IN2014DE01155A - - Google Patents
Info
- Publication number
- IN2014DE01155A IN2014DE01155A IN1155DE2014A IN2014DE01155A IN 2014DE01155 A IN2014DE01155 A IN 2014DE01155A IN 1155DE2014 A IN1155DE2014 A IN 1155DE2014A IN 2014DE01155 A IN2014DE01155 A IN 2014DE01155A
- Authority
- IN
- India
- Prior art keywords
- electronic component
- resin
- sealing member
- manufacturing
- foamed
- Prior art date
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
ABSTRACT An electronic component unit 1 includin g an electronic component 2 and a resin sealing member 3 coating the electronic component 2 is provided. The resin sealing member 3 is made of a foamed resin that is produced by foaming a thermosetting resin. With respect to a distribution of a long diameter size of connection holes 301, 302, 303, 304 connecting between foamed cells of the foamed resin, an average value a µm and a standard deviation o µm of the long diameter size satisfy a relationship of a+3o = 500. Furthermore, a manufacturing method of the electronic component unit 1 is provided. The manufacturing method includes a raw material liquid preparation process, a mixing process, and a coat foam process.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013109840 | 2013-05-24 | ||
JP2014078456A JP6323129B2 (en) | 2013-05-24 | 2014-04-07 | Electronic component unit and manufacturing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2014DE01155A true IN2014DE01155A (en) | 2015-06-05 |
Family
ID=52301353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN1155DE2014 IN2014DE01155A (en) | 2013-05-24 | 2014-04-29 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6323129B2 (en) |
BR (1) | BR102014012560A2 (en) |
IN (1) | IN2014DE01155A (en) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001352156A (en) * | 2000-06-07 | 2001-12-21 | Asahi Rubber:Kk | Formed polyurethane for electronic component and method for manufacturing electronic component coated therewith |
-
2014
- 2014-04-07 JP JP2014078456A patent/JP6323129B2/en not_active Expired - Fee Related
- 2014-04-29 IN IN1155DE2014 patent/IN2014DE01155A/en unknown
- 2014-05-23 BR BRBR102014012560-4A patent/BR102014012560A2/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP6323129B2 (en) | 2018-05-16 |
JP2015005725A (en) | 2015-01-08 |
BR102014012560A2 (en) | 2015-05-12 |
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