IL260104B - Accelerating semiconductor-related calculations using learning-based models - Google Patents
Accelerating semiconductor-related calculations using learning-based modelsInfo
- Publication number
- IL260104B IL260104B IL260104A IL26010418A IL260104B IL 260104 B IL260104 B IL 260104B IL 260104 A IL260104 A IL 260104A IL 26010418 A IL26010418 A IL 26010418A IL 260104 B IL260104 B IL 260104B
- Authority
- IL
- Israel
- Prior art keywords
- accelerating
- semiconductor
- learning based
- based models
- related computations
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
- G06F18/214—Generating training patterns; Bootstrap methods, e.g. bagging or boosting
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/24—Classification techniques
- G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
- G06F18/2413—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on distances to training or reference patterns
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/24—Classification techniques
- G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
- G06F18/2413—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on distances to training or reference patterns
- G06F18/24133—Distances to prototypes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/0464—Convolutional networks [CNN, ConvNet]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/0475—Generative networks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
- G06V10/443—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components by matching or filtering
- G06V10/449—Biologically inspired filters, e.g. difference of Gaussians [DoG] or Gabor filters
- G06V10/451—Biologically inspired filters, e.g. difference of Gaussians [DoG] or Gabor filters with interaction between the filter responses, e.g. cortical complex cells
- G06V10/454—Integrating the filters into a hierarchical structure, e.g. convolutional neural networks [CNN]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/82—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V30/00—Character recognition; Recognising digital ink; Document-oriented image-based pattern recognition
- G06V30/10—Character recognition
- G06V30/19—Recognition using electronic means
- G06V30/191—Design or setup of recognition systems or techniques; Extraction of features in feature space; Clustering techniques; Blind source separation
- G06V30/19173—Classification techniques
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V30/00—Character recognition; Recognising digital ink; Document-oriented image-based pattern recognition
- G06V30/10—Character recognition
- G06V30/19—Recognition using electronic means
- G06V30/192—Recognition using electronic means using simultaneous comparisons or correlations of the image signals with a plurality of references
- G06V30/194—References adjustable by an adaptive method, e.g. learning
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20081—Training; Learning
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20084—Artificial neural networks [ANN]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V2201/00—Indexing scheme relating to image or video recognition or understanding
- G06V2201/06—Recognition of objects for industrial automation
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Evolutionary Computation (AREA)
- Data Mining & Analysis (AREA)
- Artificial Intelligence (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Software Systems (AREA)
- Biomedical Technology (AREA)
- Molecular Biology (AREA)
- Computing Systems (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Bioinformatics & Computational Biology (AREA)
- Evolutionary Biology (AREA)
- Databases & Information Systems (AREA)
- Biophysics (AREA)
- Computational Linguistics (AREA)
- Mathematical Physics (AREA)
- Quality & Reliability (AREA)
- Biodiversity & Conservation Biology (AREA)
- Medical Informatics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662277227P | 2016-01-11 | 2016-01-11 | |
US15/402,169 US10360477B2 (en) | 2016-01-11 | 2017-01-09 | Accelerating semiconductor-related computations using learning based models |
PCT/US2017/012875 WO2017123553A1 (en) | 2016-01-11 | 2017-01-10 | Accelerating semiconductor-related computations using learning based models |
Publications (2)
Publication Number | Publication Date |
---|---|
IL260104A IL260104A (en) | 2018-07-31 |
IL260104B true IL260104B (en) | 2020-06-30 |
Family
ID=59275928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL260104A IL260104B (en) | 2016-01-11 | 2018-06-18 | Accelerating semiconductor-related calculations using learning-based models |
Country Status (6)
Country | Link |
---|---|
US (1) | US10360477B2 (zh) |
KR (1) | KR20180094121A (zh) |
CN (1) | CN108475350B (zh) |
IL (1) | IL260104B (zh) |
TW (1) | TWI711978B (zh) |
WO (1) | WO2017123553A1 (zh) |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11580398B2 (en) | 2016-10-14 | 2023-02-14 | KLA-Tenor Corp. | Diagnostic systems and methods for deep learning models configured for semiconductor applications |
US10267748B2 (en) | 2016-10-17 | 2019-04-23 | Kla-Tencor Corp. | Optimizing training sets used for setting up inspection-related algorithms |
US10395358B2 (en) | 2016-11-10 | 2019-08-27 | Kla-Tencor Corp. | High sensitivity repeater defect detection |
US10395362B2 (en) | 2017-04-07 | 2019-08-27 | Kla-Tencor Corp. | Contour based defect detection |
US11237872B2 (en) | 2017-05-23 | 2022-02-01 | Kla-Tencor Corporation | Semiconductor inspection and metrology systems for distributing job among the CPUs or GPUs based on logical image processing boundaries |
US10387755B2 (en) | 2017-06-28 | 2019-08-20 | Applied Materials, Inc. | Classification, search and retrieval of semiconductor processing metrology images using deep learning/convolutional neural networks |
FR3070084B1 (fr) * | 2017-08-10 | 2019-08-30 | Safran | Procede de controle automatique non destructif de pieces mecaniques |
US10275872B2 (en) * | 2017-08-24 | 2019-04-30 | Applied Materials Israel Ltd. | Method of detecting repeating defects and system thereof |
US10699926B2 (en) | 2017-08-30 | 2020-06-30 | Kla-Tencor Corp. | Identifying nuisances and defects of interest in defects detected on a wafer |
US10713534B2 (en) * | 2017-09-01 | 2020-07-14 | Kla-Tencor Corp. | Training a learning based defect classifier |
US10607119B2 (en) | 2017-09-06 | 2020-03-31 | Kla-Tencor Corp. | Unified neural network for defect detection and classification |
US10796221B2 (en) | 2017-10-19 | 2020-10-06 | General Electric Company | Deep learning architecture for automated image feature extraction |
US10460440B2 (en) | 2017-10-24 | 2019-10-29 | General Electric Company | Deep convolutional neural network with self-transfer learning |
TWI649659B (zh) | 2017-10-27 | 2019-02-01 | 財團法人工業技術研究院 | 自動光學檢測影像分類方法、系統及含有該方法之電腦可讀取媒體 |
US11022966B1 (en) * | 2017-12-15 | 2021-06-01 | Synopsys, Inc. | Method of modeling e-beam photomask manufacturing process using image-based artificial neural networks |
KR102606115B1 (ko) | 2018-02-23 | 2023-11-29 | 에이에스엠엘 네델란즈 비.브이. | 패턴의 시맨틱 분할을 위한 딥 러닝 |
CN111936267B (zh) | 2018-03-13 | 2023-07-25 | 应用材料公司 | 化学机械研磨机中的耗材部件监控 |
US10679333B2 (en) | 2018-03-14 | 2020-06-09 | Kla-Tencor Corporation | Defect detection, classification, and process window control using scanning electron microscope metrology |
US11170255B2 (en) | 2018-03-21 | 2021-11-09 | Kla-Tencor Corp. | Training a machine learning model with synthetic images |
US10599951B2 (en) | 2018-03-28 | 2020-03-24 | Kla-Tencor Corp. | Training a neural network for defect detection in low resolution images |
US10670536B2 (en) | 2018-03-28 | 2020-06-02 | Kla-Tencor Corp. | Mode selection for inspection |
CN110363210B (zh) * | 2018-04-10 | 2023-05-05 | 腾讯科技(深圳)有限公司 | 一种图像语义分割模型的训练方法和服务器 |
CN108564577A (zh) * | 2018-04-12 | 2018-09-21 | 重庆邮电大学 | 基于卷积神经网络的太阳能电池片断栅缺陷检测方法 |
US11669914B2 (en) | 2018-05-06 | 2023-06-06 | Strong Force TX Portfolio 2018, LLC | Adaptive intelligence and shared infrastructure lending transaction enablement platform responsive to crowd sourced information |
CN112534452A (zh) | 2018-05-06 | 2021-03-19 | 强力交易投资组合2018有限公司 | 用于改进自动执行能源、计算、存储和其它资源的现货和远期市场中的分布式账本和其它交易的机器和系统的方法和系统 |
US11544782B2 (en) | 2018-05-06 | 2023-01-03 | Strong Force TX Portfolio 2018, LLC | System and method of a smart contract and distributed ledger platform with blockchain custody service |
US11550299B2 (en) | 2020-02-03 | 2023-01-10 | Strong Force TX Portfolio 2018, LLC | Automated robotic process selection and configuration |
DE102018207880A1 (de) * | 2018-05-18 | 2019-11-21 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zum Bewerten einer unbekannten Auswirkung von Defekten eines Elements eines Photolithographieprozesses |
US10621301B2 (en) | 2018-06-06 | 2020-04-14 | International Business Machines Corporation | Coordinates-based variational autoencoder for generating synthetic via layout patterns |
US11151711B2 (en) * | 2018-06-06 | 2021-10-19 | Kla-Tencor Corporation | Cross layer common-unique analysis for nuisance filtering |
US11315231B2 (en) | 2018-06-08 | 2022-04-26 | Industrial Technology Research Institute | Industrial image inspection method and system and computer readable recording medium |
US10964566B2 (en) * | 2018-06-29 | 2021-03-30 | Taiwan Semiconductor Manufacturing Go., Ltd. | Machine learning on overlay virtual metrology |
JP7186539B2 (ja) * | 2018-08-03 | 2022-12-09 | Automagi株式会社 | 錆検出プログラム、錆検出システム及び錆検出方法 |
US10872403B2 (en) * | 2018-08-10 | 2020-12-22 | Micron Technology, Inc. | System for predicting properties of structures, imager system, and related methods |
US11818982B2 (en) | 2018-09-18 | 2023-11-21 | Deere & Company | Grain quality control system and method |
US11197417B2 (en) * | 2018-09-18 | 2021-12-14 | Deere & Company | Grain quality control system and method |
US10854486B2 (en) * | 2018-09-19 | 2020-12-01 | Kla Corporation | System and method for characterization of buried defects |
MX2020013580A (es) * | 2018-09-30 | 2021-02-26 | Boe Technology Group Co Ltd | Aparato y metodo para procesamiento de imagenes y sistema para entrenamiento de red neuronal. |
DE102018217901A1 (de) * | 2018-10-18 | 2020-04-23 | Leica Microsystems Cms Gmbh | Optimierung von Arbeitsabläufen von Mikroskopen |
EP3974906A1 (en) * | 2018-11-07 | 2022-03-30 | ASML Netherlands B.V. | Determining a correction to a process |
US11151707B2 (en) * | 2018-12-07 | 2021-10-19 | Kla Corporation | System and method for difference filter and aperture selection using shallow deep learning |
US11010885B2 (en) * | 2018-12-18 | 2021-05-18 | Kla Corporation | Optical-mode selection for multi-mode semiconductor inspection |
US11294162B2 (en) * | 2019-02-07 | 2022-04-05 | Nanotronics Imaging, Inc. | Fluorescence microscopy inspection systems, apparatus and methods with darkfield channel |
US10922808B2 (en) | 2019-02-14 | 2021-02-16 | KLA—Tencor Corp. | File selection for test image to design alignment |
JP2019101047A (ja) * | 2019-02-25 | 2019-06-24 | 株式会社アセット・ウィッツ | 部品外観自動検査装置 |
US11551348B2 (en) * | 2019-04-09 | 2023-01-10 | KLA Corp. | Learnable defect detection for semiconductor applications |
WO2020210506A1 (en) * | 2019-04-09 | 2020-10-15 | Purdue Research Foundationj | Methods and systems for crack detection using a fully convolutional network |
US11340060B2 (en) | 2019-07-23 | 2022-05-24 | Kla Corporation | Automatic recipe optimization for overlay metrology system |
US11693386B2 (en) | 2019-08-27 | 2023-07-04 | Samsung Eleotronics Co., Ltd. | Method and electronic device for guiding semiconductor manufacturing process |
US11580650B2 (en) | 2019-10-01 | 2023-02-14 | KLA Corp. | Multi-imaging mode image alignment |
US11415898B2 (en) * | 2019-10-14 | 2022-08-16 | Kla Corporation | Signal-domain adaptation for metrology |
TW202119232A (zh) * | 2019-10-14 | 2021-05-16 | 美商Pdf對策公司 | 用於半導體應用的協作學習模型 |
US11087449B2 (en) * | 2019-10-24 | 2021-08-10 | KLA Corp. | Deep learning networks for nuisance filtering |
KR102293791B1 (ko) * | 2019-11-28 | 2021-08-25 | 광주과학기술원 | 반도체 소자의 시뮬레이션을 위한 전자 장치, 방법, 및 컴퓨터 판독가능 매체 |
JP2021089219A (ja) * | 2019-12-05 | 2021-06-10 | 東洋製罐グループホールディングス株式会社 | 画像検査システム、及び画像検査方法 |
KR102228957B1 (ko) * | 2019-12-30 | 2021-03-17 | 주식회사 고영테크놀러지 | 인쇄 회로 기판 검사 장치, 스크린 프린터의 결함 유형 결정 방법 및 컴퓨터 판독 가능한 기록 매체 |
SE1930421A1 (en) * | 2019-12-30 | 2021-07-01 | Unibap Ab | Method and means for detection of imperfections in products |
US11449711B2 (en) * | 2020-01-02 | 2022-09-20 | Applied Materials Isreal Ltd. | Machine learning-based defect detection of a specimen |
US11982993B2 (en) | 2020-02-03 | 2024-05-14 | Strong Force TX Portfolio 2018, LLC | AI solution selection for an automated robotic process |
US11360030B2 (en) * | 2020-02-04 | 2022-06-14 | Applied Materials Isreal Ltd | Selecting a coreset of potential defects for estimating expected defects of interest |
US11961219B2 (en) | 2020-02-27 | 2024-04-16 | KLA Corp. | Generative adversarial networks (GANs) for simulating specimen images |
DE102021106999A1 (de) * | 2020-04-24 | 2021-10-28 | Krones Aktiengesellschaft | Verfahren und Vorrichtung zur optischen Inspektion von Behältern in einer Getränkeverarbeitungsanlage |
BR112022022447A2 (pt) * | 2020-05-05 | 2023-01-10 | Amgen Inc | Plataformas de aprendizado profundo para inspeção visual automatizada |
TWI742710B (zh) * | 2020-06-05 | 2021-10-11 | 樂達創意科技股份有限公司 | 改良機器學習使用資料進行訓練的方法及系統 |
CN113837209A (zh) * | 2020-06-23 | 2021-12-24 | 乐达创意科技股份有限公司 | 改良机器学习使用数据进行训练的方法及系统 |
CN111738268B (zh) * | 2020-07-22 | 2023-11-14 | 浙江大学 | 一种基于随机块的高分遥感图像的语义分割方法及系统 |
US11776108B2 (en) | 2020-08-05 | 2023-10-03 | KLA Corp. | Deep learning based defect detection |
US11967060B2 (en) | 2020-08-25 | 2024-04-23 | Kla Corporation | Wafer level spatial signature grouping using transfer learning |
CN112348158B (zh) * | 2020-11-04 | 2024-02-13 | 重庆大学 | 基于多参数深度分布学习的工业设备状态评估方法 |
US11586865B2 (en) * | 2021-02-18 | 2023-02-21 | Volkswagen Aktiengesellschaft | Apparatus, system and method for fusing sensor data to do sensor translation |
US12079984B2 (en) | 2021-03-05 | 2024-09-03 | Applied Materials, Inc. | Detecting an excursion of a CMP component using time-based sequence of images |
TW202316535A (zh) * | 2021-04-05 | 2023-04-16 | 美商科磊股份有限公司 | 基於半導體應用之語義圖像分割 |
US11983865B2 (en) * | 2021-05-05 | 2024-05-14 | KLA Corp. | Deep generative model-based alignment for semiconductor applications |
US20240013365A9 (en) * | 2021-10-04 | 2024-01-11 | Kla Corporation | Unsupervised or self-supervised deep learning for semiconductor-based applications |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001274209A (ja) * | 2000-03-28 | 2001-10-05 | Toshiba Corp | 半導体検査装置、半導体欠陥解析装置、半導体設計データ修正装置、半導体検査方法、半導体欠陥解析方法、半導体設計データ修正方法およびコンピュータ読み取り可能な記録媒体 |
US6947917B1 (en) | 2000-04-14 | 2005-09-20 | Honeywell International Inc. | Advanced recipe—a knowledge based information system for production processes |
US6694059B1 (en) * | 2000-05-19 | 2004-02-17 | International Business Machines Corporation | Robustness enhancement and evaluation of image information extraction |
US6891627B1 (en) | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
US6836560B2 (en) * | 2000-11-13 | 2004-12-28 | Kla - Tencor Technologies Corporation | Advanced phase shift inspection method |
US7162071B2 (en) | 2002-12-20 | 2007-01-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Progressive self-learning defect review and classification method |
JP2004354250A (ja) * | 2003-05-29 | 2004-12-16 | Nidek Co Ltd | 欠陥検査装置 |
US20040267397A1 (en) * | 2003-06-27 | 2004-12-30 | Srinivas Doddi | Optical metrology of structures formed on semiconductor wafer using machine learning systems |
US7482890B2 (en) | 2004-11-30 | 2009-01-27 | Superconductor Technologies, Inc. | Automated systems and methods for tuning filters by using a tuning recipe |
US7280229B2 (en) | 2004-12-03 | 2007-10-09 | Timbre Technologies, Inc. | Examining a structure formed on a semiconductor wafer using machine learning systems |
US7570796B2 (en) | 2005-11-18 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
US7676077B2 (en) | 2005-11-18 | 2010-03-09 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
US7570800B2 (en) * | 2005-12-14 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for binning defects detected on a specimen |
US8698093B1 (en) | 2007-01-19 | 2014-04-15 | Kla-Tencor Corporation | Objective lens with deflector plates immersed in electrostatic lens field |
US7517708B2 (en) | 2007-01-30 | 2009-04-14 | Tokyo Electron Limited | Real-time parameter tuning using wafer temperature |
US8611639B2 (en) * | 2007-07-30 | 2013-12-17 | Kla-Tencor Technologies Corp | Semiconductor device property extraction, generation, visualization, and monitoring methods |
JP5192547B2 (ja) * | 2007-08-31 | 2013-05-08 | イコス・ビジョン・システムズ・エヌブイ | 半導体基板の欠陥を検出する装置と方法 |
US8126255B2 (en) | 2007-09-20 | 2012-02-28 | Kla-Tencor Corp. | Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions |
US8396582B2 (en) | 2008-03-08 | 2013-03-12 | Tokyo Electron Limited | Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool |
JP5619776B2 (ja) * | 2009-02-06 | 2014-11-05 | ケーエルエー−テンカー コーポレイション | ウエハの検査のための1つまたは複数のパラメータの選択方法 |
JP2011002280A (ja) | 2009-06-17 | 2011-01-06 | Panasonic Corp | 欠陥検査方法 |
KR101096807B1 (ko) | 2010-01-29 | 2011-12-22 | 주식회사 팬택 | 3차원 위치 정보 획득 장치 및 방법 |
US8664594B1 (en) | 2011-04-18 | 2014-03-04 | Kla-Tencor Corporation | Electron-optical system for high-speed and high-sensitivity inspections |
US8692204B2 (en) | 2011-04-26 | 2014-04-08 | Kla-Tencor Corporation | Apparatus and methods for electron beam detection |
JP2013072788A (ja) | 2011-09-28 | 2013-04-22 | Hitachi High-Technologies Corp | 基板表面欠陥検査方法および検査装置 |
US8716662B1 (en) | 2012-07-16 | 2014-05-06 | Kla-Tencor Corporation | Methods and apparatus to review defects using scanning electron microscope with multiple electron beam configurations |
JP5921990B2 (ja) * | 2012-08-23 | 2016-05-24 | 株式会社ニューフレアテクノロジー | 欠陥検出方法 |
US8948494B2 (en) * | 2012-11-12 | 2015-02-03 | Kla-Tencor Corp. | Unbiased wafer defect samples |
US9222895B2 (en) | 2013-02-25 | 2015-12-29 | Kla-Tencor Corp. | Generalized virtual inspector |
US8984450B2 (en) | 2013-03-14 | 2015-03-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for extracting systematic defects |
US9098891B2 (en) | 2013-04-08 | 2015-08-04 | Kla-Tencor Corp. | Adaptive sampling for semiconductor inspection recipe creation, defect review, and metrology |
CN103278511B (zh) * | 2013-05-17 | 2015-04-29 | 南京大学 | 基于多尺度角点特征提取的晶片缺陷检测方法 |
US9224660B2 (en) | 2013-08-30 | 2015-12-29 | Kla-Tencor Corp. | Tuning wafer inspection recipes using precise defect locations |
US10650508B2 (en) * | 2014-12-03 | 2020-05-12 | Kla-Tencor Corporation | Automatic defect classification without sampling and feature selection |
CN104537666A (zh) * | 2014-12-26 | 2015-04-22 | 中国科学院半导体研究所 | 一种芯片封装外观缺陷检测系统及方法 |
CN104573731B (zh) * | 2015-02-06 | 2018-03-23 | 厦门大学 | 基于卷积神经网络的快速目标检测方法 |
US20180220589A1 (en) * | 2015-11-03 | 2018-08-09 | Keith Charles Burden | Automated pruning or harvesting system for complex morphology foliage |
US9965901B2 (en) | 2015-11-19 | 2018-05-08 | KLA—Tencor Corp. | Generating simulated images from design information |
-
2017
- 2017-01-09 US US15/402,169 patent/US10360477B2/en active Active
- 2017-01-10 KR KR1020187022848A patent/KR20180094121A/ko active Search and Examination
- 2017-01-10 WO PCT/US2017/012875 patent/WO2017123553A1/en active Application Filing
- 2017-01-10 CN CN201780005789.1A patent/CN108475350B/zh active Active
- 2017-01-11 TW TW106100890A patent/TWI711978B/zh active
-
2018
- 2018-06-18 IL IL260104A patent/IL260104B/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
TWI711978B (zh) | 2020-12-01 |
CN108475350A (zh) | 2018-08-31 |
IL260104A (en) | 2018-07-31 |
CN108475350B (zh) | 2020-08-21 |
US20170200260A1 (en) | 2017-07-13 |
WO2017123553A1 (en) | 2017-07-20 |
TW201734888A (zh) | 2017-10-01 |
US10360477B2 (en) | 2019-07-23 |
KR20180094121A (ko) | 2018-08-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IL260104B (en) | Accelerating semiconductor-related calculations using learning-based models | |
HK1246632A1 (zh) | 立柱插板型康復訓練系統 | |
PL3407997T3 (pl) | Zabawka | |
GB2547795B (en) | Toy bead set | |
ZA201701393B (en) | Customizable machine learning models | |
HK1204748A2 (zh) | 使用連接的玩具的教育系統 | |
HK1251878A1 (zh) | 發射型玩具 | |
ZA201806112B (en) | Educational toy simulator | |
HK1259130A1 (zh) | 利用物理對象的仿真體驗 | |
EP3257026A4 (en) | Generating three dimensional models | |
IL240461B (en) | Unmanned aerial vehicle simulator | |
SG10201602102PA (en) | Lung simulation model | |
PL3047888T3 (pl) | Zabawka w kształcie koparki | |
HK1214555A1 (zh) | 塑料模型成套組件 | |
GB201506505D0 (en) | Teaching apparatus | |
GB201417330D0 (en) | Simulation system | |
GB201519317D0 (en) | Toy construction set | |
TWM534025U (en) | Bubble-blowing toy | |
HU5017U (hu) | Készségfejlesztõ szivacs játszóház elrendezés | |
ZA201903634B (en) | Toy | |
GB201518781D0 (en) | Training aid | |
GB2524016B (en) | Hardware simulation | |
GB201613919D0 (en) | Educational toy set | |
AU366568S (en) | An educational toy | |
AU201614616S (en) | Soft Toy |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
KB | Patent renewed |