IL50237A - Passivated and encapsulated semiconuctors and method of making the same
- Google Patents
Passivated and encapsulated semiconuctors and method of making the same
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Publication number
IL50237A
IL50237AIL7650237AIL5023776AIL50237AIL 50237 AIL50237 AIL 50237AIL 7650237 AIL7650237 AIL 7650237AIL 5023776 AIL5023776 AIL 5023776AIL 50237 AIL50237 AIL 50237A
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Priority claimed from US05/604,722external-prioritypatent/US3996602A/en
Application filed by Gen Instrument CorpfiledCriticalGen Instrument Corp
Priority to IL7650237ApriorityCriticalpatent/IL50237A/en
Publication of IL50237A0publicationCriticalpatent/IL50237A0/en
Publication of IL50237ApublicationCriticalpatent/IL50237A/en
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
IL7650237A1975-08-141976-08-11Passivated and encapsulated semiconuctors and method of making the same
IL50237A
(en)