IT1261666B - Pannello di cablaggio a microstrip e procedimento per la sua fabbricazione - Google Patents

Pannello di cablaggio a microstrip e procedimento per la sua fabbricazione

Info

Publication number
IT1261666B
IT1261666B ITRM930079A IT1261666B IT 1261666 B IT1261666 B IT 1261666B IT RM930079 A ITRM930079 A IT RM930079A IT 1261666 B IT1261666 B IT 1261666B
Authority
IT
Italy
Prior art keywords
board
dielectric material
metal layers
printed wiring
multilayered printed
Prior art date
Application number
Other languages
English (en)
Italian (it)
Original Assignee
Honeywell Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Inc filed Critical Honeywell Inc
Priority to ITRM930079 priority Critical patent/IT1261666B/it
Publication of ITRM930079A0 publication Critical patent/ITRM930079A0/it
Publication of ITRM930079A1 publication Critical patent/ITRM930079A1/it
Application granted granted Critical
Publication of IT1261666B publication Critical patent/IT1261666B/it

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguides (AREA)
  • Waveguide Aerials (AREA)
ITRM930079 1993-02-11 1993-02-11 Pannello di cablaggio a microstrip e procedimento per la sua fabbricazione IT1261666B (it)

Priority Applications (1)

Application Number Priority Date Filing Date Title
ITRM930079 IT1261666B (it) 1993-02-11 1993-02-11 Pannello di cablaggio a microstrip e procedimento per la sua fabbricazione

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITRM930079 IT1261666B (it) 1993-02-11 1993-02-11 Pannello di cablaggio a microstrip e procedimento per la sua fabbricazione

Publications (3)

Publication Number Publication Date
ITRM930079A0 ITRM930079A0 (enExample) 1993-02-11
ITRM930079A1 ITRM930079A1 (it) 1994-08-11
IT1261666B true IT1261666B (it) 1996-05-29

Family

ID=11401483

Family Applications (1)

Application Number Title Priority Date Filing Date
ITRM930079 IT1261666B (it) 1993-02-11 1993-02-11 Pannello di cablaggio a microstrip e procedimento per la sua fabbricazione

Country Status (1)

Country Link
IT (1) IT1261666B (enExample)

Also Published As

Publication number Publication date
ITRM930079A1 (it) 1994-08-11
ITRM930079A0 (enExample) 1993-02-11

Similar Documents

Publication Publication Date Title
US4755911A (en) Multilayer printed circuit board
TW330370B (en) Printed circuit board with embedded decoupling capacitance and manufacturing method thereof
EP0398721A3 (en) Thin copper foil for printed wiring board and method of manufacturing same
EP0167344A3 (en) Multilayer interconnect circuitry using photoimageable dielectric
KR970700988A (ko) 다층 프린트 배선판 및 그 제조방법(multilayer printed wiring board and process for producing the same)
TW236070B (enExample)
CA2125994A1 (en) Field Control and Stability Enhancement in Multi-Layer 3-Dimensional Structures
DE3072112D1 (en) Hollow multilayer printed wiring board, and method of fabricating same
EP1699279B8 (en) Multilayer printed wiring board and method for producing the same
EP0621746A3 (en) Composite circuit board and process for its manufacture.
EP0957664A4 (enExample)
EP0460856A3 (en) Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same
AU1039695A (en) Flexible multilayer printed circuit boards and methods of manufacture
EP0389865A3 (en) Multi-layer printed circuit board
EP0282625A3 (en) Method for producing rigid-type multilayer printed wiring board
AU5156285A (en) High density multilayer printed circuit board
DE69009815D1 (de) Mehrschichtkondensator für die Oberflächenmontagetechnik sowie gedruckte Schaltung mit solchen Mehrschichtkondensatoren.
EP0331429A3 (en) A laminated printed circuit board and process for its manufacture
DE69406390D1 (de) Laminat und mehrschichtige leiterplatte
DE69300615D1 (de) Mehrschichtige Leiterplatte und Herstellungsverfahren.
MY116494A (en) Copper foils and high-density multilayer printed circuit board using the copper foils for inner-layer circuit
EP1278407A4 (en) USE OF A LAMINATE WITH INTERNAL GUIDEBASE FOR PCB FOR HIGH FREQUENCY APPLICATIONS, AND METHOD AND ARRANGEMENT FOR IMPEDANCE MEASUREMENT THEREOF
FI973786A7 (fi) Dielektrinen materiaali, jolla on alhainen lämpötilakerroin ja korkea kuormittamaton laatu, menetelmä tämän valmistamiseksi sekä yksikerros-/kaksikerrospiirilevy johon se sisältyy
EP0782376A3 (en) Polyimide-metal foil composite film
EP0570094A3 (en) Method for forming a multilayer printed circuit board and product.

Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19980225