IE981004A1 - Wave soldering apparatus - Google Patents

Wave soldering apparatus

Info

Publication number
IE981004A1
IE981004A1 IE19981004A IE981004A IE981004A1 IE 981004 A1 IE981004 A1 IE 981004A1 IE 19981004 A IE19981004 A IE 19981004A IE 981004 A IE981004 A IE 981004A IE 981004 A1 IE981004 A1 IE 981004A1
Authority
IE
Ireland
Prior art keywords
circuit board
shroud
connector
wave
engagement
Prior art date
Application number
IE19981004A
Inventor
John Scanlan
Original Assignee
Dovatron Res & Dev Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dovatron Res & Dev Ltd filed Critical Dovatron Res & Dev Ltd
Priority to IE19981004A priority Critical patent/IE981004A1/en
Priority to GB9928453A priority patent/GB2345874B/en
Publication of IE981004A1 publication Critical patent/IE981004A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A wave soldering machine (1) has a conveyor for printed circuit boards (9) comprising a pair of spaced apart parallel endless chains mounted within associated guiderails (3). Circuit board support arms (5) mounted on each chain extend downwardly of the rails (3) and have at their lower ends grips (6) for engagement with opposite sides (7,8) of a printed circuit board (9) to carry the board (9) past a solder bath (10) to apply solder to an under side of a printed circuit board (9). A connector shroud (14) is releasably engageable with a connector (15) a leading edge of the printed circuit board (9), the shroud (14) having a slot (17) for engagement with the connector (15) to mount the shroud (14) on the circuit board (9) with a bottom edge of the shroud (14) positioned below a bottom face of the circuit board (9). <Figure 1>

Description

"Wave Soldering Apparatus" This invention relates to a wave soldering apparatus.
According to the invention there is provided a wave soldering apparatus comprising a wave solder machine with conveyor means having a pair of spaced-apart substantially parallel inclined endless chains with associated drive means to drive the chains along complementary guide rails, a plurality of circuit board support arms mounted side by side on each chain for engagement with opposite sides of a circuit board to support the circuit board between the chains, a solder bath with an associated solder heater and means for forming a solder wave between the arms for washing against an underside of a circuit board carried by the support arms past the wave, and a connector shroud for releasably mounting on a connector at a leading edge of a circuit board, the shroud having a body with a slot for engagement with the connector to mount the shroud on the circuit board with a bottom edge of the shroud positioned below a bottom face of the circuit board.
In one embodiment of the invention the shroud has a downwardly depending wave breaking flange at a front bottom edge of the body for engagement with a top of the wave to clear dross from the wave surface ahead of the circuit board.
Preferably the shroud has a rear abutment face for engagement with a front face of the connector and a rearwardly extending mounting lip at a top of the body for engagement with a top surface of the connector.
In another embodiment an inclined wave deflector plate is mounted at one of the chains adjacent the solder bath spaced below bottom edges of the board support arms and extending inwardly therefrom a preset distance, the plate laving an upturned flange at its inner end which extends upwardly of the solder wave such that as a circuit board is carried past the wave by the support arms, an inner edge of the board passes over the plate inwardly of the flange to mask gold connector tabs alpng the inner edge of the board as the board passes the solder wave.
Preferably the deflector plate is formed from titanium.
In a further embodiment the apparatus includes a circuit board carrier, the carrier comprising a panel with side edges adapted for engagement with the support arms of the conveyor, one or more stepped slots extending through the panel, each slot for reception of a circuit board which can be releasably secured within the slot by means of rotatable locking arms mounted at a periphery of the slot for engagement with an uppermost edge of a circuit board mounted in the slot, the slot being arranged to support the circuit board in a desired orientation between the support arms.
Preferably the slot is arranged to support the circuit board with a side edge of the circuit board disposed at an offset angle to the direction of travel of the board through the wave.
In another embodiment the apparatus further includes a cleaner downstream of the wave solder machine having an endless mesh conveyor for delivery of a circuit board through a cleaning tunnel, a plurality of spray heads for spraying cleaning fluid at circuit boards on the conveyor, a circuit board cleaning support comprising a pair of hingedly connected mesh panels with locking means for securing free outer edges of the panels together, a plurality of spaced-apart shaped circuit board holders mounted on an inside face of one of the panels, each holder for reception of a complementary circuit board.
In another aspect the invention provides a method for manufacturing circuit boards using the apparatus described herein.
In a further aspect the invention provides circuit boards whenever produced by the apparatus or method of the invention.
The invention will be more clearly understood by the following description of some embodiments thereof, given by way of example only, with reference to the accompanying drawings, in which:- Fig. 1 is a detail perspective view of a conveyor portion of wave soldering apparatus according to the invention; Fig. 2 is a perspective view of a connector shroud forming portion of the apparatus; Fig. 3 is an elevational view of the shroud; Fig. 4 is an end view of the shroud; Fig. 5 is a sectional view illustrating the shroud mounted on a circuit board; Fig. 6 is a plan view of a circuit board carrier forming portion of the apparatus; and Fig. 7 is a perspective view of a circuit board cleaning support forming portion of the apparatus.
Referring to the drawings, there is illustrated a wave soldering apparatus according to the invention comprising a wave solder machine indicated generally by the reference numeral 1. the wave solder machine 1 comprises a housing within which is mounted conveyor means comprising a pair of spaced-apart substantially parallel inclined endless chains mounted within associated guide rails 3 and having drive means for movement of the chains through the guide means 3. A plurality of circuit board support arms 5 are mounted side by side on each chain and extend downwardly through an opening in the bottom of the rail 3 ancj having at their lower end a grip 6 for engagement with opposite sides 7, 8 of a circuit board 9 to support the circuit board 9 between the two parallel sets of travelling board support arms 6.
A solder bath 10 with an associated solder heater and means for forming a solder wave 11 is mounted between the two sets of arms 6 for washing against an underside of a circuit board 9, shown in broken outline in Fig. 1, carried by the support arms 6 past the wave 11 along an inclined path in the direction of arrow A, Thus, the wave 11 washes against the lower face of the circuit board 9 to apply solder to an underside of the circuit board 9.
A connector shroud 14 is provided for mounting on a connector 15 at a leading edge of the circuit board 9. The shroud 14 has a body 16 with a slot 17 for engagement with the connector 15 to mount the shroud 14 on the circuit board 9 with a bottom edge of the shroud 14 below a bottom face 18 of the circuit board 9, The shroud 14 has a downwardly extending wave breaking flange 20 at a front bottom edge of the body 16 for engagement with a top of the wave 11 to clear dross from the wave surface ahead of the circuit board 9. A rear abutment face 22 is engagable with a front face 23 of the connector 15. It will be noted from Fig. 5 that the connector 15 extends beyond a front edge of the circuit boarcl 9 and a rearwardly extending ledge 25 is provided at a bottom of the body 16 to abut a front edge of the circuit board 9. At a top of the body 16, a rearwardly extending mounting lip 26 is provided for engagement with a top surface of the connector. This flange 26 prevents pivoting of the shroud 14 keeping the ledge 25 in engagement with the leading edge of the circuit board 9 during soldering, it will be noted that the slot 17 is elongated to accommodate different mounting positions of the connector 15 along the front edge of the circuit board 9.
Referring to Fig. 1, an inclined wave deflector plate 30 is mounted at one of the rails 3 adjacent the solder bath 10 and spaced below bottom edges of the board support arms 6. The deflector plate 30 extends inwardly from the board support arms a preset distance. An upturned flange 31 is provided an inner edge of the plate 30. This flange 31 extends upwardly of the solder wave 11 such that as a circuit board 9 is carried past the wave 11 by the support arms 6, an inner edge 33 of the circuit board 9 passes over the plate 30 inwardly of the flange 31 to mask gold connector tabs 35 along the inner edge 33 of the circuit board 9 as the circuit board 9 passes the solder wave 11. The plate 30 is preferably formed from titanium.
Referring to Fig. 6, there is shown a circuit board carrier 40 comprising a panel 41 with side edges 42, 43 adapted for engagement with the support arms 6 of the conveyor. A number of stepped slots 44 extend through the panel. Each slot 44 is for reception of a complementary circuit board 9 which can be releasably secured within the slot 44 by means of rotatable locking arms 46 at a periphery of the slot 44. Upon insertion of the circuit board 9 into the slot 44, the circuit board 9 fits against a retaining ledge 48 at a bottom of the slot 44. The locking arms 46 are' then rotated inwardly to engage an uppermost edge of the circuit board 9 and clamp the circuit board 9 within the slot 44. It will be noted that the circuit boards 9 can be arranged in an angled orientation on the carrier 40. This is particularly advantageous where pins which project downwardly from the circuit board for soldering are closely spaced together in rows. Conveniently, by angling the circuit board 9, the distance between the pins in the direction of travel of the circuit board is increased to eliminate the possibility of solder bridging between adjacent pins as the board 9 is delivered over the wave 11.
Referring now to Fig. 7, there is illustrated a circuit board cleaning support 50 comprising·3,pair of,h.ingedly connected, mesh panels, 5-1, 52 with locking ’conried0rs54‘fdf securing free outer edges of the panels 51, 52 together. A number of spaced-apart circuit board holders 56 which in this case are cylindrical are mounted on in inside face of the panel 52. £ach holder 56 is for reception of a complementary circuit board which nests within the holder 56 and is secured between the panels 51, 52 for washing. The circuit board cleaning support 50 can then be delivered through a cleaner while securely supporting the circuit board!. The cleaner comprises an endless mesh conveydr for delivering circuit boards through a cleaning tuhnei. A plurality of spray heads for spraying cleaning fluid on the circuit boards are Spaced-apart within the tunnel. As the cleaning support 50 passes through the tunnel, the circuit boards within the holders 56 are, securely held while they are sprayed with cleaning fluid.
The invention Is hot limited to ihl embodiments hereinbefore described which may be varied in both Construction arid detail.
IE19981004A 1998-12-01 1998-12-01 Wave soldering apparatus IE981004A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
IE19981004A IE981004A1 (en) 1998-12-01 1998-12-01 Wave soldering apparatus
GB9928453A GB2345874B (en) 1998-12-01 1999-12-01 Wave soldering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IE19981004A IE981004A1 (en) 1998-12-01 1998-12-01 Wave soldering apparatus

Publications (1)

Publication Number Publication Date
IE981004A1 true IE981004A1 (en) 2000-07-12

Family

ID=11041946

Family Applications (1)

Application Number Title Priority Date Filing Date
IE19981004A IE981004A1 (en) 1998-12-01 1998-12-01 Wave soldering apparatus

Country Status (2)

Country Link
GB (1) GB2345874B (en)
IE (1) IE981004A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110062536A (en) * 2019-05-08 2019-07-26 格力电器（郑州）有限公司 A kind of skates line apparatus and welding equipment for crest welder

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4068792A (en) * 1977-04-28 1978-01-17 Burroughs Corporation Device for protecting the edge connectors of printed circuit boards during wave soldering
US4340164A (en) * 1980-05-29 1982-07-20 Texas Instruments Incorporated Mask for an attachable, circuit-terminating, circuit board edge member
US4457466A (en) * 1982-06-01 1984-07-03 Gte Automatic Electric Inc. Mask for protecting tab contacts of circuit boards
US5715592A (en) * 1994-11-08 1998-02-10 Nec Corporation Parts disassembling apparatus
NL1001090C2 (en) * 1995-08-29 1997-03-04 Soltec Bv Transport device with fixation finger.
US5820013A (en) * 1996-07-01 1998-10-13 Innovative Soldering Technologies Adjustable support apparatus for wave soldering of printed circuit boards

Also Published As

Publication number Publication date
GB2345874A (en) 2000-07-26
GB2345874B (en) 2003-08-27
GB9928453D0 (en) 2000-01-26

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Legal Events

Date Code Title Description
MM9A Patent lapsed through non-payment of renewal fee