IN2012DN04980A - - Google Patents

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Publication number
IN2012DN04980A
IN2012DN04980A IN4980DEN2012A IN2012DN04980A IN 2012DN04980 A IN2012DN04980 A IN 2012DN04980A IN 4980DEN2012 A IN4980DEN2012 A IN 4980DEN2012A IN 2012DN04980 A IN2012DN04980 A IN 2012DN04980A
Authority
IN
India
Application number
Inventor
Andrew Kw Leung
Original Assignee
Ati Technologies Ulc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ati Technologies Ulc filed Critical Ati Technologies Ulc
Publication of IN2012DN04980A publication Critical patent/IN2012DN04980A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
IN4980DEN2012 2009-11-12 2012-06-06 IN2012DN04980A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/617,544 US20110110061A1 (en) 2009-11-12 2009-11-12 Circuit Board with Offset Via
PCT/CA2010/001797 WO2011057404A1 (en) 2009-11-12 2010-11-10 Circuit board with offset via

Publications (1)

Publication Number Publication Date
IN2012DN04980A true IN2012DN04980A (en) 2015-10-02

Family

ID=43974030

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4980DEN2012 IN2012DN04980A (en) 2009-11-12 2012-06-06

Country Status (8)

Country Link
US (1) US20110110061A1 (en)
EP (1) EP2499887A1 (en)
JP (1) JP2013511137A (en)
KR (1) KR20120102700A (en)
CN (1) CN102687604A (en)
IN (1) IN2012DN04980A (en)
TW (1) TW201132265A (en)
WO (1) WO2011057404A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5326455B2 (en) * 2008-09-18 2013-10-30 日本電気株式会社 Printed wiring board and manufacturing method thereof
US20130215586A1 (en) * 2012-02-16 2013-08-22 Ibiden Co., Ltd. Wiring substrate
US9064757B2 (en) * 2012-02-29 2015-06-23 Mediatek Inc. Enhanced flip chip structure using copper column interconnect
US9437534B2 (en) * 2012-02-29 2016-09-06 Mediatek Inc. Enhanced flip chip structure using copper column interconnect
KR101472633B1 (en) * 2012-10-16 2014-12-15 삼성전기주식회사 Hybrid lamination substrate, manufacturing method thereof and package substrate
JP2014236187A (en) * 2013-06-05 2014-12-15 イビデン株式会社 Wiring board and manufacturing method therefor
JP2014236188A (en) * 2013-06-05 2014-12-15 イビデン株式会社 Wiring board and manufacturing method therefor
US9565762B1 (en) * 2013-12-06 2017-02-07 Marvell Israel (M.I.S.L) Ltd. Power delivery network in a printed circuit board structure
KR102124691B1 (en) * 2014-07-28 2020-06-18 인텔 코포레이션 A multi-chip-module semiconductor chip package having dense package wiring
US10431533B2 (en) * 2014-10-31 2019-10-01 Ati Technologies Ulc Circuit board with constrained solder interconnect pads
JP2017069318A (en) * 2015-09-29 2017-04-06 日立化成株式会社 Multilayer wiring board
US10381330B2 (en) * 2017-03-28 2019-08-13 Silicon Storage Technology, Inc. Sacrificial alignment ring and self-soldering vias for wafer bonding
US11652036B2 (en) * 2018-04-02 2023-05-16 Santa Clara Via-trace structures
TWI677065B (en) 2018-06-13 2019-11-11 瑞昱半導體股份有限公司 Electronic apparatus and circuit board

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS634694A (en) * 1986-06-24 1988-01-09 富士通株式会社 Multilayer printed board
JPH01115195A (en) * 1987-10-28 1989-05-08 Ibiden Co Ltd Printed wiring board
JPH0752784B2 (en) * 1988-05-24 1995-06-05 松下電工株式会社 Printed wiring board
JPH0276293A (en) * 1988-09-12 1990-03-15 Hitachi Ltd Wiring board and mounting module for computor
JP2940173B2 (en) * 1991-02-12 1999-08-25 横河電機株式会社 Substrate CAD system
JPH07283538A (en) * 1994-04-14 1995-10-27 Ibiden Co Ltd Manufacture of multilayered printed wiring board
JPH09326556A (en) * 1996-06-06 1997-12-16 Kyocera Corp Multilayer wiring board and manufacture thereof
JP2000208698A (en) * 1999-01-18 2000-07-28 Toshiba Corp Semiconductor device
TW512653B (en) * 1999-11-26 2002-12-01 Ibiden Co Ltd Multilayer circuit board and semiconductor device
JP2001237547A (en) * 2000-02-23 2001-08-31 Ngk Spark Plug Co Ltd Wiring board and its manufacturing method
US6900532B1 (en) * 2000-09-01 2005-05-31 National Semiconductor Corporation Wafer level chip scale package
US6664639B2 (en) * 2000-12-22 2003-12-16 Matrix Semiconductor, Inc. Contact and via structure and method of fabrication
JP2002359468A (en) * 2001-05-31 2002-12-13 Toppan Printing Co Ltd Multilayered printed wiring board having filled via hole structure and manufacturing method therefor
JP2004063904A (en) * 2002-07-30 2004-02-26 Ngk Spark Plug Co Ltd Build-up multilayered printed wiring board
JP4612543B2 (en) * 2003-06-16 2011-01-12 日本電気株式会社 Printed circuit wiring board design support apparatus, printed circuit board design method and program thereof
US20050201065A1 (en) * 2004-02-13 2005-09-15 Regnier Kent E. Preferential ground and via exit structures for printed circuit boards
JP4003767B2 (en) * 2004-09-02 2007-11-07 株式会社トッパンＮｅｃサーキットソリューションズ Semiconductor device and printed wiring board manufacturing method
JP4686201B2 (en) * 2005-01-27 2011-05-25 パナソニック株式会社 Solid-state imaging device and manufacturing method thereof
JP4299814B2 (en) * 2005-07-21 2009-07-22 Ｎｅｃアクセステクニカ株式会社 Printed circuit board design verification system, printed circuit board design verification method, and printed circuit board design verification program
JP2007096246A (en) * 2005-08-30 2007-04-12 Kyocera Corp Wiring substrate and electronic device using the same
JP2008078343A (en) * 2006-09-21 2008-04-03 Cmk Corp Printed wiring board and its manufacturing method
JP4848490B2 (en) * 2006-10-25 2011-12-28 日本電気株式会社 Transmission line, wiring board having the same, and semiconductor device
KR101551898B1 (en) * 2007-10-05 2015-09-09 신꼬오덴기 고교 가부시키가이샤 Wiring board semiconductor apparatus and method of manufacturing them

Also Published As

Publication number Publication date
US20110110061A1 (en) 2011-05-12
EP2499887A1 (en) 2012-09-19
WO2011057404A1 (en) 2011-05-19
JP2013511137A (en) 2013-03-28
CN102687604A (en) 2012-09-19
TW201132265A (en) 2011-09-16
KR20120102700A (en) 2012-09-18

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