HUT53396A - Process for producing uniform, high adhezive and very fine copper layer on polyamide substrate
- Google Patents
Process for producing uniform, high adhezive and very fine copper layer on polyamide substrate
Info
Publication number
HUT53396A
HUT53396AHU43289AHU43289AHUT53396AHU T53396 AHUT53396 AHU T53396AHU 43289 AHU43289 AHU 43289AHU 43289 AHU43289 AHU 43289AHU T53396 AHUT53396 AHU T53396A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jozsef Loranth, Janos Pinter, Lajos NyirifiledCriticalJozsef Loranth
Priority to HU43289ApriorityCriticalpatent/HU203797B/en
Publication of HUT53396ApublicationCriticalpatent/HUT53396A/en
Publication of HU203797BpublicationCriticalpatent/HU203797B/en
Process for manufacturing contacts for electronics devices, manufacturing apparatus for carrying out the same process and continuous strip material for stamping used for the same process