IN2012DN02450A - - Google Patents

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Publication number
IN2012DN02450A
IN2012DN02450A IN2450DEN2012A IN2012DN02450A IN 2012DN02450 A IN2012DN02450 A IN 2012DN02450A IN 2450DEN2012 A IN2450DEN2012 A IN 2450DEN2012A IN 2012DN02450 A IN2012DN02450 A IN 2012DN02450A
Authority
IN
India
Application number
Inventor
Lars Allers
Original Assignee
Mantis Deposition Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mantis Deposition Ltd filed Critical Mantis Deposition Ltd
Publication of IN2012DN02450A publication Critical patent/IN2012DN02450A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3455—Movable magnets
IN2450DEN2012 2009-09-21 2012-03-21 IN2012DN02450A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0916510A GB2473656A (en) 2009-09-21 2009-09-21 Sputter deposition using a cylindrical target
PCT/GB2010/001754 WO2011033268A1 (en) 2009-09-21 2010-09-17 Production of nanoparticles

Publications (1)

Publication Number Publication Date
IN2012DN02450A true IN2012DN02450A (en) 2015-08-21

Family

ID=41278030

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2450DEN2012 IN2012DN02450A (en) 2009-09-21 2012-03-21

Country Status (6)

Country Link
US (1) US20120199476A1 (en)
EP (1) EP2481076A1 (en)
CN (1) CN102576642A (en)
GB (1) GB2473656A (en)
IN (1) IN2012DN02450A (en)
WO (1) WO2011033268A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011156499A1 (en) 2010-06-08 2011-12-15 Ionwerks, Inc. Nanoparticulate assisted nanoscale molecular imaging by mass spectrometery
CN104278245A (en) * 2014-10-16 2015-01-14 苏州求是真空电子有限公司 Directly water-cooled rectangular planar target structure
CN105839065B (en) * 2016-05-26 2018-05-01 电子科技大学 A kind of magnetic control sputtering film plating device and method, the preparation method of nano particle
IT201600126397A1 (en) * 2016-12-14 2018-06-14 Kenosistec S R L Material deposition machine according to the cathodic atomization technique.
WO2019234477A1 (en) * 2018-06-08 2019-12-12 Kenosistec S.R.L. Machine for the deposition of material by the cathodic sputtering technique
EP4195236B1 (en) * 2021-12-09 2024-02-21 Platit AG Magnetron sputtering apparatus with a movable magnetic field and method of operating the magnetron sputtering apparatus

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51117933A (en) * 1975-04-10 1976-10-16 Tokuda Seisakusho Spattering apparatus
GB2125441A (en) * 1982-07-13 1984-03-07 Christopher Elphick Tunnel magnetron for cathode sputtering
JPS59197570A (en) * 1983-04-25 1984-11-09 Kawasaki Heavy Ind Ltd Electrode part structure of sputtering apparatus
JPH11302839A (en) * 1998-04-17 1999-11-02 Toshiba Corp Sputtering system
US6436252B1 (en) * 2000-04-07 2002-08-20 Surface Engineered Products Corp. Method and apparatus for magnetron sputtering
EP1733412A1 (en) * 2004-04-05 2006-12-20 Bekaert Advanced Coatings A tubular magnet assembly
US20060207871A1 (en) * 2005-03-16 2006-09-21 Gennady Yumshtyk Sputtering devices and methods
GB2430202A (en) * 2005-09-20 2007-03-21 Mantis Deposition Ltd Antibacterial surface coatings
DE502006008952D1 (en) * 2006-11-14 2011-04-07 Applied Materials Inc Magnetron sputter source, sputter coating equipment and method of coating a substrate
WO2008154397A1 (en) * 2007-06-08 2008-12-18 General Plasma, Inc. Rotatable magnetron sputtering with axially moveable target electrode tube
GB2461094B (en) * 2008-06-20 2012-08-22 Mantis Deposition Ltd Deposition of materials

Also Published As

Publication number Publication date
GB0916510D0 (en) 2009-10-28
WO2011033268A1 (en) 2011-03-24
EP2481076A1 (en) 2012-08-01
GB2473656A (en) 2011-03-23
CN102576642A (en) 2012-07-11
US20120199476A1 (en) 2012-08-09

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