IT1227363B - COMPOSITION OF EPOXY RESIN AND PROCESSES FOR THE PRODUCTION OF PRE-IMPREGNATED MATERIALS AND A LAMINATED SLAB. - Google Patents

COMPOSITION OF EPOXY RESIN AND PROCESSES FOR THE PRODUCTION OF PRE-IMPREGNATED MATERIALS AND A LAMINATED SLAB.

Info

Publication number
IT1227363B
IT1227363B IT8822656A IT2265688A IT1227363B IT 1227363 B IT1227363 B IT 1227363B IT 8822656 A IT8822656 A IT 8822656A IT 2265688 A IT2265688 A IT 2265688A IT 1227363 B IT1227363 B IT 1227363B
Authority
IT
Italy
Prior art keywords
processes
composition
production
epoxy resin
laminated slab
Prior art date
Application number
IT8822656A
Other languages
Italian (it)
Other versions
IT8822656A0 (en
Inventor
Shunji Ehara
Masakazu Yoshizawa
Mitsuru Yamamoto
Original Assignee
Dainippon Ink & Chemicals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink & Chemicals filed Critical Dainippon Ink & Chemicals
Publication of IT8822656A0 publication Critical patent/IT8822656A0/en
Application granted granted Critical
Publication of IT1227363B publication Critical patent/IT1227363B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
IT8822656A 1987-11-19 1988-11-18 COMPOSITION OF EPOXY RESIN AND PROCESSES FOR THE PRODUCTION OF PRE-IMPREGNATED MATERIALS AND A LAMINATED SLAB. IT1227363B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29067187 1987-11-19

Publications (2)

Publication Number Publication Date
IT8822656A0 IT8822656A0 (en) 1988-11-18
IT1227363B true IT1227363B (en) 1991-04-08

Family

ID=17758988

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8822656A IT1227363B (en) 1987-11-19 1988-11-18 COMPOSITION OF EPOXY RESIN AND PROCESSES FOR THE PRODUCTION OF PRE-IMPREGNATED MATERIALS AND A LAMINATED SLAB.

Country Status (2)

Country Link
DE (1) DE3839105A1 (en)
IT (1) IT1227363B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0935628B1 (en) 1996-10-29 2001-12-05 Isola Laminate Systems Corporation Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent
US8313836B2 (en) * 1996-10-29 2012-11-20 Isola Usa Corp. Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent
WO2000076764A1 (en) * 1999-06-10 2000-12-21 Isola Laminate Systems Corp. Epoxy resin, styrene-maleic anhydride copolymer and flexibilizer
KR101398731B1 (en) * 2006-09-29 2014-05-27 히타치가세이가부시끼가이샤 Thermosetting resin composition and prepreg and laminate obtained with the same

Also Published As

Publication number Publication date
DE3839105A1 (en) 1989-06-01
IT8822656A0 (en) 1988-11-18

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