IT1267993B1 - Moduli di collaudo a diaframma espandibile e connettori. - Google Patents
Moduli di collaudo a diaframma espandibile e connettori.Info
- Publication number
- IT1267993B1 IT1267993B1 IT94TO000032A ITTO940032A IT1267993B1 IT 1267993 B1 IT1267993 B1 IT 1267993B1 IT 94TO000032 A IT94TO000032 A IT 94TO000032A IT TO940032 A ITTO940032 A IT TO940032A IT 1267993 B1 IT1267993 B1 IT 1267993B1
- Authority
- IT
- Italy
- Prior art keywords
- connectors
- test modules
- expandable diaphragm
- diaphragm test
- expandable
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
- H01R11/18—End pieces terminating in a probe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/16—Connectors or connections adapted for particular applications for telephony
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/009,133 US5389885A (en) | 1992-01-27 | 1993-01-26 | Expandable diaphragm test modules and connectors |
Publications (3)
Publication Number | Publication Date |
---|---|
ITTO940032A0 ITTO940032A0 (it) | 1994-01-24 |
ITTO940032A1 ITTO940032A1 (it) | 1995-07-24 |
IT1267993B1 true IT1267993B1 (it) | 1997-02-20 |
Family
ID=21735765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT94TO000032A IT1267993B1 (it) | 1993-01-26 | 1994-01-24 | Moduli di collaudo a diaframma espandibile e connettori. |
Country Status (6)
Country | Link |
---|---|
US (1) | US5389885A (it) |
JP (1) | JPH06265576A (it) |
DE (1) | DE4401469A1 (it) |
FR (1) | FR2700858B1 (it) |
GB (1) | GB2274748B (it) |
IT (1) | IT1267993B1 (it) |
Families Citing this family (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5656945A (en) * | 1993-05-12 | 1997-08-12 | Tribotech | Apparatus for testing a nonpackaged die |
US5633598A (en) * | 1993-06-23 | 1997-05-27 | Everett Charles Technologies, Inc. | Translator fixture with module for expanding test points |
JP3442137B2 (ja) * | 1993-12-17 | 2003-09-02 | 日本発条株式会社 | 導電性接触子ユニット |
US5625299A (en) * | 1995-02-03 | 1997-04-29 | Uhling; Thomas F. | Multiple lead analog voltage probe with high signal integrity over a wide band width |
US6232789B1 (en) * | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
US6166723A (en) * | 1995-11-17 | 2000-12-26 | Immersion Corporation | Mouse interface device providing force feedback |
US5764069A (en) * | 1995-10-30 | 1998-06-09 | International Faster Corporation | High density grid for testing circuit boards |
US5742174A (en) * | 1995-11-03 | 1998-04-21 | Probe Technology | Membrane for holding a probe tip in proper location |
US5869974A (en) * | 1996-04-01 | 1999-02-09 | Micron Technology, Inc. | Micromachined probe card having compliant contact members for testing semiconductor wafers |
US5914613A (en) * | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US5754410A (en) * | 1996-09-11 | 1998-05-19 | International Business Machines Corporation | Multi-chip module with accessible test pads |
US5886535A (en) * | 1996-11-08 | 1999-03-23 | W. L. Gore & Associates, Inc. | Wafer level burn-in base unit substrate and assembly |
US5966022A (en) * | 1996-11-08 | 1999-10-12 | W. L. Gore & Associates, Inc. | Wafer level burn-in system |
US5884395A (en) * | 1997-04-04 | 1999-03-23 | Probe Technology | Assembly structure for making integrated circuit chip probe cards |
US6204680B1 (en) | 1997-04-15 | 2001-03-20 | Delaware Capital Formation, Inc. | Test socket |
US6084421A (en) * | 1997-04-15 | 2000-07-04 | Delaware Capital Formation, Inc. | Test socket |
US6194908B1 (en) | 1997-06-26 | 2001-02-27 | Delaware Capital Formation, Inc. | Test fixture for testing backplanes or populated circuit boards |
US5945838A (en) * | 1997-06-26 | 1999-08-31 | Star Technology Group, Inc. | Apparatus for testing circuit boards |
US6025729A (en) * | 1997-09-11 | 2000-02-15 | Delaware Capital Formation, Inc. | Floating spring probe wireless test fixture |
CA2217591C (en) * | 1997-10-07 | 2003-07-29 | 700674 Ontario Limited, Doing Business As Carroll Associates | Wireless test fixture |
US6724203B1 (en) | 1997-10-30 | 2004-04-20 | International Business Machines Corporation | Full wafer test configuration using memory metals |
US6204674B1 (en) | 1997-10-31 | 2001-03-20 | Probe Technology, Inc. | Assembly structure for making integrated circuit chip probe cards |
US6335627B1 (en) * | 1998-04-13 | 2002-01-01 | Intel Corporation | Apparatus and method for testing an electronics package substrate |
US6256882B1 (en) * | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6578264B1 (en) * | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
US6259263B1 (en) | 1999-06-11 | 2001-07-10 | Micron Technology, Inc. | Compliant contactor for testing semiconductors |
FR2800557B1 (fr) | 1999-10-27 | 2002-05-31 | Sagem | Telephone mobile comportant un connecteur amovible entre son corps et son boitier de batterie |
US6838890B2 (en) * | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
US6690184B1 (en) | 2000-08-31 | 2004-02-10 | Micron Technology, Inc. | Air socket for testing integrated circuits |
DE20114544U1 (de) * | 2000-12-04 | 2002-02-21 | Cascade Microtech, Inc., Beaverton, Oreg. | Wafersonde |
AU2002327490A1 (en) | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
US7132839B2 (en) * | 2002-12-31 | 2006-11-07 | Intel Corporation | Ultra-short low-force vertical probe test head and method |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
WO2006017078A2 (en) * | 2004-07-07 | 2006-02-16 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
US20050044460A1 (en) * | 2003-08-22 | 2005-02-24 | Hoglund Timothy E. | Mapping test mux structure |
DE20317436U1 (de) * | 2003-11-10 | 2004-01-22 | Magcode Ag | Elektrische Verbindungsvorrichtung |
JP2007517231A (ja) | 2003-12-24 | 2007-06-28 | カスケード マイクロテック インコーポレイテッド | アクティブ・ウェハプローブ |
JP3791689B2 (ja) * | 2004-01-09 | 2006-06-28 | 日本電子材料株式会社 | プローブカード |
KR20070058522A (ko) | 2004-09-13 | 2007-06-08 | 캐스케이드 마이크로테크 인코포레이티드 | 양측 프루빙 구조 |
US7129730B2 (en) * | 2004-12-15 | 2006-10-31 | Chipmos Technologies (Bermuda) Ltd. | Probe card assembly |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
JP4556698B2 (ja) * | 2005-02-14 | 2010-10-06 | ソニー株式会社 | プローブピンユニット |
DE602005005184T2 (de) * | 2005-06-29 | 2008-06-26 | Swissqual License Ag | Gerät und Verfahren zur Qualitätsprüfung eines batteriebetriebenen Mobiltelefons |
US7764072B2 (en) * | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7403028B2 (en) * | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7723999B2 (en) * | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
US7944710B2 (en) * | 2007-10-05 | 2011-05-17 | Battery-Biz Inc. | Termination apparatus and method for planar components on printed circuit boards |
US7888957B2 (en) * | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
US8410806B2 (en) * | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US8907694B2 (en) * | 2009-12-17 | 2014-12-09 | Xcerra Corporation | Wiring board for testing loaded printed circuit board |
US20170023643A1 (en) * | 2015-07-20 | 2017-01-26 | Qualcomm Incorporated | Handler based automated testing of integrated circuits in an electronic device |
US10514391B2 (en) * | 2016-08-22 | 2019-12-24 | Kla-Tencor Corporation | Resistivity probe having movable needle bodies |
IT201700017061A1 (it) * | 2017-02-15 | 2018-08-15 | Technoprobe Spa | Scheda di misura perfezionata per applicazioni ad alta frequenza |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3016489A (en) * | 1959-07-17 | 1962-01-09 | Drexel Dynamics Corp | Test jig for contacting circuit card positions |
US3714572A (en) * | 1970-08-21 | 1973-01-30 | Rca Corp | Alignment and test fixture apparatus |
GB1508884A (en) * | 1975-05-17 | 1978-04-26 | Int Computers Ltd | Apparatus for testing printed circuit board assemblies |
US4115735A (en) * | 1976-10-14 | 1978-09-19 | Faultfinders, Inc. | Test fixture employing plural platens for advancing some or all of the probes of the test fixture |
US4138186A (en) * | 1977-07-22 | 1979-02-06 | Everett/Charles, Inc. | Test apparatus |
US4232928A (en) * | 1979-06-27 | 1980-11-11 | Dit-Mco International Corporation | Apparatus employing flexible diaphragm for effecting substantially uniform force, individual couplings with multiple electrical contacts or the like |
US4340858A (en) * | 1979-08-13 | 1982-07-20 | Philip M. Hinderstein | Test fixture |
FR2465231A1 (fr) * | 1979-09-06 | 1981-03-20 | Thomson Csf | Tete de mesure de microcircuits, et appareil de mesure comportant une telle tete |
US4476433A (en) * | 1982-09-07 | 1984-10-09 | Logan John K | Electronic test fixture |
US5049813A (en) * | 1987-04-17 | 1991-09-17 | Everett/Charles Contact Products, Inc. | Testing of integrated circuit devices on loaded printed circuit boards |
DE3887599T2 (de) * | 1987-08-31 | 1994-05-11 | Everett Charles Contact Prod | Prüfen von integrierten Schaltungen auf einer bestückten Leiterplatte. |
US4963821A (en) * | 1989-04-14 | 1990-10-16 | Tektronix, Inc. | Probe and method for testing a populated circuit board |
US4950981A (en) * | 1989-04-14 | 1990-08-21 | Tektronix, Inc. | Apparatus for testing a circuit board |
US5055778A (en) * | 1989-10-02 | 1991-10-08 | Nihon Denshizairyo Kabushiki Kaisha | Probe card in which contact pressure and relative position of each probe end are correctly maintained |
US4968931A (en) * | 1989-11-03 | 1990-11-06 | Motorola, Inc. | Apparatus and method for burning in integrated circuit wafers |
US5252916A (en) * | 1992-01-27 | 1993-10-12 | Everett Charles Technologies, Inc. | Pneumatic test fixture with springless test probes |
-
1993
- 1993-01-26 US US08/009,133 patent/US5389885A/en not_active Expired - Fee Related
-
1994
- 1994-01-13 GB GB9400699A patent/GB2274748B/en not_active Expired - Fee Related
- 1994-01-19 DE DE4401469A patent/DE4401469A1/de not_active Withdrawn
- 1994-01-24 IT IT94TO000032A patent/IT1267993B1/it active IP Right Grant
- 1994-01-25 JP JP6006642A patent/JPH06265576A/ja active Pending
- 1994-01-25 FR FR9400788A patent/FR2700858B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2274748A (en) | 1994-08-03 |
DE4401469A1 (de) | 1994-07-28 |
JPH06265576A (ja) | 1994-09-22 |
ITTO940032A1 (it) | 1995-07-24 |
FR2700858B1 (fr) | 1997-01-24 |
FR2700858A1 (fr) | 1994-07-29 |
ITTO940032A0 (it) | 1994-01-24 |
GB9400699D0 (en) | 1994-03-09 |
US5389885A (en) | 1995-02-14 |
GB2274748B (en) | 1997-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19990128 |