HUT55325A - Process for regenerating basic or acidic etching materials
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Process for regenerating basic or acidic etching materials
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Publication number
HUT55325A
HUT55325AHU567487AHU567487AHUT55325AHU T55325 AHUT55325 AHU T55325AHU 567487 AHU567487 AHU 567487AHU 567487 AHU567487 AHU 567487AHU T55325 AHUT55325 AHU T55325A
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Application filed by Kalman Tihanyi, Imre MolnarfiledCriticalKalman Tihanyi
Priority to HU567487ApriorityCriticalpatent/HU205041B/en
Publication of HUT55325ApublicationCriticalpatent/HUT55325A/en
Publication of HU205041BpublicationCriticalpatent/HU205041B/en
Regeneration of copper contaminated acid or alkaline etching agents: a) pH of acid etching agents is set to 3.5-4.5 and ammonium ions pref. ammonium-hydroxide is added; b) pH of alkaline etchants is set to 3.5-4.5 with chloride ions, pref. hydrochloric-acid. PPtd. copper salts are isolated in both cases, pref. by filtration. The pH of the etching agents is set to sepd. values and the etchants are recirculated e
HU567487A1987-12-151987-12-15Process for regenerating copper-containing etching agents of acidic or alkaline reaction
HU205041B
(en)
Process for the separation and purification of salts of diphenylphosphinephenyl-m-sulphonic acid, phenylphospine-di(m-phenylsulphonic acid) and/or triphenylphosphine-tri-(m-sulphonic acid)
Process for the recovery of acid organophosphorus compounds and/or organophosphate ions present in an aqueous solution and its use for the treatment of aqueous effluents