IL314256A - Multi later printed circuit board rf modules and methods for manufacture - Google Patents

Multi later printed circuit board rf modules and methods for manufacture

Info

Publication number
IL314256A
IL314256A IL314256A IL31425624A IL314256A IL 314256 A IL314256 A IL 314256A IL 314256 A IL314256 A IL 314256A IL 31425624 A IL31425624 A IL 31425624A IL 314256 A IL314256 A IL 314256A
Authority
IL
Israel
Prior art keywords
modules
manufacture
methods
circuit board
printed circuit
Prior art date
Application number
IL314256A
Other languages
Hebrew (he)
Inventor
BEN LULU Ohad
Asher Kadosh Gay
Berger Alon
Original Assignee
Elta Systems Ltd
BEN LULU Ohad
Asher Kadosh Gay
Berger Alon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elta Systems Ltd, BEN LULU Ohad, Asher Kadosh Gay, Berger Alon filed Critical Elta Systems Ltd
Priority to IL314256A priority Critical patent/IL314256A/en
Publication of IL314256A publication Critical patent/IL314256A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
IL314256A 2024-07-11 2024-07-11 Multi later printed circuit board rf modules and methods for manufacture IL314256A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
IL314256A IL314256A (en) 2024-07-11 2024-07-11 Multi later printed circuit board rf modules and methods for manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL314256A IL314256A (en) 2024-07-11 2024-07-11 Multi later printed circuit board rf modules and methods for manufacture

Publications (1)

Publication Number Publication Date
IL314256A true IL314256A (en) 2026-02-01

Family

ID=98605481

Family Applications (1)

Application Number Title Priority Date Filing Date
IL314256A IL314256A (en) 2024-07-11 2024-07-11 Multi later printed circuit board rf modules and methods for manufacture

Country Status (1)

Country Link
IL (1) IL314256A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030203174A1 (en) * 2001-09-14 2003-10-30 Tonoga, Inc. Low signal loss bonding ply for multilayer circuit boards
KR101343984B1 (en) * 2013-05-14 2013-12-31 주식회사 이노디스 Polytetrafluoroethylene fusion device
CN107379701A (en) * 2017-07-08 2017-11-24 周丽 A kind of pure polytetrafluoroethylene (PTFE) copper coated foil plate of high-performance
CN108449890A (en) * 2018-03-27 2018-08-24 广东生益科技股份有限公司 A kind of production method of the multi-layer PCB containing PTFE
CN208540262U (en) * 2018-06-29 2019-02-22 南京大学 A PTFE-based PCB copper clad laminate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030203174A1 (en) * 2001-09-14 2003-10-30 Tonoga, Inc. Low signal loss bonding ply for multilayer circuit boards
KR101343984B1 (en) * 2013-05-14 2013-12-31 주식회사 이노디스 Polytetrafluoroethylene fusion device
CN107379701A (en) * 2017-07-08 2017-11-24 周丽 A kind of pure polytetrafluoroethylene (PTFE) copper coated foil plate of high-performance
CN108449890A (en) * 2018-03-27 2018-08-24 广东生益科技股份有限公司 A kind of production method of the multi-layer PCB containing PTFE
CN208540262U (en) * 2018-06-29 2019-02-22 南京大学 A PTFE-based PCB copper clad laminate

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
POLYFLON COMPANY, TAKING ADVANTAGE OF PURE PTFE’S QUALITIES IN MICROWAVE SUBSTRATES A TECHNICAL DISCUSSION, 18 September 2020 (2020-09-18) *
VITALY BENSMAN, FUSION BONDING FOR PTFE-BASE MULTILAYER PCB, 10 July 2023 (2023-07-10) *

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