HU0105494D0 - Metal mold for use in injection molding - Google Patents
Metal mold for use in injection moldingInfo
- Publication number
- HU0105494D0 HU0105494D0 HU0105494A HUP0105494A HU0105494D0 HU 0105494 D0 HU0105494 D0 HU 0105494D0 HU 0105494 A HU0105494 A HU 0105494A HU P0105494 A HUP0105494 A HU P0105494A HU 0105494 D0 HU0105494 D0 HU 0105494D0
- Authority
- HU
- Hungary
- Prior art keywords
- injection molding
- metal mold
- mold
- metal
- molding
- Prior art date
Links
- 238000001746 injection moulding Methods 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001058652 | 2001-03-02 | ||
JP2001074535A JP3490404B2 (en) | 2001-03-02 | 2001-03-15 | Injection mold and injection molding equipment |
Publications (4)
Publication Number | Publication Date |
---|---|
HU0105494D0 true HU0105494D0 (en) | 2002-02-28 |
HUP0105494A2 HUP0105494A2 (en) | 2002-09-28 |
HUP0105494A3 HUP0105494A3 (en) | 2004-08-30 |
HU223953B1 HU223953B1 (en) | 2005-03-29 |
Family
ID=26610539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HU0105494A HU223953B1 (en) | 2001-03-02 | 2001-12-28 | Metal mold and an injection molding machine |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3490404B2 (en) |
CN (1) | CN100361802C (en) |
HU (1) | HU223953B1 (en) |
MX (1) | MXPA02000807A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100551406B1 (en) * | 2004-03-15 | 2006-02-09 | 삼성에스디아이 주식회사 | Mold for secondary battery |
US20130221572A1 (en) * | 2012-02-24 | 2013-08-29 | The Procter & Gamble Company | High Thermal Conductivity Co-Injection Molding System |
CN104260297B (en) * | 2014-08-25 | 2017-05-24 | 健大电业制品(昆山)有限公司 | A cooling device for insert pins in a plastic mold used for processing multi-hole industrial connectors |
CN104308958B (en) * | 2014-09-29 | 2016-10-05 | 广东萨提亚新型建材科技有限公司 | A kind of ultra-wide stone-plastic plate material and preparation method thereof |
KR102654127B1 (en) * | 2023-04-21 | 2024-04-02 | 김병찬 | Aluminum Profile Injection Bonding Method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BR8907118A (en) * | 1988-10-13 | 1991-02-05 | Seiki Corp Co Ltd | INJECTION MOLDING PROCESS AND APPLIANCE |
AU6714390A (en) * | 1990-10-06 | 1992-04-28 | Seiko Corporation | Process and apparatus for injection molding with melt filtration |
US5772933A (en) * | 1994-10-12 | 1998-06-30 | Kotzab; Werner | Method for tempering an injection mold having at least one heated nozzle or hot runner |
JPH08268205A (en) * | 1995-03-31 | 1996-10-15 | Toyoda Gosei Co Ltd | Manufacture method of pad |
JPH0990540A (en) * | 1995-09-28 | 1997-04-04 | Fuji Photo Film Co Ltd | Silver halide photographic sensitive material |
EP1019234B1 (en) * | 1997-04-16 | 2007-08-01 | Husky Injection Molding Systems Ltd. | Partial crystallization method and apparatus of amorphous plastic articles |
JP3556875B2 (en) * | 1999-03-02 | 2004-08-25 | 京セラ株式会社 | Battery and manufacturing method thereof |
-
2001
- 2001-03-15 JP JP2001074535A patent/JP3490404B2/en not_active Expired - Lifetime
- 2001-12-28 HU HU0105494A patent/HU223953B1/en active IP Right Grant
- 2001-12-31 CN CNB011451645A patent/CN100361802C/en not_active Expired - Lifetime
-
2002
- 2002-01-23 MX MXPA02000807A patent/MXPA02000807A/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN100361802C (en) | 2008-01-16 |
MXPA02000807A (en) | 2004-07-20 |
CN1373035A (en) | 2002-10-09 |
JP3490404B2 (en) | 2004-01-26 |
JP2002326255A (en) | 2002-11-12 |
HUP0105494A2 (en) | 2002-09-28 |
HU223953B1 (en) | 2005-03-29 |
HUP0105494A3 (en) | 2004-08-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
HFG4 | Patent granted, date of granting |
Effective date: 20050217 |