IT1035284B - Gruppo elettronico e procedimento per fornire un collegamen to isolante in esso - Google Patents
Gruppo elettronico e procedimento per fornire un collegamen to isolante in essoInfo
- Publication number
- IT1035284B IT1035284B IT4906475A IT4906475A IT1035284B IT 1035284 B IT1035284 B IT 1035284B IT 4906475 A IT4906475 A IT 4906475A IT 4906475 A IT4906475 A IT 4906475A IT 1035284 B IT1035284 B IT 1035284B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- providing
- insulating connection
- electronic group
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1645174 | 1974-04-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
IT1035284B true IT1035284B (it) | 1979-10-20 |
Family
ID=10077563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT4906475A IT1035284B (it) | 1974-04-16 | 1975-04-14 | Gruppo elettronico e procedimento per fornire un collegamen to isolante in esso |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS50140065A (it) |
DE (1) | DE2516006A1 (it) |
FR (1) | FR2268431A1 (it) |
IT (1) | IT1035284B (it) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4564801A (en) * | 1983-08-22 | 1986-01-14 | Lutron Electronics Co., Inc. | Semiconductor mounted on a yoke in heat transfer relationship |
US4721155A (en) * | 1986-05-07 | 1988-01-26 | United Technologies Corporation | Sawtooth card retainer |
US4796157A (en) * | 1988-01-04 | 1989-01-03 | Motorola, Inc. | Substrate mounting assembly |
DE102011121823A1 (de) | 2011-12-21 | 2013-07-11 | Wabco Gmbh | Elektronikeinheit mit einem zweiteiligen Gehäuse |
-
1975
- 1975-04-12 DE DE19752516006 patent/DE2516006A1/de active Pending
- 1975-04-14 IT IT4906475A patent/IT1035284B/it active
- 1975-04-15 FR FR7512271A patent/FR2268431A1/fr not_active Withdrawn
- 1975-04-16 JP JP4536575A patent/JPS50140065A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
FR2268431A1 (en) | 1975-11-14 |
JPS50140065A (it) | 1975-11-10 |
DE2516006A1 (de) | 1975-11-06 |
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