IN2014DN05918A - - Google Patents

Info

Publication number
IN2014DN05918A
IN2014DN05918A IN5918DEN2014A IN2014DN05918A IN 2014DN05918 A IN2014DN05918 A IN 2014DN05918A IN 5918DEN2014 A IN5918DEN2014 A IN 5918DEN2014A IN 2014DN05918 A IN2014DN05918 A IN 2014DN05918A
Authority
IN
India
Prior art keywords
polymer composition
conductive polymer
semi
copolymer
cable
Prior art date
Application number
Inventor
Muhammad Ali Malik
Christer Svanberg
Thomas Gkourmpis
Takashi Uematsu
Roger Carlsson
Niklas Thorn
Jenny Ann ÖSTLUND
Original Assignee
Borealis Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47678686&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IN2014DN05918(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Borealis Ag filed Critical Borealis Ag
Publication of IN2014DN05918A publication Critical patent/IN2014DN05918A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B9/00—Power cables
    • H01B9/02—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients
    • H01B9/027—Power cables with screens or conductive layers, e.g. for avoiding large potential gradients composed of semi-conducting layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0853—Vinylacetate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869—Acids or derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C08L23/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/10—Homopolymers or copolymers of propene
    • C08L23/14—Copolymers of propene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
    • H01B13/24—Sheathing; Armouring; Screening; Applying other protective layers by extrusion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/202—Applications use in electrical or conductive gadgets use in electrical wires or wirecoating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2207/00—Properties characterising the ingredient of the composition
    • C08L2207/10—Peculiar tacticity
    • C08L2207/14—Amorphous or atactic polypropylene
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core

Abstract

The present invention relates to a semi conductive polymer composition the present invention provides a semi conductive polymer composition comprising an ethylene copolymer comprising polar co monomer units; an olefin homo or copolymer; and a conductive filler; wherein the olefin homo or copolymer has a degree of crystallinity below 20%. The invention also relates to a wire or cable comprising said semi conductive polymer composition and to the use of said composition for the production of a layer preferably a semi conducting shield layer of a wire or cable.
IN5918DEN2014 2012-02-16 2013-01-31 IN2014DN05918A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP12001032 2012-02-16
PCT/EP2013/000283 WO2013120582A1 (en) 2012-02-16 2013-01-31 Semi-conductive polymer composition

Publications (1)

Publication Number Publication Date
IN2014DN05918A true IN2014DN05918A (en) 2015-06-05

Family

ID=47678686

Family Applications (1)

Application Number Title Priority Date Filing Date
IN5918DEN2014 IN2014DN05918A (en) 2012-02-16 2013-01-31

Country Status (8)

Country Link
US (1) US11688529B2 (en)
EP (1) EP2814883B2 (en)
KR (1) KR101653210B1 (en)
CN (1) CN104080853B (en)
BR (1) BR112014020269A8 (en)
EA (1) EA026888B9 (en)
IN (1) IN2014DN05918A (en)
WO (1) WO2013120582A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3029003B1 (en) * 2014-11-26 2018-06-29 Nexans ELECTRICAL DEVICE WITH MEDIUM OR HIGH VOLTAGE
CA2971145C (en) 2014-12-17 2021-06-08 Prysmian S.P.A. Energy cable having a cold-strippable semiconductive layer
WO2018000314A1 (en) 2016-06-30 2018-01-04 Dow Global Technologies Llc Semiconductive shield free of weld lines and protrusions
RU2645939C2 (en) * 2016-07-06 2018-03-01 Открытое акционерное общество Всероссийский научно-исследовательский, проектно-конструкторский и технологический институт кабельной промышленности (ВНИИ КП) Polymer composition
WO2018119619A1 (en) * 2016-12-27 2018-07-05 辛范范 Shielding material for cable
US10975469B2 (en) 2017-03-17 2021-04-13 Applied Materials, Inc. Plasma resistant coating of porous body by atomic layer deposition
KR101880534B1 (en) * 2017-08-02 2018-07-23 주식회사 디와이엠 솔루션 Composition for Semi-conductive Layer of Power Cable
US10626260B2 (en) * 2017-08-04 2020-04-21 Dym Solution Co., Ltd. Semiconductive composition for cable
TW201942234A (en) * 2018-03-28 2019-11-01 美商陶氏全球科技有限責任公司 Composite of non-polar organic polymer, polar organic polymer, and ultra-low-wettability carbon black
KR102425313B1 (en) * 2020-10-23 2022-07-27 (주)티에스씨 Communication cable composition, isulation cable and communication cable by coated thereof
WO2022175351A1 (en) * 2021-02-18 2022-08-25 Borealis Ag Upgraded polyolefin for electrical components
KR20220120155A (en) * 2021-02-23 2022-08-30 한화솔루션 주식회사 Semiconductive resin composition for ultra-high voltage cable with excellent processability and method for manufacturing the same
KR20230155640A (en) * 2022-05-03 2023-11-13 한화솔루션 주식회사 Semiconducting compound composition and manufacturing method thereof

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3770531A (en) * 1972-05-04 1973-11-06 Bell Telephone Labor Inc Bonding substance for the fabrication of integrated circuits
US3951871A (en) * 1974-05-16 1976-04-20 Union Carbide Corporation Deformation resistant shielding composition
JPS57158906A (en) * 1981-03-25 1982-09-30 Mitsubishi Petrochemical Co Semiconductive resin composition
EP0129617B1 (en) 1983-06-13 1988-02-03 Du Pont-Mitsui Polychemicals Co., Ltd. Semiconducting compositions and wires and cables using the same
JPH06116362A (en) 1992-10-02 1994-04-26 Nippon Petrochem Co Ltd Semiconducting resin composition
US5889117A (en) 1995-03-20 1999-03-30 Bicc Cables Corporation Polymeric compositions for power cables
JP3551755B2 (en) 1998-04-03 2004-08-11 日立電線株式会社 Easily peelable semiconductive resin composition and electric wire / cable
US6455771B1 (en) 2001-03-08 2002-09-24 Union Carbide Chemicals & Plastics Technology Corporation Semiconducting shield compositions
MXPA06003343A (en) 2003-09-25 2006-06-08 Dow Global Technologies Inc Strippable semiconductive shield and compositions therefor.
ATE501514T1 (en) * 2007-09-12 2011-03-15 Borealis Tech Oy CABLE WITH REDUCED PROPORTION OF VOLATILE CONNECTIONS
DE602008005863D1 (en) * 2008-05-27 2011-05-12 Borealis Ag A peelable semiconductive composition comprising low melting polyolefins
EP2128195A1 (en) * 2008-05-27 2009-12-02 Borealis AG Strippable semiconductive composition comprising low melt temperature polyolefin
FR2937041B1 (en) 2008-10-09 2012-07-20 Arkema France SEMICONDUCTOR COMPOSITION FOR ELECTRIC CABLES
EP2365010B1 (en) 2010-03-01 2013-01-23 Borealis AG Semiconductive polymer composition comprising polar copolymer
US10308794B2 (en) * 2010-06-10 2019-06-04 Borealis Ag Copolymer composition for semiconductive cable layer

Also Published As

Publication number Publication date
EA026888B9 (en) 2017-07-31
CN104080853A (en) 2014-10-01
KR20140112063A (en) 2014-09-22
US20150004411A1 (en) 2015-01-01
CN104080853B (en) 2017-04-26
KR101653210B1 (en) 2016-09-01
EA201491389A1 (en) 2015-01-30
EP2814883B1 (en) 2016-07-27
BR112014020269A2 (en) 2017-06-20
BR112014020269A8 (en) 2017-07-11
EA026888B1 (en) 2017-05-31
US11688529B2 (en) 2023-06-27
EP2814883A1 (en) 2014-12-24
EP2814883B2 (en) 2019-05-15
WO2013120582A1 (en) 2013-08-22

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