IN2014MN01627A - - Google Patents

Info

Publication number
IN2014MN01627A
IN2014MN01627A IN1627MUN2014A IN2014MN01627A IN 2014MN01627 A IN2014MN01627 A IN 2014MN01627A IN 1627MUN2014 A IN1627MUN2014 A IN 1627MUN2014A IN 2014MN01627 A IN2014MN01627 A IN 2014MN01627A
Authority
IN
India
Prior art keywords
stainless steel
plate
engrave
acid liquid
guiding device
Prior art date
Application number
Inventor
Franck Dupuy
Joël Harmand
Inocencio Marcos
François Lapeyre
Original Assignee
Diller Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Diller Corp filed Critical Diller Corp
Publication of IN2014MN01627A publication Critical patent/IN2014MN01627A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/28—Acidic compositions for etching iron group metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Chemical engraving machine to engrave a plate of stainless steel (8) moved along an horizontal direction (X) said machine comprising a base (10) an acid liquid circuit (5) adapted to chemically attack said plate of stainless steel at locations where it is not protected by a protection mask (7) a lower guiding device (1) an upper guiding device (2) the lower and upper guiding devices (1 2) being configured to maintain said plate of stainless steel substantially vertically a nozzle support (3) bearing a plurality of spraying nozzles (4) projecting horizontally the acid liquid toward the plate of stainless steel (8). Method to chemically engrave a plate of stainless steel in a vertical position.
IN1627MUN2014 2012-02-10 2012-02-10 IN2014MN01627A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2012/000361 WO2013117951A1 (en) 2012-02-10 2012-02-10 Machine and method to chemically engrave a plate of stainless steel

Publications (1)

Publication Number Publication Date
IN2014MN01627A true IN2014MN01627A (en) 2015-05-08

Family

ID=45841541

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1627MUN2014 IN2014MN01627A (en) 2012-02-10 2012-02-10

Country Status (7)

Country Link
US (1) US10030309B2 (en)
EP (1) EP2812463B1 (en)
CN (1) CN104321465B (en)
AU (1) AU2012369067B2 (en)
CA (1) CA2864028C (en)
IN (1) IN2014MN01627A (en)
WO (1) WO2013117951A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103774147B (en) * 2013-12-30 2017-02-22 天津市德中技术发展有限公司 Etching method and etching device with nozzle group reciprocating in etching region
CN114150316B (en) * 2021-08-31 2024-05-07 东莞市琢器机械设备科技有限公司 Precise etching module, precise etching device and etching process of precise etching device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2762149A (en) 1953-04-27 1956-09-11 Buckbee Mears Co Method and apparatus for producing perforated metal webs
US2822635A (en) * 1954-10-01 1958-02-11 Norman B Mears Apparatus and method for etching metal webs
US2969300A (en) * 1956-03-29 1961-01-24 Bell Telephone Labor Inc Process for making printed circuits
US3415699A (en) * 1965-03-29 1968-12-10 Buckbee Mears Co Production of etched patterns in a continuously moving metal strip
US3795561A (en) * 1972-07-24 1974-03-05 Buckbee Mears Co Vertical etchers for minute parts
DE2338827A1 (en) * 1973-07-31 1975-03-06 Siemens Ag RUNNING MACHINE
US4620894A (en) * 1985-03-11 1986-11-04 Advanced Systems Incorporated Apparatus for processing circuit board substrate
DE3521135A1 (en) * 1985-06-13 1986-12-18 Walter 6983 Kreuzwertheim Lemmen Spraying apparatus
DE59407101D1 (en) * 1993-05-12 1998-11-19 Ciba Geigy Ag METHOD AND DEVICE FOR COATING PCBS
US6378199B1 (en) * 1994-05-13 2002-04-30 Dai Nippon Printing Co., Ltd. Multi-layer printed-wiring board process for producing
US7029597B2 (en) * 2001-01-23 2006-04-18 Lorin Industries, Inc. Anodized aluminum etching process and related apparatus
US6726848B2 (en) * 2001-12-07 2004-04-27 Scp Global Technologies, Inc. Apparatus and method for single substrate processing
US20050006205A1 (en) * 2003-07-07 2005-01-13 Kuo Ming Hong Transporting device for a vertical-type thin circuit board etching machine
JP2005211717A (en) * 2004-01-27 2005-08-11 Shinko Electric Ind Co Ltd Substrate processing apparatus
DE102006022722B4 (en) 2006-05-12 2010-06-17 Hueck Engraving Gmbh & Co. Kg Method and device for surface structuring of a press plate or an endless belt
JP2008013389A (en) * 2006-07-04 2008-01-24 Nec Corp Etching device and method for manufacturing thin type glass substrate
KR101387711B1 (en) * 2007-04-10 2014-04-23 에프엔에스테크 주식회사 Glass substrate etching apparatus of flat panel display
KR20090008945A (en) * 2007-07-19 2009-01-22 삼성전자주식회사 Etching apparatus for substrate
CN201347410Y (en) * 2009-02-09 2009-11-18 新鋐源科技股份有限公司 Upright type etching mechanism

Also Published As

Publication number Publication date
CA2864028A1 (en) 2013-08-15
AU2012369067B2 (en) 2017-02-16
CN104321465B (en) 2017-05-03
WO2013117951A1 (en) 2013-08-15
CN104321465A (en) 2015-01-28
EP2812463B1 (en) 2016-04-13
EP2812463A1 (en) 2014-12-17
US10030309B2 (en) 2018-07-24
CA2864028C (en) 2019-01-08
US20150053646A1 (en) 2015-02-26
AU2012369067A1 (en) 2014-08-28

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