IE58759B1 - Curable compositions containing a polyepoxide and a halogenated dihydric phenol and impregnated substrates and laminates prepared therefrom - Google Patents

Curable compositions containing a polyepoxide and a halogenated dihydric phenol and impregnated substrates and laminates prepared therefrom

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Publication number
IE58759B1
IE58759B1 IE243385A IE243385A IE58759B1 IE 58759 B1 IE58759 B1 IE 58759B1 IE 243385 A IE243385 A IE 243385A IE 243385 A IE243385 A IE 243385A IE 58759 B1 IE58759 B1 IE 58759B1
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IE
Ireland
Prior art keywords
formula
epoxy resin
dihydric phenol
polyepoxide
curable compositions
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IE243385A
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IE852433L (en
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Dow Chemical Co
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Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of IE852433L publication Critical patent/IE852433L/en
Publication of IE58759B1 publication Critical patent/IE58759B1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3218Carbocyclic compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41Compounds containing sulfur bound to oxygen
    • C08K5/42Sulfonic acids; Derivatives thereof
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2213Coating or impregnation is specified as weather proof, water vapor resistant, or moisture resistant
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/20Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
    • Y10T442/2549Coating or impregnation is chemically inert or of stated nonreactance
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3382Including a free metal or alloy constituent
    • Y10T442/3415Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the woven fabric]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/30Woven fabric [i.e., woven strand or strip material]
    • Y10T442/3472Woven fabric including an additional woven fabric layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/654Including a free metal or alloy constituent
    • Y10T442/656Preformed metallic film or foil or sheet [film or foil or sheet had structural integrity prior to association with the nonwoven fabric]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/60Nonwoven fabric [i.e., nonwoven strand or fiber material]
    • Y10T442/659Including an additional nonwoven fabric
    • Y10T442/67Multiple nonwoven fabric layers composed of the same inorganic strand or fiber material

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Curable compositions are disclosed which comprise a polyglycidyl ether such as the triglycidylether of tris(hydroxyphenyl)methane and a halogenated dihydric phenol such as tetrabromobisphenol A. These compositions can be cured by heating in the presence or absence of catalyst for reacting epoxy groups with phenolic hydroxyl groups such as 2-methyl imidazole. These compositions are particularly useful in the preparation of electrical laminates.

Description

The present invention pertains to curable compositions containing polyglycidyl ethers of a polyphenol and halogenated bisphenols.
US-A-4,438,254 describes novolac resins wherein difunctional epoxides are reacted with phenols or thiophenols to advance the resin. The resins cure upon reaction with an added curing agent to thermoplastic polymers.
FR-A-1,325,223 refers to novolac resins wherein the B-staging occurs so rapidly that a laminate cannot be prepared therefrom.
The references do not describe trisepoxides.
Compositions containing glycidyl ethers of bisphenols and halogenated bisphenols have been employed in the preparation of electrical laminates. However, they are usually lacking in one or more properties such as, for example, thermal performance, moisture resistance and high temperature mechanical strength.
It is the object of the present invention to provide a curable composition which results in cured compositions having an improvement in one or more of the properties selected from thermal stability, glass transition temperature, elevated temperature mechanical strength, moisture resistance, chemical resistance and toughness.
This object is attained by a curable composition characterized by comprising (A) at least one of (1) at least one epoxy resin represented by the following formulas I, II, IV, V or VI: FORMULA I s B-C B H OH H Q . , , B-O-C—C-C-O-B-C < ι t Η Η H FORMULA II formula IV 2 ( I B-C-C-B I I Β B FORMULA V H 2 Η Ο H Q Q B-C-C-B"—O-C—C-C-O-B-C-C-B Λ Λ * ’ 1 ι » Β Β H R Η Β B FORMULA VI ( K · ) , Η R Η each Ε is represented by the formula Ο H / \ .
H-C-C-C-O I f f each E' is represented by the f crynul Η O ' / \ O-C-C-C-H (R’ )s each B" is represented by the formula - 5 and each Q is independently hydrogen or a hydrocarbyi group having from 1 to 10 carbon atoms; each R is independently hydrogen or an alkyl group having from 1 to 4 carbon atoms; each R' is independently hydrogen, a hydrocarbyi or hydrocarbyloxy group having from 1 to 10 carbon atoms or a halogen; m has a value of n-1; m' has a value of n'-l; m has a value of n-l; each n, n' and n independently has a value from zero to 3; q has a value from zero to 4 and each z and z' independently has a value from zero to 3; (2) the reaction product of (a) at least one epoxy resin as defined in component (A-l) and (b) at least one dihydric phenol represented by the following formulas VII or VIII: FORMULA VII OH (Y)4- -OH FORMULA VIII OH OH (Y)4" HA>n- MY>4 wherein each Y is independently hydrogen, a halogen or a hydrocarbyi or hydrocarbyloxy group having from 1-10 carbon atoms and n has a value of zero or 1 and each A is independently a divalent hydrocarbyi group having from 1-12 carbon atoms, - 6 Ο Ο II II -S-, -S-S-, -S-, -S-, If ο ο II -C- or -Ο-; and wherein components (A-2-a) and (A-2-b) are present in quantities such that the ratio of phenolic hydroxyl groups to epoxide groups is from 0.01 : 1 to 0.5 : 1; or (3) mixtures thereof; and (B) at least one halogenated dihydric phenol represented by the following formulas IX or X: FORMULA IX OH (Y) x OH FORMULA X wherein A, Y and n are as defined above; each X is a halogen; and wherein components (A) and (B) are present in quantities such that the ratio of phenolic hydroxyl groups to epoxide groups is from 0.7 : 1 to 1.1 : 1.
In the formula n is preferably 1 and q is preferably from 0.1 to 2 and more preferably from 0.5 to 1.5.
The components (A-2a) and (A-2b) are present in quantities such that the ratio of phenolic hydroxyl groups to epoxide groups is preferably from 0.05 : 1 to 0.25 : 1, most preferably from 0.1 : 1 to 0.2 : 1.
The components (A) and (B) are present in quantities such that the ratio of phenolic hydroxyl groups to epoxide groups is preferably from 0.85 : 1 to 1 : 1, most preferably from 0.9 : 1 to 0.95 : 1.
Optionally, the composition additionally comprises (C) a catalytic quantity of from 0.001 to 20 percent by weight based on the weight of the reactants of at least one catalyst for effecting the reaction between components (A) and (B); and (D) from zero to 50, preferably from 10 to 45, most preferably from 30 to 40, percent by weight based on the combined weight of components (A), (B), (C) and (D) of at least one solvent.
The present invention also pertains to substrates impregnated with the aforementioned compositions and to laminates prepared therefrom.
A preferred composition is characterized in that component (A) is component (A-l) represented by formula I or II wherein Q and R are hydrogen; Β,Β',Β,η,η',n, m,m',m,z and z' are as defined before; q has an average value of from 0.1 to 2 and component (B) is represented by formula X wherein A is a divalent hydrocarbyl group having from 1 to 6 carbon atoms, each X is bromine and n has a value of 1 and Y is as defined before.
Another preferred composition is characterized in that component (A) is component (A-l) represented by formula IV or V wherein each Q and R are hydrogen, B and B are as defined before, - 8 and component (B) is represented by formula X wherein A is a divalent hydrocarbyl group having from 1 to 6 carbon atoms; each X is bromine and n has a value of 1 and Y is as defined before.
A further composition is characterized in that component (A) is component (A-l) represented by formula VI wherein each Q,R and R1 is hydrogen and component (B) is represented by formula X wherein A is a divalent hydrocarbyl group having from 1 to 6 carbon atoms; each X is bromine and n has a value of 1 and Y is as defined before.
Particularly suitable epoxy resins which can be employed herein include, for example, the triglycidyl ether of tris(hydroxyphenyl)methane, higher molecular weight homologs thereof, trisepoxides advanced with dihydric phenols, and mixtures thereof.
Particularly suitable dihydric phenols and halogenated dihydric phenols include, for example, bisphenol A, tetrabromobisphenol A, bisphenol S, tetrabromobisphenol S, biphenol, tetrabromobi pheno1, tetrabromodi hydroxybenzophenone, resorci no1, tetrabromoresorcinol, and mixtures thereof.
Multifunctional phenolic compounds, those having an average functionality of greater than 2, can be employed in this invention together with the diphenolic compounds, if desired, so as to change ι the cure behaviour of the composition. Particularly suitable multifunctional phenolic compounds include, for example, phenol-formaldehyde condensation products having an average functionality of from 3 to 8, phenol hydroxybenzaldehyde condensation products having an average functionality of from 3 to 7 and cresolformaldehyde condensation products having an average functionality of from 3 to 8.
Suitable catalysts for effecting the reaction between the epoxy resin and the phenolic hydroxyl-containing compound include, for example, those disclosed in U.S. -A- 3,306,872; 3,341,580; 3,379,684; 3,477,990; 3,547,881; 3,637,590; 3,843,605; 3,948,855; 3,956,237; 4,048,141; 4,093,650; 4,131,633; 4,132.706; 4,171,420; 4,177,216; 4,302,574; 4,320,222; 4,358,578; 4,366,295 and 4,389,520. - 9 Particularly suitable catalysts are those quaternary phosphonium and ammonium compounds such as, for example, ethyltriphenylphosphonium chloride, ethyltriphenylphosphonium bromide, ethyltriphenylphosphonium iodide, ethyltriphenylphosphonium acetate, ethyltriphenylphosphonium diacetate (ethyltriphenylphosphonium acetate'acetic acid complex), ethyl tri phenylphosphon i um tetrahaloborate, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium diacetate (tetrabutylphosphonium acetate’acetic acid complex), tetrabutylphosphonium tetrahaloborate, butyltriphenylphosphonium tetrabromobisphenate, butyltriphenylphosphonium bisphenate, butyltriphenylphosphonium bicarbonate, benzyltrimethylammonium chloride, benzyltrimethylammonium hydroxide, benzyltrimethylammonium tetrahaloborate, tetramethylammonium hydroxide, tetrabutyl ammonium hydroxide, tetrabutylammonium tetrahaloborate, and mixtures thereof.
The catalyst, when used, is employed in a catalytic quantity of from 0.001 to 10, more preferably from 0.05 to 5 percent by weight based upon the weight of the reactants.
Other suitable catalysts include tertiary amines such as, for example, triethylamine, tripropylamine, tributylamine, 2-methylimidazole, benzyldimethylamine, and mixtures thereof.
Other suitable catalysts include ammonium compounds such as, for example, triethyl ammonium chloride, triethylammonium bromide, triethylammonium iodide, triethylammonium tetrahaloborate, tri butylammonium chloride, tributylammonium bromide, tributylammonium iodide, tributylammonium tetrahaloborate, N,N'-dimethyl-l,2-diaminoethane tetrahaloboric acid complex, and mixtures thereof.
Other suitable catalysts include quaternary and tertiary ammonium, phosphonium, and arsonium adducts or complexes with suitable non-nucleophilic acids such as, for example, fluoboric, fluoarsenic, fluoantimonic, fluophosphoric, perchloric, perbromic, periodic, and mixtures thereof.
Suitable solvents which can be employed herein include, for example, ketones, alcohols, glycol ethers and amides, such as, for example, acetone, methyl ethyl ketone, methanol, propylene glycol mono methyl ether and dimethyl formamide.
The compositions of the present invention may also contain, if desired, stabilizers, pigments, dyes, mould release agents, flow control agents, reinforcing agents, fillers, fire retardant agents, rubber modifiers, surfactants, accelerators, reactive diluents, and mixtures thereof.
Suitable stabilizers which can be employed herein, are those represented by the formula XI. (RMS o II S-OR2 c wherein each R' is independently hydrogen, a hydrocarbyl group having 2 from 1 to 10 carbon atoms or a halogen and R is a hydrocarbyl group having from 1 to 10 carbon atoms.
Particularly suitable stabilizers include, for example, methyl p-toluene sulfonate, ethyl p-toluene sulfonate, methyl chlorobenzene sulfonate, and combinations thereof. Preferably the stabilizer is methyl p-toluene sulfonate.
The stabilizer component, when used, is employed in a stabilizing quantity of from 0.001 to 10, more preferably from 0.01 to 2, percent by weight based upon the weight of the epoxy resin component.
The compositions of the present invention are suitable for such applications as impregnating substrates and as coatings, adhesives, castings, mouldings, electronic encapsulations and in potting compositions.
Suitable substrates which can be employed herein include, for example, fibres or filaments in woven, matt or non-woven form of glass, carbon, graphite, synthetic fibres, quartz, and combinations thereof. The impregnated substrates can be cured employing conditions known in the art.
Structural or electrical laminates or composites can be prepared from one or more layers of cured impregnated substrates or a combination of substrates. The electrical laminates usually have at least one external layer of an electrically conductive material. The electrically conductive material is preferably copper.
The following examples are illustrative of the invention.
Fracture Toughness Measurement (G^q) The method for measuring Gjq (fracture toughness or "critical strain energy release rate) is an adaptation of ASTM E-399 for plastics materials from the original usage with metals. The compact tension test is now widespread in usage and is described in the J. Mater. Sci., Vol. 16, 2657, 1981. An individual test piece is cut as an approximate 25.4 mm (1 square) from a flat casting usually of 3.175 mm (l/8") thickness. A dovetail notch is cut into one edge, centered, about 6.25 mm (1/4) in depth. Next, a razor blade is inserted into this notch and tapped to produce a precrack. Two holes are then drilled adjacent to the dovetail as indicated in ASTM E-399, allowing the test piece to be pinned into position in the Instron test machine. Extension of the sample now allows the force required to propagate opening of the precrack to be measured, using a test speed of 0.0085 mm/sec. (0.02 inches/minute). This force is used in the equation given in ASTM E-399, along with the required sample dimensions and actual precrack length, to calculate a stress intensification factor Kq. This is then combined with the tensile modulus and Poisson's ratio for the material to give the value for G|q, usually reported in ergs/cnr x 10° or kJ/m . A scale comparing typical values for for various plastics and metals is given in reference Lee, L. H., Physiochemical Aspects of Polymer Surfaces, K. L. Mittal, ed. Plenum Press, New York, N.Y., 1983.
The Tg was determined by Differential Scanning Calorimetry using a calibrated DuPont Instrument (Model No. 912 with a 1090 controller). Samples were run under a nitrogen atmosphere with a heat-up rate of 10°C per min. (0.1667°C/sec.).
Coefficient of thermal expansion (CTE) was determined using a calibrated DuPont Thermal Mechanical Analyzer (Model No. 943 with a 1090 controller).
Decomposition properties were determined using a DuPont Thermal Gravimetric Analyzer (Model No. 951 with a DuPont 1090 controller).
Dynamic mechanical properties were measured on a DuPont Dynamic Mechanical Analyzer (Model No. 982 with a DuPont 1090 controller).
The following components were employed in the Examples and Comparative Experiments.
Epoxy Resin A was a polyglycidyl ether of a phenolhydroxybenzaldehyde condensation product having an EEW of 220 and an average functionality of 3.5.
Epoxy Resin B was a polyglycidyl ether of a phenolhydroxybenzaldehyde condensation product having an EEW of 162 and an average functionality of 3.2.
Epoxy Resin C was an advanced epoxy resin made by advancing Epoxy Resin B with tetrabromobisphenol A to an EEW of 215.
Epoxy Resin D was a polyglycidyl ether of a phenol- 13 hydroxybenzaldehyde condensation product having an EEW of 204 and an average functionality of 3.4.
Epoxy Resin E was an advanced epoxy resin made by advancing Epoxy Resin B with tetrabromobisphenol A to an EEW of 239.
Epoxy Resin F was a polyglycidyl ether of a dimethyl phenolhydroxybenzaldehyde condensation product having an EEW of 185 and an average functionality of 3.
Epoxy Resin G was a polyglycidyl ether of a dimethyl phenoldimethylbenzaldehyde condensation product having an EEW of 189 and an average functionality of 3.
EXAMPLE 1 56.87 Grams (0.209 equiv.) of tetrabromobisphenol A (TBBPA) was stirred into 50 grams (0.227 equiv.) of Epoxy Resin A at 150°C until the TBBPA had completely dissolved (about 180 seconds). Then 0.214 g of a 70 percent methanol solution of tetrabutylphosphonium acetate‘acetic acid complex was added and mixed. The solution was then degassed. The resultant mixture was then poured into an aluminium mould which had been treated with Fluoroglide release agent and which had been preheated to about 175°C. The mould was clamped together at 2.175 mm (1/8) spacing. The filled mould was then placed in a 200°C oven for 2 hours (7200 s). After cooling to room temperature, the casting was removed and physical properties obtained. The results were as follows: G1q = .51 kJ/m2 Tg = 180°C coefficient of thermal expansion below 100°C was 65 ppm/°C.
EXAMPLE 2 Ai. VARNISH FORMULATION grams (9.944 equiv.) of a 75 percent solution of the trisepoxide in Example 1 in methyl ethyl ketone; 2917 4048 grams (8.929 equiv.) of a 60 percent solution of TBBPA in methyl ethyl ketone; 3.3 grams of 2-methyl imidazole; and 200 grams of acetone.
The above mixture had a viscosity of 21 seconds measured in a No. 2 Zahn cup at (75°F) 23.9°C.
EL PREPARATION OF PREIMPREGNATED SUBSTRATE Burlington style 7628 glass cloth with an 1617 finish was impregnated with the varnish formulation of Example 2-A in a forced air vertical treater having a total length of 7.9 meters (26 feet) with the first 5.9 meters (19.5 feet) heated to 176.7°C (350°F) at a rate of 61 mm/sec (12 feet per min.). The resin contained in the impregnated glass cloth had a 73 second gel time at 171°C.
The resultant impregnated glass cloth had a resin content of 47 percent by weight.
PREPARATION OF LAMINATE Both unclad (no copper) and one sided copper clad, 1.57 mm (0.062) thick laminates were pressed from aforementioned prepreg. Eight 304.8 mm x 304.8 mm (12 inch by 12 inch) plies were pressed into laminate form. The copper foil was a 28.35 g (1 ounce) zinc oxide treated material. The laminates were pressed in a preheated Wabash press at 176.7°C (350°F) and 3.45 MPa (500 psi) for 1 hour (3600 s).
There was no post-cure.
The unclad laminate had the following properties. 1. Tg = 180°C 2. Dynamic decomposition temperature was 314°C (run at 3°C/min., 0.05°C/sec.). 3. Decomposition stability at 250°C over a 60 min. (3600 s) period was excellent. 4. Z-axis coefficient of thermal expansion was 46.7 (ppm/°C( oC j)).
. Maintained 95 percent of original storage modulus up to 157°C. 6. The relative moisture resistance was determined by placing 3' 50.8 x 101.6 mm (2 x 4) unclad laminate coupons in a pressure pot at 103 kPa (15 psi) steam pressure for 2 hours (7200 s). After 2 hours (7200 s), the compounds were removed, externally dried and dipped in molten solder at 260°C (500°F) for 20 seconds. Each side of the 3 coupons was then inspected for any delamination blisters.
The results were reported as No. of sides with no blisters divided by total No. of sides. This system had a perfect 6/6 or 100 percent passed.
The clad laminate had a copper peel strength of 700 to 841 N/m (4 to 4.8 Ibs/in).
EXAMPLE 3 /L VARNISH FORMULATION A varnish formulation was prepared from the following. 2532 grams (8.833 equiv.) of a 75 percent solution of Epoxy Resin C in methyl ethyl ketone; 3808 grams (8.40 equiv.) of a 60 percent solution of TBBPA in methyl ethyl ketone; 8.55 grams of ethyltriphenylphosphonium acetate The above mixture had a viscosity of 20 seconds measured in a No. 2 Zahn cup at 23.9°C (75°F).
Ik PREPARATION QF PREIMPREGNATED SUBSTRATE Burlington style 7628 glass cloth with an 1617 finish was impregnated with the varnish formulation of Example 3-A in a forced air vertical treater having a total length of 7.9 meters (26 feet) with the first 5.9 meters (19.5 feet) heated to 176.7°C (350°F) at a rate of 50.8 mm/sec (10 feet per min.). The resin contained in the impregnated glass cloth had a 97 second gel time at 171°C.
The resultant impregnated glass cloth had a resin content of 44.4 percent by weight. (λ PREPARATION OF LAMINATE Laminates, both unclad and one sided copper clad, were prepared in the same manner described in Example 2-C.
The unclad laminate had the following properties: 1. Tg = 184°C 2. The relative moisture resistance was determined in the same manner noted in Example 2, property no. 6. This system had a perfect 8/8 or 100 percent pass for 4 coupons.
The clad laminate had a copper peel strength of 841 to 981 N/m (4.8 to 5.6 Ibs/in).
EXAMPLES 4-9 These examples were prepared in a manner similar to Example 1 employing the components and conditions of the following Table 1.
The properties of the resultant product are also given in the Table 1. - 17 TABLE I COMPONENTS CONDITIONS AND RESULTS EXAMPLE 4 EXAMPLE 5 EXAMPLE 6 Epoxy Resin type/grams/equ i v. D/5.013/0.0246 D/5.050/0.0248 B/7.482/0 Tetrabromobisphenol A, grams/equiv. 6.682/0.0246 6.733/0.0248 12.562/0. Catalyst, type/grams ΒϋΜΑ^Ο.ΟΙδ None BDMA/0.22 Mixing Conditions, °C/sec. 175/120 175/120 175/120 3 Curing Conditions , °C/sec. 180/3600 180/3600 180/3600 225/9000 225/9000 225/9000 Tg, °C 189.4 175 178 1. BDMA is benzyldimethylamine (10 percent solution in methanol) 2. TBPA is a 70 percent solution of tetrabutylphosphonium acetate’acetic acid complex in methanol 3. After mixing, the clear resin system was poured into a small aluminum mould for curing.
TABLE I (Cont.) COMPONENTS CONDITIONS AND RESULTS EXAMPLE 7 EXAMPLE 8 EXAMPLE 9 Epoxy Resin type/grams/equ i v. E/5.447/0.0288 F/5.819/0.0315 G/5.176/0.0273 Tetrabromobisphenol A, grams/equiv. 6.204/0.0228 8.574/0.0315 7.433/0.0273 Catalyst, type/grams BDMA/0.016 BDMA/0.017 BDMA/0.015 Mixing Conditions, °C/sec. 175/120 175/120 175/120 3 Curing Conditions , °C/sec. 180/3600 180/3600 180/3600 225/9000 225/9000 225/9000 Tg, °C 178 180 191 1. BDMA is benzyldimethylamine (10 percent solution in methanol) 2. TBPA is a 70 percent solution of tetrabutylphosphonium acetate'acetic acid complex in methanol 3. After mixing, the clear resin system was poured into a small aluminum mould for curing.
EXAMPLE 10 A formulation was made consisting of 100 g (0.4545 equiv.) of Epoxy Resin A, 114 g (0.41829 equiv.) of tetrabromobisphenol A and 110 g of methyl ethyl ketone. The resin solution was studied to determine its stability at 25°C and at 50°C. This stability was related to changes in the percent epoxide over a period of time. Also, methyl-p-toluene sulfonate was added to portions of the solution to determine its effects on the stability of the resin system. The results are given in Table II.
TABLE II STABILITY AT 25°C (NO STABILIZER) Time % Epoxide 6.3 days (172,800 s) 6.2 days (2,332,800 s) 6.0 days (7,776,000 s) 5.6 STABILITY AT 50°C (NO STABILIZER) Time % Epoxide 6.3 days (172,800 s) 6.1 days (2,332,800 s) 6.0 days (7,776,000 s) 5.6 STABILITY AT 50°C (WITH STABILIZER *) Time % Epoxide 6.3 days (172,800 s) 6.2 days (2,332,800 s) 6.1 days (7,776,000 s) 5.6 240 days (20,736,000 s) 4.9 * 0.1 g of methyl-p-toulene sulfonate was added to 40 g of resin solution.

Claims (1)

1. A curable composition characterized by comprising (A) at least one of (1) at least one epoxy resin represented by the following formulas I, II, IV, V or VI: FORMULA I Q / Η °H H Q\ B-cLb -O-C—C-C-O-B*' -C-4-B Λ h Ah b/ FORMULA II FORMULA IV Q ? B-C-C-B I f Β B FORMULA V Η Q Q Η Ο Η Q Q II 111 If B-C-C-B-O-C-C-C-O-B-C-C-B II III l| Β Β Η R Η Β Β Η R Η eech Β is represented by the for: Ο Η / \ I B-C-C-C-0 I I I Η R Η Ο*').-, eech Ε’ is represented b π:: j Ε Ο O-C-C-C-H (R’ ) 5 each Β is represented by the formula
IE243385A 1984-10-05 1985-10-04 Curable compositions containing a polyepoxide and a halogenated dihydric phenol and impregnated substrates and laminates prepared therefrom IE58759B1 (en)

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IL76555A0 (en) 1986-02-28
NO862223D0 (en) 1986-06-04
IE852433L (en) 1986-04-05
DK239286A (en) 1986-05-22
US4604317A (en) 1986-08-05
BR8506964A (en) 1986-12-23
DK239286D0 (en) 1986-05-22
FI862046A0 (en) 1986-05-15
NO166042B (en) 1991-02-11
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EP0205455A1 (en) 1986-12-30
CA1242046A (en) 1988-09-13
NO862223L (en) 1986-06-04
EP0205455B1 (en) 1991-03-13

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