IT1177785B - COMPOSITION OF ELECTROLYTE AND PROCEDURE FOR COPPER ELECTRODEPOSITION - Google Patents

COMPOSITION OF ELECTROLYTE AND PROCEDURE FOR COPPER ELECTRODEPOSITION

Info

Publication number
IT1177785B
IT1177785B IT48351/84A IT4835184A IT1177785B IT 1177785 B IT1177785 B IT 1177785B IT 48351/84 A IT48351/84 A IT 48351/84A IT 4835184 A IT4835184 A IT 4835184A IT 1177785 B IT1177785 B IT 1177785B
Authority
IT
Italy
Prior art keywords
electrolyte
procedure
composition
copper electrodeposition
electrodeposition
Prior art date
Application number
IT48351/84A
Other languages
Italian (it)
Other versions
IT8448351A0 (en
Inventor
Daniel J Combs
Original Assignee
Omi Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omi Int Corp filed Critical Omi Int Corp
Publication of IT8448351A0 publication Critical patent/IT8448351A0/en
Application granted granted Critical
Publication of IT1177785B publication Critical patent/IT1177785B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Chemically Coating (AREA)
IT48351/84A 1983-06-10 1984-06-08 COMPOSITION OF ELECTROLYTE AND PROCEDURE FOR COPPER ELECTRODEPOSITION IT1177785B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50121183A 1983-06-10 1983-06-10

Publications (2)

Publication Number Publication Date
IT8448351A0 IT8448351A0 (en) 1984-06-08
IT1177785B true IT1177785B (en) 1987-08-26

Family

ID=23992559

Family Applications (1)

Application Number Title Priority Date Filing Date
IT48351/84A IT1177785B (en) 1983-06-10 1984-06-08 COMPOSITION OF ELECTROLYTE AND PROCEDURE FOR COPPER ELECTRODEPOSITION

Country Status (10)

Country Link
JP (1) JPS6013090A (en)
AU (1) AU554236B2 (en)
BR (1) BR8402811A (en)
CA (1) CA1255621A (en)
DE (1) DE3420999A1 (en)
ES (1) ES533252A0 (en)
FR (1) FR2547318B1 (en)
GB (1) GB2141140B (en)
IT (1) IT1177785B (en)
NL (1) NL8401841A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4126502C1 (en) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
JPH10330983A (en) * 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd Electrolytic copper foil and its production
DE19758121C2 (en) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Aqueous bath and method for electrolytic deposition of copper layers
DE10261852B3 (en) * 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
DE10337669B4 (en) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Aqueous, acid solution and process for the electrodeposition of copper coatings and use of the solution
JP4644447B2 (en) * 2004-06-25 2011-03-02 株式会社日立製作所 Method for manufacturing printed wiring board
GB0520793D0 (en) * 2005-10-13 2005-11-23 Avecia Inkjet Ltd Phthalocyanine inks and their use in ink-jet printing

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE520210A (en) * 1952-05-26
NL83873C (en) * 1952-05-26
US2738318A (en) * 1954-12-28 1956-03-13 Udylite Res Corp Electrodeposition of copper from an acid bath
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (en) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
IT1046971B (en) * 1975-03-11 1980-09-10 Oxy Metal Industries Corp Baths for electrodeposition of copper - contg soluble prod prepd by reacting alkoxylated polyalkylene-imine with alkylating agent
DE2746938C2 (en) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Aqueous acid bath for the galvanic deposition of shiny and crack-free copper coatings and use of this bath
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
CA1255621A (en) 1989-06-13
JPS6013090A (en) 1985-01-23
FR2547318A1 (en) 1984-12-14
GB2141140B (en) 1986-12-10
BR8402811A (en) 1985-05-21
GB2141140A (en) 1984-12-12
JPS6112036B2 (en) 1986-04-05
GB8414862D0 (en) 1984-07-18
IT8448351A0 (en) 1984-06-08
AU2903384A (en) 1984-12-13
ES8601336A1 (en) 1985-10-16
DE3420999A1 (en) 1984-12-13
DE3420999C2 (en) 1987-10-15
AU554236B2 (en) 1986-08-14
FR2547318B1 (en) 1990-05-04
NL8401841A (en) 1985-01-02
ES533252A0 (en) 1985-10-16

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