HUT53396A - Process for producing uniform, high adhezive and very fine copper layer on polyamide substrate - Google Patents

Process for producing uniform, high adhezive and very fine copper layer on polyamide substrate

Info

Publication number
HUT53396A
HUT53396A HU43289A HU43289A HUT53396A HU T53396 A HUT53396 A HU T53396A HU 43289 A HU43289 A HU 43289A HU 43289 A HU43289 A HU 43289A HU T53396 A HUT53396 A HU T53396A
Authority
HU
Hungary
Prior art keywords
adhezive
copper layer
fine copper
producing uniform
polyamide substrate
Prior art date
Application number
HU43289A
Other languages
Hungarian (hu)
Other versions
HU203797B (en
Inventor
Jozsef Loranth
Janos Pinter
Lajos Nyiri
Original Assignee
Jozsef Loranth
Janos Pinter
Lajos Nyiri
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jozsef Loranth, Janos Pinter, Lajos Nyiri filed Critical Jozsef Loranth
Priority to HU43289A priority Critical patent/HU203797B/en
Publication of HUT53396A publication Critical patent/HUT53396A/en
Publication of HU203797B publication Critical patent/HU203797B/en

Links

Landscapes

  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

Coating comprises, copper sulphate, sodium phosphate, sodium borohydride and tenside (wetting agent) sodium sulphite and an amine type complex forming agent. - (Dwg.No.0/0)
HU43289A 1989-01-30 1989-01-30 Process for producing equal, high adhesive, copper layer of less than 0,1 diameter on polyamide substrate HU203797B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
HU43289A HU203797B (en) 1989-01-30 1989-01-30 Process for producing equal, high adhesive, copper layer of less than 0,1 diameter on polyamide substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
HU43289A HU203797B (en) 1989-01-30 1989-01-30 Process for producing equal, high adhesive, copper layer of less than 0,1 diameter on polyamide substrate

Publications (2)

Publication Number Publication Date
HUT53396A true HUT53396A (en) 1990-10-28
HU203797B HU203797B (en) 1991-09-30

Family

ID=10949579

Family Applications (1)

Application Number Title Priority Date Filing Date
HU43289A HU203797B (en) 1989-01-30 1989-01-30 Process for producing equal, high adhesive, copper layer of less than 0,1 diameter on polyamide substrate

Country Status (1)

Country Link
HU (1) HU203797B (en)

Also Published As

Publication number Publication date
HU203797B (en) 1991-09-30

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Legal Events

Date Code Title Description
HMM4 Cancellation of final prot. due to non-payment of fee