IL308535A - הטמעת התקנים אלקטרוניים פונקציונליים בפולימרים מחוזקים בסיבים באמצעות סינטור והקשחה בו זמנית - Google Patents

הטמעת התקנים אלקטרוניים פונקציונליים בפולימרים מחוזקים בסיבים באמצעות סינטור והקשחה בו זמנית

Info

Publication number
IL308535A
IL308535A IL308535A IL30853523A IL308535A IL 308535 A IL308535 A IL 308535A IL 308535 A IL308535 A IL 308535A IL 30853523 A IL30853523 A IL 30853523A IL 308535 A IL308535 A IL 308535A
Authority
IL
Israel
Prior art keywords
ink
composite structure
electronic device
sintering
curing
Prior art date
Application number
IL308535A
Other languages
English (en)
Inventor
Zemel Erez
Original Assignee
Rafael Advanced Defense Systems Ltd
Zemel Erez
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rafael Advanced Defense Systems Ltd, Zemel Erez filed Critical Rafael Advanced Defense Systems Ltd
Priority to IL308535A priority Critical patent/IL308535A/he
Priority to PCT/IL2024/050939 priority patent/WO2025104720A1/en
Publication of IL308535A publication Critical patent/IL308535A/he

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
IL308535A 2023-11-14 2023-11-14 הטמעת התקנים אלקטרוניים פונקציונליים בפולימרים מחוזקים בסיבים באמצעות סינטור והקשחה בו זמנית IL308535A (he)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IL308535A IL308535A (he) 2023-11-14 2023-11-14 הטמעת התקנים אלקטרוניים פונקציונליים בפולימרים מחוזקים בסיבים באמצעות סינטור והקשחה בו זמנית
PCT/IL2024/050939 WO2025104720A1 (en) 2023-11-14 2024-09-19 Embedding functional electronic devices in fiber reinforced polymers through simultaneous sintering and curing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL308535A IL308535A (he) 2023-11-14 2023-11-14 הטמעת התקנים אלקטרוניים פונקציונליים בפולימרים מחוזקים בסיבים באמצעות סינטור והקשחה בו זמנית

Publications (1)

Publication Number Publication Date
IL308535A true IL308535A (he) 2025-06-01

Family

ID=95742241

Family Applications (1)

Application Number Title Priority Date Filing Date
IL308535A IL308535A (he) 2023-11-14 2023-11-14 הטמעת התקנים אלקטרוניים פונקציונליים בפולימרים מחוזקים בסיבים באמצעות סינטור והקשחה בו זמנית

Country Status (2)

Country Link
IL (1) IL308535A (he)
WO (1) WO2025104720A1 (he)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012091897A1 (en) * 2010-12-31 2012-07-05 Cytec Technology Corp. Method of fabricating a composite structure with a conductive surface
SG11201510615SA (en) * 2013-06-24 2016-01-28 Harvard College Printed three-dimensional (3d) functional part and method of making
US11745440B2 (en) * 2020-04-03 2023-09-05 The Boeing Company Automated lamination system and method for embedding printed electronic elements in a composite structure

Also Published As

Publication number Publication date
WO2025104720A1 (en) 2025-05-22

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