IL31484A

IL31484A - Method of soldering components to a printed circuit board previously provided with a solder layer

Info

Publication number: IL31484A
Application number: IL31484A
Authority: IL
Original assignee: Motorola Inc
Priority date: 1968-02-13
Filing date: 1969-01-24
Publication date: 1973-06-29
Also published as: DE1900591A1; IL31484A0

Description

METHOD OF SOLDERING COMPONENTS TO A PRINTED CIRCUIT BOARD PREVIOUSLY PROVIDED WITH A SOLDER LAYER Diip jam m cans Vays ni^ O'S'STB man n no¾? on nasv ay i a The present invention relates to a method of soldering printed board assemblies.

It has been known to automatically solder electronic components to printed circuit boards .by processes known as wave soldering and dip soldering. In the wave soldering process, the printed circuit board assembly is passed over a solder pot which has an agitator therein to cause the solder to raise in waves to engage the board. In dip soldering the board with the components thereon is lowered into the solder pot to cause soldering of conductors to the printed circuits on the board. Although these systems have the advantage that they save time as compared to hand soldering, they present serious problems. In either case the" solder which engages the printed circuit board and the component leads becomes contaminated so that it does not provide the effective electrical connections desired. The solder may inadvertently bridge parts which are not to be connected to form a short, and may cause movement of the components so they are not in the desired position on the board. For these and other reasons, significant maintenance is required to maintain either a wave soldering or a dip soldering process operative, and considerable patch-up work is required on the soldered boards.

Another problem with wave and dip soldering is that the equipment required involves substantial equipment cost and in many cases it is not readily adaptable from one product to another. This results in a high.capital -equipment expense, and at the same time the performance has been less than desirable. Particular problems have been encountered where the as- i sembly being soldered has, many components in a very small space.

To overcome this problem, it was proposed, in U. S. Patent No. 3,294, 9 1, to induce capillary action by drilling a hole in one member and simultaneously melting, the solder on a member immediately below it to cause the melted solder to flowu up into the hole previously drilled. It was also suggested, in British Patent No. 1,102,621, that the printed circuit board could be pre-heated prior to the application of the solder, as a part of the initial cleaning operation.

Neither of these two proposals, however, has succeeded in overcoming the problems discussed above.

The present invention provides the method of soldering components having conductive leads to a printed circuit board having conductors with openings therein for receiving the component leads, including the steps of, providing the printed circuit board with a layer of hardened solder on the conductors, placing components on the printed circuit board with the leads thereof in the openings of the conductors, preheating the printed circuit board with the solder and components thereon, and focusing radiation from an infrared source onto the conductors of the printed circuit board to cause the solder to flow and make electrical and mechanical connections between thecomponent lead and the conductors on the board.

With the method of the present invention, there is no contamination of the solder, a good soldered connection minimum maintenance coats, and no undesired bridging of conductors, or shorts, is produced by the solder.

The soldering process of the invention is ■· > practiced by applying semi*-liquid or paste solder on the conductors of a printed circuit board and heating the same to cure the solder. The boards can then be stored for an indefinite period of time. When it is desired to solder components onto the boards, they may be placed on a conveyor for automatic processing. The components are placed on the boards with the leads thereof inserted in openings in the conductors and the boards. The boards with the components thereon may then be gradually preheated to bring. the solder close to the temperature required for forming an effective solder connection,, Infrared radiation is then^ focused on the solder to provide the temperature required to cause the solder to flow.

It may be desired to use a mask to shield the parts of the insulating board which are not being soldered from the infrared energy. The preheating can be provided by radiation from an infrared source which is distributed over the preheating region by a flat reflector, and the intense heat for soldering can be focused on the solder layer from a second infrared source by an elliptic reflector which concentrates the radiant energy.

In the drawings: Figure 1 illustrates the welding process of the invention; and Figure 2 is a chart showing the temperature of the solder in the process of Figure 1.

The process of the invention is illustrated in the drawing wherein Figure 1 schematically represents automatic equipment for soldering printed circuit assemblies. A conveyor apparatus includes end pulleys 10 and 11 which support a belt 12 or the like on which the printed circuit boards are positioned. The printed circuit boards 15 may be constructed in known manner with conductor 16 on one or both sides of an insulating sheet 17. The conductors have openings 18 therein which may be aligned with openings in the Insulating board.

Eyelets or ferrules 20, of known construction, can be provided in the openings engaging the conducting layers.

As the boards move to the right on the conveyor, solder in paste form is applied on the conductors , 16. To apply the solder only on the conductors, a mask 21 is positioned on the board having openings 22 in the areas of the conductors. The solder is applied through the openings 22 by a roller 23, or by a brush or a squeegee.

As the boards continue to move to the right, air from device 2 is directed on the covered boards to blow the -solder from the openings 18 in the conductors, so that these openings are free for the insertion of component leads therein.

The printed boards with the solder paste thereon is next passed into an oven 25. The oven is held at a low temperature which causes the solder paste to cure and become hardened. The boards with the hardened solder paste can then be stored or can be immediately used.

In the process illustrated in Figure 1, the conveyor moves the boards from the oven to a position 26 at which the boards are turned over, and components are placed on the boards. The components 28 have leads 30 which extend through the openings in the boards and in the conductors. As previously stated, eyelets may be provided in the openings to receive the leads, and which engage the conducting layers.

The boards with the components thereon are next moved into a preheat region 32 and the fluxes in the. solder are activated by the heat. The solder is on the conductors which are now on the bottom side of the boards, so that the heat is directed thereon. This preheat region can be provided by an elongated infrared lamp 3 positioned in a trough shaped reflector 36 which directs the heat from the lamp 34 oyer a wide area extending from the position 32 to the position 42. The 'reflector 36 is constructed so that the temperature of the board gradually increases as the board is moved from position 32 toward position 42.

At position 42 more intense energy is directed on the solder by a second infrared lamp 44 positioned at one focal point of an elliptical reflector 46. The reflector has an elliptical cross-section and the lamp is an elongated tubular unit extending elong the line defining one focal point of the reflector. The energy is, therefore, focused along the line defining the second fpcal point which is in the plane of the solder on the conductors. A top plate 48 is connected across the elliptical reflector 46, and has an arcuate shape with its center at the infrared lamp 44. A slip 50 is provld>-ed. along the center of the top plate 48 for the focused energy to pass therethrough to engage the solder on the conductor.

Figure 2 illustrates the heating effect on the solder by the preheating and by the focused radiant energy. In the preheat region, the temperature gradually increases to about 300°F. as shown by the portion a of Figure 2. When the radiant energy is focused on the solder from the source 44 at posir tion 42, the temperature of the solder increases rapidly as shown by the portion b of Figure 2. This will provide a temperature of the order of 450°F. which will cause the solder to flow so that it will engage the leads in the openings in the conductors or eyelets and provide an effective solder conection between the leads and the conductors or between the leads, the eyelets and the conductors.

A mask 38 may be positioned between the infrared lamps and the board to be soldered, to shield portions of the board which are not to be soldered from the radiant energy.

This may be made of stainless steel and have the same pattern as the mask 21 through which the solder is applied. That, is, the energy must be applied to the same areas to which the solder was applied. The insulating board may be made of a phenolic material which cheriges characteristics in the. presence of the heat intensity used to cause the solder to flow.

The automatic process illustrated In Figure 1 may include the further position 5 .at which a defluxing operation is provided. This is a known operation and may not be necessary in certain applications.

In order to provide maximum reflectivity, the reflecting surfaces of the reflectors 36 and 46 are preferably gold plated. Similarly, the reflection surface on the top plate 48 may be gold plated. This top sur ape reflects radiation back to the focus of the elliptical reflectpr which directs the same through the slit 50 so that the energy is concentrated at the solder.

Although the process has been shown with a conveyor for automatically moving the board from one position to another for the various process steps, it J,s obvious that various other arrangements can be used. For example, the preheating can be provided in a fixed position with the same source producing the preheat and the final radiant energy. By pulsing this source, the heat can be caused to build up graduall until the final heat is obtained. It may also be desired to simultaneously heat the solder on conductors on opposite sides of an insulating board, and to. do this heating elements can be positioned both above and below the board. It may be preferable to provide the heating elements above the board when only a single layer of solder is heated, rather than below the board, as illustrated.

Claims

31484/2 ,

1. The method of soldering components having conductive leads to a printed circuit board having conductors, with openings therein for receiving the component leads, including the steps of providing previously the printed circuit board with a layer of hardened solder on the conductors means being used to apply the solder on said conductors and preventing the solder from blocking the respective openings, placing components on the printed circuit board with the leads thereof in the openings of the conductors, pre-heating the printed circuit board with the solder and components thereon^ and focusing radiation from an infrared source onto the conductors of the printed circuit board to cause the solder to flow and make electrical and mechanical connections between the component leads and the conductors , on the board.

2. , The method in accordance with claim 1 wherein the layer of hardened solder is provided by applying solder in paste form to the conductors of the printed circuit board, and heating the board and the solder to harden the solder.

3. < The method in accordance with claim 1 or 2 wherein the printed circuit board is positioned on a conveyor and is moved thereby in sequence to different positions for the different process steps,

4. , The method in accordance with claim 1 or 2 wherein radiant energy is directed to the printed circuit board from a second infrared source of preheating the solder prior to the focusing, of the infrared radiation on the solder to cause the same to flow.

5. The method in accordance with fc&aim 2 including the step of placing a mask on the printed circuit board having openings registering with the conductors thereon, and applying - 8 - solder through the openings in the mask to the conductors.

6. The method in accordance with any one of the preceding claims including the step of placing a mask between the infrared source and the printed circuit board having openings registering with the conductors thereon to shield the remainder of the board from the radiation from the source.

7. The method in accordance with any one of the preceding claims wherein radiant energy is focused from an elongated infrared lamp by a reflector of elliptical cross section positioned with one focus along; the axis of the infrared lamp and the second focus aligned with the solder to concentrate the energy on the solder.

8. The method of as described herein. 9