IL59344A - Precursor solutions of silicone copolymer materials made from a siloxane containing a bis-amino aryl ether or thioether - Google Patents
Precursor solutions of silicone copolymer materials made from a siloxane containing a bis-amino aryl ether or thioetherInfo
- Publication number
- IL59344A IL59344A IL59344A IL5934480A IL59344A IL 59344 A IL59344 A IL 59344A IL 59344 A IL59344 A IL 59344A IL 5934480 A IL5934480 A IL 5934480A IL 59344 A IL59344 A IL 59344A
- Authority
- IL
- Israel
- Prior art keywords
- bis
- amino aryl
- coating composition
- ethers
- thioether
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
- C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
- C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
- C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3178—Coating or filling in grooves made in the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Silicon Polymers (AREA)
- Paints Or Removers (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Mixers Of The Rotary Stirring Type (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1641279A | 1979-03-01 | 1979-03-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
IL59344A0 IL59344A0 (en) | 1980-05-30 |
IL59344A true IL59344A (en) | 1983-06-15 |
Family
ID=21776996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL59344A IL59344A (en) | 1979-03-01 | 1980-02-08 | Precursor solutions of silicone copolymer materials made from a siloxane containing a bis-amino aryl ether or thioether |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0015720B1 (xx) |
JP (1) | JPS55144026A (xx) |
KR (1) | KR840000527B1 (xx) |
AT (1) | ATE4994T1 (xx) |
CA (1) | CA1163742A (xx) |
DE (1) | DE3065230D1 (xx) |
IL (1) | IL59344A (xx) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4395527A (en) * | 1978-05-17 | 1983-07-26 | M & T Chemicals Inc. | Siloxane-containing polymers |
US4339526A (en) * | 1981-06-24 | 1982-07-13 | International Business Machines Corporation | Acetylene terminated, branched polyphenylene resist and protective coating for integrated circuit devices |
US4690997A (en) * | 1984-01-26 | 1987-09-01 | General Electric Company | Flame retardant wire coating compositions |
US4586997A (en) * | 1984-10-19 | 1986-05-06 | General Electric Company | Soluble silicone-imide copolymers |
US4701511A (en) * | 1984-10-19 | 1987-10-20 | General Electric Company | Method of making diglyme soluble siloxane-imide copolymers |
US8814861B2 (en) | 2005-05-12 | 2014-08-26 | Innovatech, Llc | Electrosurgical electrode and method of manufacturing same |
US7147634B2 (en) | 2005-05-12 | 2006-12-12 | Orion Industries, Ltd. | Electrosurgical electrode and method of manufacturing same |
EP2580264A1 (en) * | 2010-06-08 | 2013-04-17 | Tata Steel Nederland Technology B.V. | A method of preparing a polyetherimide coated substrate |
DE102010034136A1 (de) * | 2010-08-12 | 2012-02-16 | Norbert Harthauß | Verfahren zur Reparatur eines beschädigten Bereiches einer elektrischen Leitung |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4030948A (en) * | 1975-07-21 | 1977-06-21 | Abe Berger | Polyimide containing silicones as protective coating on semiconductor device |
US4051163A (en) * | 1975-07-21 | 1977-09-27 | Abe Berger | Polyimide containing silicones |
SE418433B (sv) * | 1975-12-11 | 1981-05-25 | Gen Electric | Halvledarelement med ett skikt av ett polymert siloxan-innehallande membranmaterial med variabel permeabilitet anbringat pa utvalda ytomraden av elementet |
GB1585477A (en) * | 1976-01-26 | 1981-03-04 | Gen Electric | Semiconductors |
US4139547A (en) * | 1978-05-17 | 1979-02-13 | Bergston & Associates, Inc. | Silicone containing bis-thioether aromatic amines |
-
1980
- 1980-02-08 IL IL59344A patent/IL59344A/xx not_active IP Right Cessation
- 1980-02-28 DE DE8080300600T patent/DE3065230D1/de not_active Expired
- 1980-02-28 CA CA000346610A patent/CA1163742A/en not_active Expired
- 1980-02-28 EP EP80300600A patent/EP0015720B1/en not_active Expired
- 1980-02-28 AT AT80300600T patent/ATE4994T1/de not_active IP Right Cessation
- 1980-02-29 KR KR1019800000849A patent/KR840000527B1/ko active
- 1980-03-01 JP JP2466180A patent/JPS55144026A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS55144026A (en) | 1980-11-10 |
KR830002006A (en) | 1983-05-21 |
DE3065230D1 (en) | 1983-11-17 |
KR840000527B1 (ko) | 1984-04-17 |
EP0015720A1 (en) | 1980-09-17 |
IL59344A0 (en) | 1980-05-30 |
EP0015720B1 (en) | 1983-10-12 |
CA1163742A (en) | 1984-03-13 |
JPS6358169B2 (xx) | 1988-11-15 |
ATE4994T1 (de) | 1983-10-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES8103128A1 (es) | Mejoras introducidas en los procesos de fabricacion de composiciones endurecibles a base de silicona. | |
ES444862A1 (es) | Procedimiento para la obtencion de un producto ignifugo de resina epoxi. | |
IL59344A0 (en) | Precursor solutions of silicone copolymer materials made from a siloxane containing a bis-amino aryl ether or thioether | |
FI843265A (fi) | Haerdande sammansaettningar. | |
EP0432502A3 (en) | Semiconductor pellet adhesive and article made therewith | |
ES481651A1 (es) | Procedimiento para la preparacion de resinas de silicona en-durecibles por calor. | |
NO903694D0 (no) | Avansert harpiksmateriale, samt fremgangsmaate for fremstilling av et slikt. | |
JPS5481363A (en) | Manufacture of silicone contact lens | |
JPS52112698A (en) | Curable resin compositions | |
JPS57212230A (en) | Novel polyimide resin molded article | |
JPS5723620A (en) | Thermosetting resin composition | |
JPS5274655A (en) | Resin composition containing carbon fiber | |
NO163231C (no) | Fremgangsm te for fremstilling av triazin- eller trg oksazolin-gruppeholdige epoksyharpikser. | |
EP0316669A3 (en) | Dry-storable compositions curable to elastomers by contact with water at ambient temperature | |
EP0294148A3 (en) | Epoxy resin composition | |
US3484471A (en) | Aminoxycyclopolysiloxanes | |
JPS5710643A (en) | Silicone resin composition | |
JPS5692912A (en) | Epoxy resin composition | |
JPS5331761A (en) | Thermosetting silicone resin composition | |
JPS5699239A (en) | Modification of polyester molded product | |
JPS5710621A (en) | Catalyst for polymerizing epoxy compound | |
JPS5545731A (en) | Epoxy resin composition | |
JPS5538836A (en) | Epoxy resin curing agent | |
JPS5796045A (en) | One-pack type organopolysiloxane composition for injection molding | |
Bilow et al. | Synthesis and polymerization of tris (alkylamino)‐silance with epoxy prepolymers |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RH | Patent void |