IN155774B - - Google Patents
Info
- Publication number
- IN155774B IN155774B IN95/CAL/83A IN95CA1983A IN155774B IN 155774 B IN155774 B IN 155774B IN 95CA1983 A IN95CA1983 A IN 95CA1983A IN 155774 B IN155774 B IN 155774B
- Authority
- IN
- India
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
- H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57010122A JPS58128758A (ja) | 1982-01-27 | 1982-01-27 | 半導体装置とその製造法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN155774B true IN155774B (enExample) | 1985-03-09 |
Family
ID=11741489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN95/CAL/83A IN155774B (enExample) | 1982-01-27 | 1983-01-24 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0084859B1 (enExample) |
| JP (1) | JPS58128758A (enExample) |
| DE (1) | DE3378090D1 (enExample) |
| ES (1) | ES8402676A1 (enExample) |
| IN (1) | IN155774B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3402970A1 (de) * | 1984-01-28 | 1985-08-01 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Kontaktierungssystem fuer 2-polige elektronische bauelemente, insbesondere halbleiterbauelemente |
| JPH10501376A (ja) * | 1995-03-20 | 1998-02-03 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 銀・アルミニウム結合層を用いてスラグに連結された半導体本体を含んで構成されるガラス中に封止された型の半導体装置 |
| US5773885A (en) * | 1996-06-06 | 1998-06-30 | General Motors Corporation | Thermally responsive compressive diode assembly |
| CN107866647B (zh) * | 2016-09-26 | 2019-12-17 | 宝钢特钢有限公司 | 一种Fe-Ni因瓦合金焊丝及其制造方法 |
| CN113192902A (zh) * | 2021-04-27 | 2021-07-30 | 中国振华集团永光电子有限公司（国营第八七三厂） | 高温冶金键合玻璃钝化实体封装表贴二极管及制造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5242631B2 (enExample) * | 1973-07-11 | 1977-10-25 | ||
| JPS531469A (en) * | 1976-06-26 | 1978-01-09 | Hitachi Ltd | Glass seal type semiconductor device |
| JPS5846059B2 (ja) * | 1977-04-15 | 1983-10-14 | 株式会社日立製作所 | 半導体装置 |
| JPS54150461U (enExample) * | 1978-04-11 | 1979-10-19 | ||
| JPS559437A (en) * | 1978-07-07 | 1980-01-23 | Toshiba Corp | Composite wire for glass sealing |
-
1982
- 1982-01-27 JP JP57010122A patent/JPS58128758A/ja active Granted
-
1983
- 1983-01-20 EP EP83100477A patent/EP0084859B1/en not_active Expired
- 1983-01-20 DE DE8383100477T patent/DE3378090D1/de not_active Expired
- 1983-01-24 IN IN95/CAL/83A patent/IN155774B/en unknown
- 1983-01-26 ES ES519272A patent/ES8402676A1/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| EP0084859B1 (en) | 1988-09-21 |
| EP0084859A2 (en) | 1983-08-03 |
| ES519272A0 (es) | 1984-02-01 |
| EP0084859A3 (en) | 1986-02-12 |
| JPS58128758A (ja) | 1983-08-01 |
| JPH035665B2 (enExample) | 1991-01-28 |
| ES8402676A1 (es) | 1984-02-01 |
| DE3378090D1 (en) | 1988-10-27 |