HU165278B - - Google Patents
Info
- Publication number
- HU165278B HU165278B HUWE474A HUWE000474A HU165278B HU 165278 B HU165278 B HU 165278B HU WE474 A HUWE474 A HU WE474A HU WE000474 A HUWE000474 A HU WE000474A HU 165278 B HU165278 B HU 165278B
- Authority
- HU
- Hungary
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Battery Electrode And Active Subsutance (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20230571A | 1971-11-26 | 1971-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
HU165278B true HU165278B (hu) | 1974-07-27 |
Family
ID=22749324
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HUWE474A HU165278B (hu) | 1971-11-26 | 1972-11-20 |
Country Status (11)
Country | Link |
---|---|
US (1) | US3793072A (hu) |
JP (1) | JPS4860026A (hu) |
AU (1) | AU4910572A (hu) |
BE (1) | BE791374A (hu) |
CA (1) | CA998577A (hu) |
ES (1) | ES409263A1 (hu) |
FR (1) | FR2161101B1 (hu) |
GB (1) | GB1413810A (hu) |
HU (1) | HU165278B (hu) |
IT (1) | IT975851B (hu) |
NL (1) | NL7215981A (hu) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3982054A (en) * | 1972-02-14 | 1976-09-21 | Rca Corporation | Method for electrolessly depositing metals using improved sensitizer composition |
US3964906A (en) * | 1973-12-12 | 1976-06-22 | Western Electric Company, Inc. | Method of forming a hydrophobic surface by exposing a colloidal sol to UV radiation |
US4136216A (en) * | 1975-08-26 | 1979-01-23 | Surface Technology, Inc. | Non-precious metal colloidal dispersions for electroless metal deposition |
US4087586A (en) * | 1975-12-29 | 1978-05-02 | Nathan Feldstein | Electroless metal deposition and article |
US4100037A (en) * | 1976-03-08 | 1978-07-11 | Western Electric Company, Inc. | Method of depositing a metal on a surface |
US4150171A (en) * | 1976-03-30 | 1979-04-17 | Surface Technology, Inc. | Electroless plating |
JPS5418875A (en) * | 1977-07-12 | 1979-02-13 | Nippon Denki Kagaku Co Ltd | Pretreatment for nonnelectrolytic copper plating on epoxyresin substrate |
US8110254B1 (en) | 2006-09-12 | 2012-02-07 | Sri International | Flexible circuit chemistry |
US7981508B1 (en) * | 2006-09-12 | 2011-07-19 | Sri International | Flexible circuits |
US7989029B1 (en) | 2007-06-21 | 2011-08-02 | Sri International | Reduced porosity copper deposition |
US8628818B1 (en) | 2007-06-21 | 2014-01-14 | Sri International | Conductive pattern formation |
JP5227570B2 (ja) * | 2007-11-13 | 2013-07-03 | セーレン株式会社 | 透明導電性部材の製造方法 |
US8895874B1 (en) | 2009-03-10 | 2014-11-25 | Averatek Corp. | Indium-less transparent metalized layers |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2611040A (en) * | 1947-06-23 | 1952-09-16 | Brunetti Cledo | Nonplanar printed circuits and structural unit |
US2943956A (en) * | 1952-12-18 | 1960-07-05 | Automated Circuits Inc | Printed electrical circuits and method of making the same |
US3562038A (en) * | 1968-05-15 | 1971-02-09 | Shipley Co | Metallizing a substrate in a selective pattern utilizing a noble metal colloid catalytic to the metal to be deposited |
US3657003A (en) * | 1970-02-02 | 1972-04-18 | Western Electric Co | Method of rendering a non-wettable surface wettable |
-
0
- BE BE791374D patent/BE791374A/xx unknown
-
1971
- 1971-11-26 US US00202305A patent/US3793072A/en not_active Expired - Lifetime
-
1972
- 1972-06-12 CA CA144,449A patent/CA998577A/en not_active Expired
- 1972-11-20 HU HUWE474A patent/HU165278B/hu unknown
- 1972-11-21 AU AU49105/72A patent/AU4910572A/en not_active Expired
- 1972-11-22 GB GB5392572A patent/GB1413810A/en not_active Expired
- 1972-11-24 IT IT70704/72A patent/IT975851B/it active
- 1972-11-24 NL NL7215981A patent/NL7215981A/xx unknown
- 1972-11-24 FR FR7241955A patent/FR2161101B1/fr not_active Expired
- 1972-11-25 ES ES409263A patent/ES409263A1/es not_active Expired
- 1972-11-27 JP JP47118119A patent/JPS4860026A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US3793072A (en) | 1974-02-19 |
JPS4860026A (hu) | 1973-08-23 |
CA998577A (en) | 1976-10-19 |
FR2161101A1 (hu) | 1973-07-06 |
DE2256960B2 (de) | 1976-07-15 |
FR2161101B1 (hu) | 1975-11-07 |
ES409263A1 (es) | 1975-10-01 |
GB1413810A (en) | 1975-11-12 |
BE791374A (fr) | 1973-03-01 |
DE2256960A1 (de) | 1973-05-30 |
NL7215981A (hu) | 1973-05-29 |
AU4910572A (en) | 1974-05-23 |
IT975851B (it) | 1974-08-10 |