ID937B - BOTTLE SHAPED PACKAGING WITH A CLOSED COVER - Google Patents
BOTTLE SHAPED PACKAGING WITH A CLOSED COVERInfo
- Publication number
- ID937B ID937B IDP1491A ID910014A ID937B ID 937 B ID937 B ID 937B ID P1491 A IDP1491 A ID P1491A ID 910014 A ID910014 A ID 910014A ID 937 B ID937 B ID 937B
- Authority
- ID
- Indonesia
- Prior art keywords
- shaped packaging
- closed cover
- bottle shaped
- bottle
- packaging
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1026799A JPH02207532A (en) | 1989-02-07 | 1989-02-07 | Structure of solder bump and its forming method |
Publications (1)
Publication Number | Publication Date |
---|---|
ID937B true ID937B (en) | 1996-09-18 |
Family
ID=12203361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IDP1491A ID937B (en) | 1989-02-07 | 1991-08-05 | BOTTLE SHAPED PACKAGING WITH A CLOSED COVER |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH02207532A (en) |
ID (1) | ID937B (en) |
-
1989
- 1989-02-07 JP JP1026799A patent/JPH02207532A/en active Pending
-
1991
- 1991-08-05 ID IDP1491A patent/ID937B/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPH02207532A (en) | 1990-08-17 |
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