IN155774B - - Google Patents
Info
- Publication number
- IN155774B IN155774B IN95/CAL/83A IN95CA1983A IN155774B IN 155774 B IN155774 B IN 155774B IN 95CA1983 A IN95CA1983 A IN 95CA1983A IN 155774 B IN155774 B IN 155774B
- Authority
- IN
- India
Links
Classifications
-
- H10W72/00—
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- H10W70/24—
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- H10W74/111—
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- H10W74/43—
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- H10W90/00—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/20—Parameters
- H01L2924/207—Diameter ranges
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57010122A JPS58128758A (ja) | 1982-01-27 | 1982-01-27 | 半導体装置とその製造法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN155774B true IN155774B (th) | 1985-03-09 |
Family
ID=11741489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN95/CAL/83A IN155774B (th) | 1982-01-27 | 1983-01-24 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0084859B1 (th) |
| JP (1) | JPS58128758A (th) |
| DE (1) | DE3378090D1 (th) |
| ES (1) | ES519272A0 (th) |
| IN (1) | IN155774B (th) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3402970A1 (de) * | 1984-01-28 | 1985-08-01 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Kontaktierungssystem fuer 2-polige elektronische bauelemente, insbesondere halbleiterbauelemente |
| WO1996029735A1 (en) * | 1995-03-20 | 1996-09-26 | Philips Electronics N.V. | Semiconductor device of the type sealed in glass comprising a semiconductor body connected to slugs by means of a silver-aluminium bonding layer |
| US5773885A (en) * | 1996-06-06 | 1998-06-30 | General Motors Corporation | Thermally responsive compressive diode assembly |
| CN107866647B (zh) * | 2016-09-26 | 2019-12-17 | 宝钢特钢有限公司 | 一种Fe-Ni因瓦合金焊丝及其制造方法 |
| CN113192902A (zh) * | 2021-04-27 | 2021-07-30 | 中国振华集团永光电子有限公司（国营第八七三厂） | 高温冶金键合玻璃钝化实体封装表贴二极管及制造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5242631B2 (th) * | 1973-07-11 | 1977-10-25 | ||
| JPS531469A (en) * | 1976-06-26 | 1978-01-09 | Hitachi Ltd | Glass seal type semiconductor device |
| JPS5846059B2 (ja) * | 1977-04-15 | 1983-10-14 | 株式会社日立製作所 | 半導体装置 |
| JPS54150461U (th) * | 1978-04-11 | 1979-10-19 | ||
| JPS559437A (en) * | 1978-07-07 | 1980-01-23 | Toshiba Corp | Composite wire for glass sealing |
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1982
- 1982-01-27 JP JP57010122A patent/JPS58128758A/ja active Granted
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1983
- 1983-01-20 EP EP83100477A patent/EP0084859B1/en not_active Expired
- 1983-01-20 DE DE8383100477T patent/DE3378090D1/de not_active Expired
- 1983-01-24 IN IN95/CAL/83A patent/IN155774B/en unknown
- 1983-01-26 ES ES519272A patent/ES519272A0/es active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| EP0084859A3 (en) | 1986-02-12 |
| EP0084859A2 (en) | 1983-08-03 |
| DE3378090D1 (en) | 1988-10-27 |
| JPS58128758A (ja) | 1983-08-01 |
| ES8402676A1 (es) | 1984-02-01 |
| ES519272A0 (es) | 1984-02-01 |
| JPH035665B2 (th) | 1991-01-28 |
| EP0084859B1 (en) | 1988-09-21 |