IL73839A - Microchip electrical circuitry - Google Patents

Microchip electrical circuitry

Info

Publication number
IL73839A
IL73839A IL73839A IL7383984A IL73839A IL 73839 A IL73839 A IL 73839A IL 73839 A IL73839 A IL 73839A IL 7383984 A IL7383984 A IL 7383984A IL 73839 A IL73839 A IL 73839A
Authority
IL
Israel
Prior art keywords
microchip
electrical circuitry
circuitry
electrical
microchip electrical
Prior art date
Application number
IL73839A
Other versions
IL73839A0 (en
Original Assignee
Laserpath Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laserpath Corp filed Critical Laserpath Corp
Publication of IL73839A0 publication Critical patent/IL73839A0/en
Publication of IL73839A publication Critical patent/IL73839A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5382—Adaptable interconnections, e.g. for engineering changes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
IL73839A 1983-12-15 1984-12-16 Microchip electrical circuitry IL73839A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US56191783A 1983-12-15 1983-12-15

Publications (2)

Publication Number Publication Date
IL73839A0 IL73839A0 (en) 1985-03-31
IL73839A true IL73839A (en) 1988-05-31

Family

ID=24244047

Family Applications (1)

Application Number Title Priority Date Filing Date
IL73839A IL73839A (en) 1983-12-15 1984-12-16 Microchip electrical circuitry

Country Status (7)

Country Link
EP (1) EP0166762A4 (en)
JP (1) JPS61500697A (en)
AU (1) AU3747585A (en)
BR (1) BR8407221A (en)
CA (1) CA1223085A (en)
IL (1) IL73839A (en)
WO (1) WO1985002751A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1291274C (en) * 1987-10-05 1991-10-22 Cray Research, Inc. Wire/disk board-to-board interconnect device
US4859188A (en) * 1987-10-05 1989-08-22 Cray Research, Inc. Wire/disk board-to-board interconnect device
US5010448A (en) * 1987-12-18 1991-04-23 Alpine Electronics Inc. Printed circuit board
GB8803891D0 (en) * 1988-02-19 1988-03-23 Bicc Plc Improved circuit board
JP2767645B2 (en) * 1990-03-07 1998-06-18 富士通株式会社 Method for manufacturing multilayer wiring board
US5367764A (en) * 1991-12-31 1994-11-29 Tessera, Inc. Method of making a multi-layer circuit assembly
US5282312A (en) * 1991-12-31 1994-02-01 Tessera, Inc. Multi-layer circuit construction methods with customization features
EP0834921B1 (en) * 1991-12-31 2003-11-26 Tessera, Inc. Multi-layer circuit construction method and structures with customization features and components for use therein
US5802699A (en) * 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5632631A (en) * 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5983492A (en) * 1996-11-27 1999-11-16 Tessera, Inc. Low profile socket for microelectronic components and method for making the same
US5810609A (en) 1995-08-28 1998-09-22 Tessera, Inc. Socket for engaging bump leads on a microelectronic device and methods therefor

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1157432A (en) * 1914-03-05 1915-10-19 Ray R Simpson Combined envelop, shipping-tag, and index-card.
US3060076A (en) * 1957-09-30 1962-10-23 Automated Circuits Inc Method of making bases for printed electric circuits
US3072734A (en) * 1958-08-26 1963-01-08 Eastman Kodak Co Circuit board for mounting and inter-connecting electrical components
US3202879A (en) * 1959-12-24 1965-08-24 Ibm Encapsulated circuit card
JPS4115121Y1 (en) * 1963-08-14 1966-07-15
US3398326A (en) * 1965-08-25 1968-08-20 Vitramon Inc Solid-state electrical component combining multiple capacitors with other kinds of impedance
GB1187619A (en) * 1967-12-08 1970-04-08 Ferranti Ltd Improvements relating to Electrical Interconnection Grids
CH469424A (en) * 1968-06-10 1969-02-28 Contiflex Ag Multi-layer printed circuit board and method for making same
US3646670A (en) * 1968-07-19 1972-03-07 Hitachi Chemical Co Ltd Method for connecting conductors
US3660726A (en) * 1970-10-12 1972-05-02 Elfab Corp Multi-layer printed circuit board and method of manufacture
DE2056222A1 (en) * 1970-11-16 1972-05-18 Poersch H Solder-free connection technology for through-hole plating of different levels in multilayer, two-dimensional conductor track circuits. Pörsch née Thuma, Hildegard; Pörsch, Andrea; 8500 Nuremberg
FR2212740B1 (en) * 1972-12-28 1977-02-25 Honeywell Bull
US3859711A (en) * 1973-03-20 1975-01-14 Ibm Method of detecting misregistration of internal layers of a multilayer printed circuit panel
US4054939A (en) * 1975-06-06 1977-10-18 Elfab Corporation Multi-layer backpanel including metal plate ground and voltage planes
US3953924A (en) * 1975-06-30 1976-05-04 Rockwell International Corporation Process for making a multilayer interconnect system
DE2742534C2 (en) * 1977-09-21 1985-01-24 Siemens AG, 1000 Berlin und 8000 München Connector for electronic circuits
FR2404990A1 (en) * 1977-10-03 1979-04-27 Cii Honeywell Bull SUBSTRATE FOR THE INTERCONNECTION OF ELECTRONIC COMPONENTS WITH INTEGRATED CIRCUITS, EQUIPPED WITH A REPAIR DEVICE
JPS5530822A (en) * 1978-08-25 1980-03-04 Fujitsu Ltd Printed board
US4258468A (en) * 1978-12-14 1981-03-31 Western Electric Company, Inc. Forming vias through multilayer circuit boards
US4249302A (en) * 1978-12-28 1981-02-10 Ncr Corporation Multilayer printed circuit board
US4286593A (en) * 1980-05-05 1981-09-01 Place Virgil A Vaginal contraceptive shield
DE3020196C2 (en) * 1980-05-28 1982-05-06 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Multilevel printed circuit board and process for its manufacture
DE3045433A1 (en) * 1980-12-02 1982-07-01 Siemens AG, 1000 Berlin und 8000 München MULTI-LAYER CIRCUIT BOARD AND METHOD FOR DETERMINING THE CURRENT POSITION OF INTERNAL CONNECTION AREAS
US4434321A (en) * 1981-02-09 1984-02-28 International Computers Limited Multilayer printed circuit boards
JPH077933U (en) * 1993-07-07 1995-02-03 株式会社明々道 Reinforced sheet

Also Published As

Publication number Publication date
IL73839A0 (en) 1985-03-31
AU3747585A (en) 1985-06-26
CA1223085A (en) 1987-06-16
BR8407221A (en) 1985-11-26
EP0166762A1 (en) 1986-01-08
EP0166762A4 (en) 1986-05-16
JPS61500697A (en) 1986-04-10
WO1985002751A1 (en) 1985-06-20

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