IT1084491B - BASIC MATERIAL FOR PRINTED CIRCUITS. - Google Patents
BASIC MATERIAL FOR PRINTED CIRCUITS.Info
- Publication number
- IT1084491B IT1084491B IT23227/77A IT2322777A IT1084491B IT 1084491 B IT1084491 B IT 1084491B IT 23227/77 A IT23227/77 A IT 23227/77A IT 2322777 A IT2322777 A IT 2322777A IT 1084491 B IT1084491 B IT 1084491B
- Authority
- IT
- Italy
- Prior art keywords
- basic material
- printed circuits
- printed
- circuits
- basic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19762619970 DE2619970A1 (en) | 1976-05-06 | 1976-05-06 | BASIC MATERIAL FOR PRINTED CIRCUITS |
Publications (1)
Publication Number | Publication Date |
---|---|
IT1084491B true IT1084491B (en) | 1985-05-25 |
Family
ID=5977178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT23227/77A IT1084491B (en) | 1976-05-06 | 1977-05-05 | BASIC MATERIAL FOR PRINTED CIRCUITS. |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE2619970A1 (en) |
GB (1) | GB1586275A (en) |
IT (1) | IT1084491B (en) |
SE (1) | SE7705151L (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2172436B (en) * | 1985-03-16 | 1989-06-21 | Marconi Electronic Devices | Electrical circuit |
DE69635600T2 (en) * | 1995-03-09 | 2006-09-14 | Sankei Giken Kogyo K.K. | Resin composition for electroless metal deposition and electroless metal deposition process |
-
1976
- 1976-05-06 DE DE19762619970 patent/DE2619970A1/en not_active Withdrawn
-
1977
- 1977-05-03 SE SE7705151A patent/SE7705151L/en unknown
- 1977-05-05 IT IT23227/77A patent/IT1084491B/en active
- 1977-05-06 GB GB19125/77A patent/GB1586275A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2619970A1 (en) | 1977-11-17 |
SE7705151L (en) | 1977-11-07 |
GB1586275A (en) | 1981-03-18 |
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