IES990008A2 - Magnetic device for electrochemistry - Google Patents

Magnetic device for electrochemistry

Info

Publication number
IES990008A2
IES990008A2 IES990008A IES990008A2 IE S990008 A2 IES990008 A2 IE S990008A2 IE S990008 A IES990008 A IE S990008A IE S990008 A2 IES990008 A2 IE S990008A2
Authority
IE
Ireland
Prior art keywords
electrochemical cell
magnetic field
permanent magnets
electrodeposition
magnetic
Prior art date
Application number
Inventor
Gareth Hinds
John Michael David Coey
Original Assignee
John Michael David Coey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by John Michael David Coey filed Critical John Michael David Coey
Priority to IES990008 priority Critical patent/IES990008A2/en
Publication of IES81061B2 publication Critical patent/IES81061B2/en
Publication of IES990008A2 publication Critical patent/IES990008A2/en

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

A permanent magnet device is described which generates a magnetic field in the vicinity of the electrode of an electrochemical cell. The device may be used to increase the rate of electrodeposition and improve the morphology and electrical characteristics of the electrodeposit. By varying the magnitude and direction of the magnetic field, or by rotating the magnetic field created by the device it is possible to further control the quality of the electrodeposit.

Description

APPLICATION to..
Magnetic device for electrochemistry Abstract: A permanent magnet device is described which generates a magnetic field in the vicinity of the electrode of an electrochemical cell. The device may be used to increase the rate of electrodeposition and improve the morphology and electrical characteristics of the electrodeposit. By varying the magnitude and direction of the magneticfield, or by rotating the magnetic field created by the device it is possible to further control the quality of the electrodeposit.
Background of the invention Electrodeposition and electroplating of metal layers from ion-containing solutions are important industrial processes. Electroplating is used to produce decorative, protective, functional or hard coatings on various metallic substrates. It may also be beneficial to coat electrodes themselves with active layers in order to modify their characteristics. Another process is electropolymerization, where a polymeric deposit is produced electrochemicallyfrom solution. In all these processes, it is desirable to control the quality of the electrodeposit, including properties such as thickness, deposition rate, surface morphology, porosity, composition, mechanical properties, adherence and electrical conductivity. This is traditionally done by chemical and physical means such as use of chemical additives and choosing the composition and concentration of the electrolyte, the pH of the solution and the working voltage. Mechanical motion of the electode and stirring of the solution are sometimes used. Ultrasonic excitation in another such technique.
For example, in order to make interconnects in the semiconductor industry' it may be advantageous to use use electrodeposition instead of a physical deposition method for the metal layers, typically copper. In order to achieve smooth, uniform layers it is necessary to operate at a low plating rate and it is customary to include additives in the electrolytesolution which are known in the art.
There have been some reports in the electochemical literature that a steady magneticfield can influence the deposition rate of metals such as copper, silver and zinc. Examples are F. Z, Fahidy, Electrochimica Acta, vol 18, p.607 (1973); E. Chassaing and R Wiart, Electrochimica Acta, vo| 29, p.649 (1984); J. P. Chopart et al. Electrochimica Acta, vol 36, p.459 (1991);V. Noninski, Electrochimica Acta, vol 42. p.251 (1997); G Hinds et al, Journal of Applied Physics vol. 83, p.6447 (1998).
The present invention permits the control of deposition rates and other process parameters of electrodeposits by using permanent magnets to generate a suitable magne IE 990008 Description of the invention.
The invention consists of an electrochemical cell associated with an a permanent magnetaassembly which createsa magneticfield in the vicinity of an electrode, usually the cathode of the electrochemical cell. The permanent magnets may be immersed in the electrolyte and the magnets may be coated painted or cased in an inert material to avoid direct contact between the magnetic material and the electrolyte (Figure 1). Alternatively, the magnets may be mounted outside the cell (Figure 2). In that case segments of soft magnetic material may optionally be mounted inside the cell to concentrate and direct the magneticflux in the vicinity of the electrode (Figure3).
The permanent magnetb can be made of hexagonal ferrite, neodymium-ironboron, samarium-cobalt, samarium-iron-nitrogen, alnico or another permanent magnet material.The magnetic circuit is typically designed to deliver a magnetic field typically parallel or perpendicularto the electrode surface where electrodeposition is taking place. In the case of non-planar electrodes the field pattern may be chosen to fit the form of electrode. The direction of the field required may depend on the orientation of the electrode relative to the Earth’s surface. The principles of magnetic circuit design are known in the art; a reference is Advances in Permanent Magnetism by R. J. Parker, John Wiley, New York 1990.
In magnitude of the magnetic field required to exert an effective benficial influence on may be estimated form the dimensionless ratio R = Bj/gp, where B is the magnetic flux density in teslas, j is the current density at the electrode in amperes per square meter, g is the acceleration due to gravity amd p is the desnsity of the electrolye in kilograms per cubic meter. The magneticfield will be most effective when this ratio is in the range 0.1 - 10. A typical value is 1. Hence, for example, for a current density of 10,000 A/m2, a density of 1000 kg/m3and g ~ 10 m/s2 a field of 1 tesla will be effective.
By generatingthe magneticfield with a permanent magnetflux source, there are the advantages that no power supply with a continuous supply of energy is needed, and no cooling of the magnet is required. The flux source may produce a fixed or variable magneticfield, and the direction of the field may be varied during the electrodeposition process. In particular, it may be beneficial to rotate the field during electrodeposition. Variation of the field direction and magnitude may be achieved by moving the magnets.
Some examples of the implementation of the device are now disclosed. 1) Eleetrodepositionof copper was carried out from a 0.2 M solution of CuSOq at pH 1, using copperelectrodeswith a current density of approximately 20,000 A'm2. The cell was incorporated in a permanent magnet variable flux source incorporating two IE 990008 nested counter-rotating magnetic cylinders. The plateau current was recorded as a function of magnetic flux density from 0 - 1 T, with the results shown in Table 1.
Table I Magnetic flux density (T) 0 0.1 0.2 0.4 0.6 0.8 1.0 plateau current (mA) 44 59 76 84 96 104 111 2) The quality of the coppper electrodeposits obtained with and without the magnetic field was examined. Without the field, the plated surface of the cathode was irregular with areas of rapid dendritic growth. When a uniform field of 0.6 T was applied during electrodeposition in an electrochemical cell placed in a cylindrical segmented permanent magnet, the surface was smoother, and the dendrites were eliminated. The mean surface roughness was decreased from 2.2 microns to less than 1 micron. 3) The inf uenceof the magnetief eld is related to the the pH of the solution. The effect increases markedly at low pH. In a uniform field of 0.6 T applied during electrodeposition in an electrochemical cell placed in a cylindrical segmented permanent magnet, the variation of current with pH of the electrolyte solution is shown in Table2.
Table 2. pH of electrolyte solution Plateau current (mA) 3.0 2.5 2.0 1.5 1.0 0.8 0.6 110 129 140 4) By rotating the permanent magnet with respect to the electrochemical cell during electrodeposition at a frequency of approximately 1 Hertz, a further improvement in the deposition rate and the quality of the electrodeposit was observed. The rotation of the field is very convenient to achieve with the permanent magnet electrochemical cell, but would be very awkward in an electromagnet system.
These examples are intended to be illustrative. The permanent-magnet electrochemical cell of the invention can be applied in other ways, including electropolymerization of pyrrole for example, coating electodes with electoactive IE 990008 polymers and oxides, and generally when control of mass transport or redox reactions near the electrode is required.

Claims (5)

Claims.
1) An electrochemical cell for electrodeposition associated with a structure of permanent magnets and optionally soft magnetic matrial which produces a magnetic field at an electrode of the electrochemical cell, the magnetic flux density of the field being in the range 0.01 tesla to 2 tesla
2. ) An electrochemical cell for electrodeposition associated with a structure of permanent magnets and optionally soft magnetic matrial which produces a magnetic field at an electrode of the electrochemicalcell, the magnetic flux density of the field being varied by movement of the permanent magnets during an electrochemical process in the range from zero to a maximum not exceeding? teslaand optionallyin sign .
3. ) An electrochemical cell for electrodeposition associated with a structure of permanent magnets and optionally soft magnetic matrial which produces a magnetic field at an electrode of the electrochemical cell, the direction of the magnetic field being varied or continuously rotated during the course of electrolysis by movement of permanent magnets of the device.
4. ) An electrochemical cell for electrodeposition of copper or other good elecrical conductors which incorporates a structure of permanent magnets and optionally soft magnetic matrial which produces a magnetic field at the cathode of the electrochemical cell, the magnetic flux density of the field being in the range 0.01 tesla to 2 tesla and preferably in the range 0.2 to 1 teslaand optionally variable in magnitude and direction includingthe possibility of rotation during the course of electrodeposition.
5. ) An electrochemical process which is conducted in a magnetic field in the range 0.1 to 1 tesla in an electolytic solution of pH less than 1.5 with a current density in the range 100 to 100000 amperesper square meterwhere the direction of the magnetic field produced by a structure of permanent magnets is continuously rotated during the process.
IES990008 1999-01-05 1999-01-05 Magnetic device for electrochemistry IES990008A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
IES990008 IES990008A2 (en) 1999-01-05 1999-01-05 Magnetic device for electrochemistry

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IES990008 IES990008A2 (en) 1999-01-05 1999-01-05 Magnetic device for electrochemistry

Publications (2)

Publication Number Publication Date
IES81061B2 IES81061B2 (en) 2000-01-13
IES990008A2 true IES990008A2 (en) 2000-07-05

Family

ID=11041980

Family Applications (1)

Application Number Title Priority Date Filing Date
IES990008 IES990008A2 (en) 1999-01-05 1999-01-05 Magnetic device for electrochemistry

Country Status (1)

Country Link
IE (1) IES990008A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103184491A (en) * 2011-12-28 2013-07-03 北京有色金属研究总院 Electroplating apparatus applying external magnetic field on plating member and method
US20220093302A1 (en) * 2020-09-22 2022-03-24 U.S. Army Combat Capabilities Development Command, Army Research Laboratory Open-bore co-electrodeposition of metal matrix composite coatings using permanent magnets

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108103565A (en) * 2018-02-05 2018-06-01 深圳市瑞世兴科技有限公司 A kind of crystal grain refinement metal plating device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103184491A (en) * 2011-12-28 2013-07-03 北京有色金属研究总院 Electroplating apparatus applying external magnetic field on plating member and method
US20220093302A1 (en) * 2020-09-22 2022-03-24 U.S. Army Combat Capabilities Development Command, Army Research Laboratory Open-bore co-electrodeposition of metal matrix composite coatings using permanent magnets

Also Published As

Publication number Publication date
IES81061B2 (en) 2000-01-13

Similar Documents

Publication Publication Date Title
Grimmett et al. Pulsed Electrodeposition of Iron‐Nickel Alloys
EP1051543B1 (en) Method for electroplating metal coating(s) on particulates at high coating speed with high current density
Chiba et al. Magnetic field effects on the electrodeposition of nickel from a high pH watt's bath
CN1297495A (en) Apparatus and method for mfg. Ni-Fe alloy thin foil
EP0267972A1 (en) A method for the electrodeposition of an ordered alloy
Afshar et al. Electrodeposition of graphite-bronze composite coatings and study of electroplating characteristics
Böck et al. Effect of additive and current mode on surface morphology of palladium films from a non-aqueous deep eutectic solution (DES)
Yu et al. Effects of magnetic fields on the electrodeposition process of cobalt
Huang et al. Electrodeposition of nickel coating in choline chloride-urea deep eutectic solvent
CN100414003C (en) Method for preparing neodymium-iron-boron magnetic powder coated with metal layer by electrochemical deposition
Chin et al. A‐C modulation of a rotating zinc electrode in an acid zinc‐chloride solution
JP2002069689A (en) Method for electroplating on powder
Sartale et al. Room temperature preparation of NiFe 2 O 4 thin films by electrochemical route
IES990008A2 (en) Magnetic device for electrochemistry
Chiba et al. Inhibition by magnetic fields of the growth of zinc dendrites from alkaline zincate baths
Yang Effect of rapid cathode rotation and magnetic fields on crystal orientation in electrodeposited metals
Yermolenko et al. Galvanic ternary Fe-Co-W coatings: structure, composition and magnetic properties
JP3690975B2 (en) Organic plating method and organic plating product
Jorne et al. Suppression of dendrites and roughness during electrodeposition by impinging flow
CN114250489A (en) Method for preparing copper-iron alloy based on electrodeposition method
Hong-ru et al. FePt thin films electrodeposited from non-aqueous liquids
CN108796587B (en) Method and device for continuously preparing high-silicon steel thin strip
Musiani et al. Electrodeposited Tl2 O 3‐Matrix Composites: I. Effect of the Dispersed Phase on Nucleation and Growth of the Matrix
Budi et al. Electrodeposition of Ni-Nitride composite coatings: A review of recent study
JPH0230790A (en) Method for electrodepositing alloy

Legal Events

Date Code Title Description
MM4A Patent lapsed