IT1399876B1 - METHOD AND EQUIPMENT FOR THE OPTICAL MEASUREMENT BY INTERFEROMETRY OF THE THICKNESS OF AN OBJECT - Google Patents

METHOD AND EQUIPMENT FOR THE OPTICAL MEASUREMENT BY INTERFEROMETRY OF THE THICKNESS OF AN OBJECT

Info

Publication number
IT1399876B1
IT1399876B1 ITBO2010A000318A ITBO20100318A IT1399876B1 IT 1399876 B1 IT1399876 B1 IT 1399876B1 IT BO2010A000318 A ITBO2010A000318 A IT BO2010A000318A IT BO20100318 A ITBO20100318 A IT BO20100318A IT 1399876 B1 IT1399876 B1 IT 1399876B1
Authority
IT
Italy
Prior art keywords
interferometry
thickness
equipment
optical measurement
measurement
Prior art date
Application number
ITBO2010A000318A
Other languages
Italian (it)
Inventor
Domenico Malpezzi
Dino Galletti
Original Assignee
Marposs Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to ITBO2010A000318A priority Critical patent/IT1399876B1/en
Application filed by Marposs Spa filed Critical Marposs Spa
Priority to EP11720461.0A priority patent/EP2571655B1/en
Priority to KR1020127032947A priority patent/KR101822976B1/en
Priority to ES11720461.0T priority patent/ES2473241T3/en
Priority to JP2013510601A priority patent/JP5960125B2/en
Priority to US13/643,518 priority patent/US9079283B2/en
Priority to SG2012078697A priority patent/SG185368A1/en
Priority to MYPI2012004885A priority patent/MY164183A/en
Priority to CN201180024726.3A priority patent/CN102892552B/en
Priority to PCT/EP2011/057987 priority patent/WO2011144624A1/en
Publication of ITBO20100318A1 publication Critical patent/ITBO20100318A1/en
Application granted granted Critical
Publication of IT1399876B1 publication Critical patent/IT1399876B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
ITBO2010A000318A 2010-05-18 2010-05-18 METHOD AND EQUIPMENT FOR THE OPTICAL MEASUREMENT BY INTERFEROMETRY OF THE THICKNESS OF AN OBJECT IT1399876B1 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
ITBO2010A000318A IT1399876B1 (en) 2010-05-18 2010-05-18 METHOD AND EQUIPMENT FOR THE OPTICAL MEASUREMENT BY INTERFEROMETRY OF THE THICKNESS OF AN OBJECT
KR1020127032947A KR101822976B1 (en) 2010-05-18 2011-05-17 Method and apparatus for optically measuring by interferometry the thickness of an object
ES11720461.0T ES2473241T3 (en) 2010-05-18 2011-05-17 Method and apparatus for optically measuring by interferometry the thickness of an object
JP2013510601A JP5960125B2 (en) 2010-05-18 2011-05-17 Method and apparatus for optically measuring the thickness of an object by interferometry
EP11720461.0A EP2571655B1 (en) 2010-05-18 2011-05-17 Method and apparatus for optically measuring by interferometry the thickness of an object
US13/643,518 US9079283B2 (en) 2010-05-18 2011-05-17 Method and apparatus for optically measuring by interferometry the thickness of an object
SG2012078697A SG185368A1 (en) 2010-05-18 2011-05-17 Method and apparatus for optically measuring by interferometry the thickness of an object
MYPI2012004885A MY164183A (en) 2010-05-18 2011-05-17 Method and apparatus for optically measuring by interferometry the thickness of an object
CN201180024726.3A CN102892552B (en) 2010-05-18 2011-05-17 By interfering method and apparatus object thickness being carried out to optical measurement
PCT/EP2011/057987 WO2011144624A1 (en) 2010-05-18 2011-05-17 Method and apparatus for optically measuring by interferometry the thickness of an object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITBO2010A000318A IT1399876B1 (en) 2010-05-18 2010-05-18 METHOD AND EQUIPMENT FOR THE OPTICAL MEASUREMENT BY INTERFEROMETRY OF THE THICKNESS OF AN OBJECT

Publications (2)

Publication Number Publication Date
ITBO20100318A1 ITBO20100318A1 (en) 2011-11-19
IT1399876B1 true IT1399876B1 (en) 2013-05-09

Family

ID=43384674

Family Applications (1)

Application Number Title Priority Date Filing Date
ITBO2010A000318A IT1399876B1 (en) 2010-05-18 2010-05-18 METHOD AND EQUIPMENT FOR THE OPTICAL MEASUREMENT BY INTERFEROMETRY OF THE THICKNESS OF AN OBJECT

Country Status (1)

Country Link
IT (1) IT1399876B1 (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6437868B1 (en) * 1999-10-28 2002-08-20 Agere Systems Guardian Corp. In-situ automated contactless thickness measurement for wafer thinning
JP4486217B2 (en) * 2000-05-01 2010-06-23 浜松ホトニクス株式会社 Thickness measuring apparatus, wet etching apparatus using the same, and wet etching method
WO2002010729A1 (en) * 2000-07-31 2002-02-07 Asml Us, Inc. In-situ method and apparatus for end point detection in chemical mechanical polishing
ITBO20070504A1 (en) * 2007-07-20 2009-01-21 Marposs Spa EQUIPMENT AND METHOD FOR THE CONTROL OF THE THICKNESS OF A PROCESSED ELEMENT

Also Published As

Publication number Publication date
ITBO20100318A1 (en) 2011-11-19

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