Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peter BunertfiledCriticalPeter Bunert
Priority to HU9903579ApriorityCriticalpatent/HUP9903579A3/en
Publication of HUP9903579A2publicationCriticalpatent/HUP9903579A2/en
Publication of HUP9903579A3publicationCriticalpatent/HUP9903579A3/en
The housing is made using injection moulding with a base element (10) and a cover element (20). The electronic circuit (2) is mounted between the inner surfaces of the base and cover elements. The electronic circuit is mounted in at least one recess (11,12) in the base element and/or cover element. The contours of the recess match the outer contours of the electronic circuit. The housing is covered with plastic to form the electronic card.
HU9903579A1997-04-021997-04-02Housing for an electronic circuit implementable in an electronic card, and a method of manufacturing such a card
HUP9903579A3
(en)