IN2014DE01155A - - Google Patents

Info

Publication number
IN2014DE01155A
IN2014DE01155A IN1155DE2014A IN2014DE01155A IN 2014DE01155 A IN2014DE01155 A IN 2014DE01155A IN 1155DE2014 A IN1155DE2014 A IN 1155DE2014A IN 2014DE01155 A IN2014DE01155 A IN 2014DE01155A
Authority
IN
India
Prior art keywords
electronic component
resin
sealing member
manufacturing
foamed
Prior art date
Application number
Inventor
Echigo Masashi
Yoshida Akikazu
Arao Osamu
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of IN2014DE01155A publication Critical patent/IN2014DE01155A/en

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

ABSTRACT An electronic component unit 1 includin g an electronic component 2 and a resin sealing member 3 coating the electronic component 2 is provided. The resin sealing member 3 is made of a foamed resin that is produced by foaming a thermosetting resin. With respect to a distribution of a long diameter size of connection holes 301, 302, 303, 304 connecting between foamed cells of the foamed resin, an average value a µm and a standard deviation o µm of the long diameter size satisfy a relationship of a+3o = 500. Furthermore, a manufacturing method of the electronic component unit 1 is provided. The manufacturing method includes a raw material liquid preparation process, a mixing process, and a coat foam process.
IN1155DE2014 2013-05-24 2014-04-29 IN2014DE01155A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013109840 2013-05-24
JP2014078456A JP6323129B2 (en) 2013-05-24 2014-04-07 Electronic component unit and manufacturing method thereof

Publications (1)

Publication Number Publication Date
IN2014DE01155A true IN2014DE01155A (en) 2015-06-05

Family

ID=52301353

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1155DE2014 IN2014DE01155A (en) 2013-05-24 2014-04-29

Country Status (3)

Country Link
JP (1) JP6323129B2 (en)
BR (1) BR102014012560A2 (en)
IN (1) IN2014DE01155A (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001352156A (en) * 2000-06-07 2001-12-21 Asahi Rubber:Kk Formed polyurethane for electronic component and method for manufacturing electronic component coated therewith

Also Published As

Publication number Publication date
JP6323129B2 (en) 2018-05-16
JP2015005725A (en) 2015-01-08
BR102014012560A2 (en) 2015-05-12

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