷺宮製作所 Pressure sensor
FR3082054B1 (en) * 2018-05-30 2020-07-03 Commissariat A L'energie Atomique Et Aux Energies Alternatives METHOD FOR MANUFACTURING A PIEZOELECTRIC SENSOR AND PIEZOELECTRIC SENSOR OBTAINED BY SUCH A METHOD

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856367A (en) * 1981-09-29 1983-04-04 Hitachi Ltd Semiconductor pressure sensor
JPH0746065B2 (en) * 1985-03-25 1995-05-17 株式会社日本自動車部品総合研究所 High pressure detector
JPH0711461B2 (en) * 1986-06-13 1995-02-08 株式会社日本自動車部品総合研究所 Pressure detector
JPH08193897A (en) * 1995-01-19 1996-07-30 Mitsubishi Electric Corp Semiconductor pressure sensor

Also Published As

Publication number Publication date
ITTO20100396A1 (en) 2011-11-13
WO2011141886A2 (en) 2011-11-17
WO2011141886A3 (en) 2012-03-29

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