IN2013MU03700A - - Google Patents

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Publication number
IN2013MU03700A
IN2013MU03700A IN3700MU2013A IN2013MU03700A IN 2013MU03700 A IN2013MU03700 A IN 2013MU03700A IN 3700MU2013 A IN3700MU2013 A IN 3700MU2013A IN 2013MU03700 A IN2013MU03700 A IN 2013MU03700A
Authority
IN
India
Prior art keywords
insights
heat dissipating
thermal
dissipating device
cooling units
Prior art date
Application number
Other languages
English (en)
Inventor
Anirudh Deodhar
Harshad Girish Bhagwat
Amarendra Kumar Singh
Anand Sivasubramaniam
Original Assignee
Tata Consultancy Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tata Consultancy Services Ltd filed Critical Tata Consultancy Services Ltd
Priority to PCT/IN2014/000120 priority Critical patent/WO2015075727A2/en
Priority to EP14864803.3A priority patent/EP3074914A4/en
Priority to US15/039,729 priority patent/US10540457B2/en
Priority to IN3700MU2013 priority patent/IN2013MU03700A/en
Publication of IN2013MU03700A publication Critical patent/IN2013MU03700A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/28—Design optimisation, verification or simulation using fluid dynamics, e.g. using Navier-Stokes equations or computational fluid dynamics [CFD]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/3003—Monitoring arrangements specially adapted to the computing system or computing system component being monitored
    • G06F11/3006—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system is distributed, e.g. networked systems, clusters, multiprocessor systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00—Error detection; Error correction; Monitoring
    • G06F11/30—Monitoring
    • G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
    • G06F11/3062—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations where the monitored property is the power consumption
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F17/00—Digital computing or data processing equipment or methods, specially adapted for specific functions
    • G06F17/10—Complex mathematical operations
    • G06F17/18—Complex mathematical operations for evaluating statistical data, e.g. average values, frequency distributions, probability functions, regression analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00—Details relating to CAD techniques
    • G06F2111/10—Numerical modelling
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00—Details relating to the application field
    • G06F2113/02—Data centres
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/08—Thermal analysis or thermal optimisation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computing Systems (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Quality & Reliability (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • Data Mining & Analysis (AREA)
  • Pure & Applied Mathematics (AREA)
  • Mathematical Optimization (AREA)
  • Mathematical Analysis (AREA)
  • Computational Mathematics (AREA)
  • Algebra (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Software Systems (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Operations Research (AREA)
  • Probability & Statistics with Applications (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Evolutionary Biology (AREA)
  • Databases & Information Systems (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Fluid Mechanics (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Architecture (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
IN3700MU2013 2013-11-25 2014-02-25 IN2013MU03700A (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/IN2014/000120 WO2015075727A2 (en) 2013-11-25 2014-02-25 A system and method for predicting thermal-insights of a data center
EP14864803.3A EP3074914A4 (en) 2013-11-25 2014-02-25 A system and method for predicting thermal-insights of a data center
US15/039,729 US10540457B2 (en) 2013-11-25 2014-02-25 System and method for predicting thermal-insights of a data center
IN3700MU2013 IN2013MU03700A (zh) 2013-11-25 2014-02-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IN3700MU2013 IN2013MU03700A (zh) 2013-11-25 2014-02-25

Publications (1)

Publication Number Publication Date
IN2013MU03700A true IN2013MU03700A (zh) 2015-07-31

Family

ID=53180340

Family Applications (1)

Application Number Title Priority Date Filing Date
IN3700MU2013 IN2013MU03700A (zh) 2013-11-25 2014-02-25

Country Status (4)

Country Link
US (1) US10540457B2 (zh)
EP (1) EP3074914A4 (zh)
IN (1) IN2013MU03700A (zh)
WO (1) WO2015075727A2 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015201015A (ja) * 2014-04-07 2015-11-12 富士通株式会社 熱流体解析プログラム、情報処理装置および熱流体解析方法
US10621849B2 (en) * 2015-09-25 2020-04-14 Intel Corporation Alert system for internet of things (IoT) devices
JP6562893B2 (ja) * 2016-11-17 2019-08-21 株式会社東芝 パラメータ推定装置、空調システム評価装置、パラメータ推定方法およびプログラム
CN106951355A (zh) * 2017-03-24 2017-07-14 联想(北京)有限公司 侦测机箱内空气状况的方法和服务器
CN113170592B (zh) * 2018-11-19 2023-11-10 阿里云计算有限公司 基于监测/控制机制的热控制优化
CN109582520B (zh) * 2018-12-07 2022-02-18 郑州云海信息技术有限公司 一种基于Linux环境的AEP内存散热自动化测试方法及系统
CN116048910B (zh) * 2022-12-08 2024-10-01 国网湖北省电力有限公司信息通信公司 一种数据中心设备运行数据双尺度预测方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7644051B1 (en) * 2006-07-28 2010-01-05 Hewlett-Packard Development Company, L.P. Management of data centers using a model
JP5479112B2 (ja) 2007-01-24 2014-04-23 シュナイダー エレクトリック アイティー コーポレーション 装置ラックの冷却性能を評価するためのシステムおよび方法
US8306794B2 (en) * 2008-06-26 2012-11-06 International Business Machines Corporation Techniques for thermal modeling of data centers to improve energy efficiency
US8972217B2 (en) * 2010-06-08 2015-03-03 Schneider Electric It Corporation System and method for predicting temperature values in a data center
US8949091B2 (en) * 2011-03-09 2015-02-03 Tata Consultancy Services Limited Method and system for thermal management by quantitative determination of cooling characteristics of data center
US8992074B2 (en) 2012-02-17 2015-03-31 Cypress Envirosystems, Inc. System and method for conducting heating, ventilation, and air conditioning analytics
WO2013128468A2 (en) * 2012-03-01 2013-09-06 Tata Consultancy Services Limited Method and system for efficient real time thermal management of a data center

Also Published As

Publication number Publication date
EP3074914A4 (en) 2017-06-07
EP3074914A2 (en) 2016-10-05
US20160378891A1 (en) 2016-12-29
US10540457B2 (en) 2020-01-21
WO2015075727A2 (en) 2015-05-28
WO2015075727A3 (en) 2015-11-12

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