IL259146A - Printed circuit board based high frequency rf coaxial transmission line using buried vias and method of fabrication thereof - Google Patents

Printed circuit board based high frequency rf coaxial transmission line using buried vias and method of fabrication thereof

Info

Publication number
IL259146A
IL259146A IL259146A IL25914618A IL259146A IL 259146 A IL259146 A IL 259146A IL 259146 A IL259146 A IL 259146A IL 25914618 A IL25914618 A IL 25914618A IL 259146 A IL259146 A IL 259146A
Authority
IL
Israel
Prior art keywords
fabrication
circuit board
printed circuit
high frequency
transmission line
Prior art date
Application number
IL259146A
Other languages
Hebrew (he)
Original Assignee
Arbe Robotics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arbe Robotics Ltd filed Critical Arbe Robotics Ltd
Priority to IL259146A priority Critical patent/IL259146A/en
Publication of IL259146A publication Critical patent/IL259146A/en
Priority to PCT/IL2019/050467 priority patent/WO2019211833A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/085—Coaxial-line/strip-line transitions
IL259146A 2018-05-03 2018-05-03 Printed circuit board based high frequency rf coaxial transmission line using buried vias and method of fabrication thereof IL259146A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IL259146A IL259146A (en) 2018-05-03 2018-05-03 Printed circuit board based high frequency rf coaxial transmission line using buried vias and method of fabrication thereof
PCT/IL2019/050467 WO2019211833A1 (en) 2018-05-03 2019-04-25 Printed circuit board based high frequency rf coaxial transmission line using buried vias and method of fabrication thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IL259146A IL259146A (en) 2018-05-03 2018-05-03 Printed circuit board based high frequency rf coaxial transmission line using buried vias and method of fabrication thereof

Publications (1)

Publication Number Publication Date
IL259146A true IL259146A (en) 2018-06-28

Family

ID=66624890

Family Applications (1)

Application Number Title Priority Date Filing Date
IL259146A IL259146A (en) 2018-05-03 2018-05-03 Printed circuit board based high frequency rf coaxial transmission line using buried vias and method of fabrication thereof

Country Status (2)

Country Link
IL (1) IL259146A (en)
WO (1) WO2019211833A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111640682B (en) * 2020-05-31 2022-07-08 西南电子技术研究所（中国电子科技集团公司第十研究所） Gold wire bonding transition structure of separation device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE426894B (en) * 1981-06-30 1983-02-14 Ericsson Telefon Ab L M IMPEDANCY COAXIAL TRANSFER FOR MICROVAG SIGNALS
FI114585B (en) * 2000-06-09 2004-11-15 Nokia Corp Transfer cable in multilayer structures
US7868257B2 (en) * 2004-03-09 2011-01-11 Nec Corporation Via transmission lines for multilayer printed circuit boards
US7404250B2 (en) * 2005-12-02 2008-07-29 Cisco Technology, Inc. Method for fabricating a printed circuit board having a coaxial via

Also Published As

Publication number Publication date
WO2019211833A1 (en) 2019-11-07

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