IE981060A1 - Magnetic components and their production - Google Patents

Abstract

A magnetic component (20) has conductor windings (22a, 22b) surrounded by insulation (21). In addition, the component (20) has a magnetic plate (23a, 23b) on each side. This is applied using conventional PCB process techniques. The magnetic plates enhance the inductance of the component in a manner which may be controlled by setting the configuration of the plates. For example a plate may have a number of isolated sections. Also, the plates on each side may be interconnected by plated through holes to provide a closed core.

Description

Magnetic Components And Their Production Field of the Invention The invention relates to construction of magnetic components such as inductors and transformers, and to methods for producing them.

Prior Art Discussion Traditionally, such components have been produced by winding wire in various configurations. However, such a process can he labour intensive and repeatability is difficult, leading to wide tolerances.

It is also known to use planar material to produce magnetic components. For example. United States Patent Specification No. US3898595 (Cunningham Corporation) describes lamination of steel foils onto a baseboard and being patterned to form core shapes for reed relays, inductors, and transformers. Windings are formed by connecting conductor tracks on layers above and below the core layer by plated conductor through holes. Also. European Patent Specification No. EP756298 (Autosplice Systems) describes a process for producing magnetic components in which an insulating layer is cut out to provide recesses into which a toroidal core is added. In general, it appears that approaches which use planar materials tend to be quite complex. For example two plated through holes are required for each tum. It appears that there would be little flexibility in the manner in which characteristics of the component may be set by choice of production parameters.

Objects of the invention INT CL b riciE_ iJiLi -2One object is to provide a construction of magnetic component which provides good performance characteristics and which has a relatively flat profile.

Another object is that the component be easily integrated into a circuit board.

Another object is to provide a component production method which involves using conventional multilayer printed circuit board production techniques. z\ still further object is to provide improved flexibility in choice of operating 10 characteristics set by design and manufacturing parameters.

SUMMARY OF THE INVENTION According to the invention, there is provided a magnetic component comprising:15 a planar conductor shaped according to a component winding pattern; an insulating layer over the conductor; and a magnetic plate over the insulating layer.

Such a component provides excellent inductance characteristics In one embodiment, the component comprises an insulating layer and a magnetic plate on 25 both sides of the conductor.

Preferably, the magnetic plates are interconnected by magnetic material to provide a closed core. Ideally, the magnetic plates are interconnected by plated through holes. -3 In another embodiment, the magnetic plate comprises a plurality of isolated sections.

In one embodiment, corresponding sections on both sides of the component arc interconnected by magnetic material.

In one embodiment, the sections are shaped as disc sectors.

In one embodiment, the sectors are shaped as quadrants. In one embodiment, the magnetic plate is of NiFe material.

In one embodiment, the component comprises a plurality of magnetic plates separated by insulation on a side of the conductor According to another aspect, the invention provides a method of producing a magnetic component, the method comprising the steps oftapplying a planar conductor in a component winding pattern; applying an insulating layer over the conductor; and applying a magnetic plate over the insulating layer in a pattern to set characteristics of the magnetic component.

This method produces a magnetic component having excellent inductance characteristics. Also, by applying the magnetic plate in a pattern as described, the characteristics of the component may be set in a very simple and predictable manner.

Preferably, a plurality of conductors and associated insulating layers are formed, and the patterned magnetic plate is applied over an outer conductor. -4In one embodiment, an insulating layer and a magnetic plate are applied on both sides of the conductor.

In one embodiment, the magnetic plates are interconnected with magnetic material to provide a closed core.

Preferably, the plates are interconnected by plated through holes isolated from the conductor.

In one embodiment, the magnetic plate is applied as a plurality of isolated sections.

Preferably, the sections are shaped as disc sector's.

Preferably, the conductor, the insulating layer and the magnetic plate are applied in steps for producing a multilayer circuit board whereby the component is integrated into the board.

DETAILED DESCRIPTION OF THE INVENTION Brief Description of the Drawings The invention will be more clearly understood from the following description of some embodiments thereof, given by way of example only with reference to the accompanying drawings in which: Fig. 1 is a diagrammatic cross-sectional view of a magnetic component of the invention; -5Fig. 2 is a set of plan views showing parts of the component of Fig. I in more detail: Fig. 3 is a plan view of an alternative magnetic plate for a magnetic component of the invention: Fig. 4 is a diagrammatic cross-sectional view of an alternative magnetic component of the invention; Fig. 5 is a set of plan views showing parts of the component of Fig. 4 in more detail: Fig. 6 is a diagrammatic perspective view showing a magnetic component of Fig. 4: and Fig. 7 is a set of plan views of parts of a still further construction of magnetic component of the invention.

Referring to the drawings and initially to Figs. 1 and 2 there is shown a magnetic component 1 of the invention. The component 1 is integrated in a multilayer printed circuit board. It is produced using conventional multilayer printed circuit board production techniques because of the construction of the component itself. These production techniques are conventional and are not described in this document and instead the construction of the components is described in detail, from which it is clear why conventional multilayer circuit production techniques may be used.

The component 1 comprises a “prepreg” insulator 2 which supports two planar conductors 3(a) and 3(b), each of which is in the shape of a spiral winding as shown in Fig. 2. The insulator 2 insulates the windings of the conductors 3(a) and 3(b). The component 1 also comprises patterned magnetic plates 4(a) and 4(b) at the top and bottom -6sides of the component l. Finally, the conductors 3(a) and 3(b) comprise leads 5(a) and 5(b) respectively and a through-hole connection so that they are interconnected. The conductors 3(a) and 3(b) arc of copper material and they provide the windings of the component 1.

The magnetic plates 4(a) and 4(b) are of NiFe (permalloy) material.

The component 1 is produced by sequentially applying a conductor 3(a) or 3(b). an insulating layer, and subsequently a magnetic layer 4(a) or 4(b). These operations are performed in botli directions to provide the symmetrical structure illustrated. However, the structure may not be symmetrical and may include only one magnetic plate. At its simplest, therefore, the component may have a single conductor, a single insulating layer over the conductor, and a single patterned magnetic plate over the insulating layer. Also, the component may comprise a number of conductor/insulating layer pairs. It will be appreciated that the overall structure of the component is achieved by using conventional multilayer printed circuit board production techniques by simply bonding various layers as required to provide the component configuration.

The presence of the patterned magnetic plates 4(a) and 4(b) enhances inductance by providing a low reluctance path to magnetic flux around the conductor windings. The inductance characteristics of the component may be controlled by the choice of configuration of the or each magnetic plate. This provides a highly active and predictable level of control in a simple manner because it is achieved by simple plating and patterning steps.

Referring now to Fig. 3, the magnetic plate may be patterned to comprise a number of isolated sections. In this way. there is no complete path for eddv-currents to flow in opposition to currents flowing in the conductors windings. The purpose of patterning in this way is to disrupt eddy current flow so as to help prevent inductance reduction with - 7 frequency. In the embodiment of Fig. 3. a magnetic plate IO comprises four isolated quadrant-shaped sectors ll separated by radially extending gaps 12. The number of sections may be varied to set the inductance characteristics of the component. There is. of course, a trade off between the number of sections and the area of magnetic plate provided and an optimum configuration can be easily found for each type of component.

It will be appreciated that the invention provides for setting of inductance characteristics of the component by configuring the manner in which the magnetic plate is patterned ov er the insulation. This configuration may be achieved by using simple and conventional patterning techniques which are well know in the multilayer printed circuit board production industry.

Another option which is available to set the inductance characteristics is to provide a closed core by interconnecting the magnetic plates of both sides of the component. Such I 5 a scenario is illustrated in Figs. 4 to 7 inclusive. In Fig. 4 there is shown a magnetic component 20 comprising insulation 21 and a pair of copper conductors 22(a) and 22(b) in a spiral configuration, as for the component 1 shown in Fig. 1. The component 20 also comprises magnetic plates 23(a) and 23(b) which are interconnected by through holes 24 which are plated with magnetic material.

Interconnection of the magnetic plates provides a closed magnetic path so larger inductance values per unit area are achieved than for open-core structures. The high frequency performance of the component may be improved by patterning the magnetic plates as shown in Fig. 7. In Fig. 7, magnetic plates 30(a) and 30(b) are illustrated which comprise four quadrants as for the magnetic plate 10 shown in Fig. 3. The magnetic plates 30(a) and 30(b) are used with conductor windings 31(a) and 31(b).

It will be appreciated that the invention provides a very simple method for producing a magnetic component because conventional PCB processing techniques may be used. -8Also. the invention provides excellent control at the production stage because operating characteristics within a wide frequency range may be chosen by configuring the magnetic plate or plates as appropriate. Ίhis is achieved using conventional patterning techniques. Particularly good results are achieved at lower frequencies. At higher frequencies the inductance drops due to the conductivity of the magnetic plates, however, due to the magnetic plate patterning the results still represent an improvement over a component without magnetic material. Also, the invention achieves a component having a relatively fiat profile.

The benefits of the invention are now illustrated with reference to the table below . This table reflects the results of measuring inductance for five prototype components as fo I lows :(a) a component without magnetic material. (b) a component hav ing an architecture as illustrated in Fig. 1. (c) a component having plates with sections as shown in Fig. 3. (d) a component having a closed core, and (e) a component having magnetic plates as shown in Fig. 7 to provide a patterned closed core.

In all cases, the conductor windings comprise a two-layer circular spiral with 13 turns petlayer. The spiral has a track width and spacing of 100 pm and an outer diameter of 8.5mm. The magnetic layer has a circular outline with an outer diameter of 1 Omni. For the patterned components, the top and bottom magnetic layers are divided into four quadrants.

I kHz 10kHz 100kHz ΙΜΗζ (a) 4.4μΗ 3.87μΗ 3.78μΗ 3.77μΙ 1 (b) 11.3μΗ 10.4μΗ 2.6μΗ 0.28μΗ (c) 11.3μΗ 10.8μΗ 9.76μ11 4.2μΗ (d) 38.8μΗ 14.1 μΗ 2.1 1 μΗ .0.27μΗ (e, 93 μΗ 31.4μΗ 11,55μΗ 4.3μΗ The results for l kHz illustrate how beneficial it is to pattern the magnetic layers and use magnetic piated through holes. The inductance increases from 4.4uH to 93uH for a patterned closed core. As is clear from the right-hand column, the inductance is lower at higher frequencies, however, patterning achieves a performance comparable with components with no magnetic material. The production method may therefore be applied for a w ide component frequency range.

The invention is not limited to the embodiments described. The magnetic plates may be configured using conventional processing techniques to any shape or configuration desired to achieve the required inductance for the frequency of operation. For example, the layers may be applied in any suitable manner instead of bonding, such as by lamination. Also, multiple magnetic plates may be applied on each side, insulated from each other. This will provide a method to obtain high inductance values across a wide frequency range. In addition to the design patterning, further patterning may be carried out in order to trim inductance values, e.g. by using a laser. This type of patterning could be carried out in order to improve inductance tolerance or to provide in-circuit tuning of the component.

Claims (10)

Claims

1. A magnetic component comprising:5 a planar conductor shaped according to a component winding pattern: an insulating layer over the conductor; and a magnetic plate over the insulating layer.

2. A component as claimed in claim 1, wherein the component comprises an insulating layer and a magnetic plate on both sides of the conductor.

3. A component as claimed in claim 2, wherein the magnetic plates are 15 interconnected by magnetic material to provide a closed core.

4. A component as claimed in claim 3, wherein the magnetic plates are interconnected by plated through holes. 20 5. A component as claimed in any of claims 1 to 4, wherein the magnetic plate comprises a plurality of isolated sections.

5. Magnetic plates separated by insulation on a side of the conductor. I l. A method of producing a magnetic component, the method comprising the steps of:10 applying a planar conductor in a component w inding pattern: applying an insulating layer over the conductor: 15 applying a magnetic plate over the insulating layer in a pattern to set characteristics of the magnetic component. 12. A method as claimed in claim 11, wherein a plurality of conductors and associated insulating layers are formed, and the patterned magnetic plate is applied over an 20 outer conductor. 13. A method as claimed in claims 11 or 12, wherein an insulating layer and a magnetic plate are applied on both sides of the conductor. 25 14. A method as claimed in claim 13, wherein the magnetic plates are interconnected with magnetic material to provide a closed core. 15. A method as claimed in claim 14, wherein the plates are interconnected by plated through holes isolated from the conductor. - 12 16. A method as claimed in any of claims 11 to 15. wherein the magnetic plate comprises a plurality of isolated sections. 17. A method is claimed in claim 16, wherein the sections arc shaped as disc sectors. 18. A method as claimed in any of claims 11 to 17. wherein the conductor, the insulating layer and the magnetic plate are applied in steps for producing a multilayer circuit board whereby the component is integrated into the board.

6. A component as claimed in any of claims 3 to 5, wherein corresponding sections on both sides of the component are interconnected.

7. A component as claimed in claims 5 or 6, wherein the sections are shaped as disc sectors.

8. A component as claimed in claim 7, wherein the sectors are shaped as quadrants.

9. A component as claimed in any preceding claim, wherein the magnetic plate is of NiFe material. 10. A component as claimed in any preceding claim, comprising a plurality of

10. 19. A method as claimed in any of claims 11 to 18. comprising the further steps of applying a plurality of magnetic plates separated by insulating layers.